HC80279_2007

Save this PDF as:

WORD PNG TXT JPG

Size: px

Start display at page:

Download "HC80279_2007"

惜为山翁
1 years ago
Views:

Transcription

1 Reliability Laboratory Page: 1 of 7 Date: August 31, 2007 TEMWELL CORPORATION 8F-1, NO. 51, SEC. 1, MIN SHENG E. RD., TAIPEI, TAIWAN The following merchandise was submitted and identified by the vendor as: Product Description: TEMWELL BRAND Helical Filter Style/Item No.: 7H/ No.1~ No.5 Manufacturer/Vendor: TEMWELL CORPORATION Quantity: Total 5 pieces Testing Period: Aug. 28, 2007 to Aug. 29, 2007 Note: (Client s declaration) The materials used for 7H series are similar. We have tested the submitted sample(s) as requested and the following results were obtained: Test Required: (According to client s test specification, please see following sheets in detail.) Solderability Test by Solder Bath/ Dip and Look Test (Leads, Wires, etc.) According to client s test specification, the test procedures are shown as below. Test Procedure Identification Test Action/ Item Test Sequence Preconditioning 1 Solder Bath / Dip and Look Test 2 Test Object: The test purpose is to verify that the solderability of component leads and terminations meets the requirements provided by client and that subsequent storage has had no adverse effect on the ability to solder components to an interconnecting substrate. Test Results: - PLEASE SEE ATTACHED SHEETS - Terence Hsieh Asst. Manager

2 Page: 2 of 7 Solderability Test by Solder Bath/ Dip and Look Test (Leads, Wires, etc.): Test Equipment: Name Brand Model Serial No. Steam Aging Device Self-made SGS-ETR ETR Solderability Tester Multicore MUST II PLUS 9652 Materials: Name Brand Designation Chemical Composition Solder Multicore Sn/40Pb Flux Sharemate SM/NA (Unactivated) 25 wt.% of Colophony in 75wt.% of 2-propanol Lab Environmental Conditions: Ambient temperature: 25±3 Relative humidity: 55±20%RH Test Method/ Specification: Test Method: Reference to IPC/EIA/JEDEC J-STD-002B Test Method A A. Preconditioning Test Method: IPC/EIA/JEDEC J-STD-002B Clause 3.4 Sample Condition: See below item marked, As-received condition prior to preconditioning Specimen shall be cleaned prior to preconditioning (Immersed in a neutral organic solvent at room temperature and dried in air) Aging Method Used: See below item marked, --Mini Coating Durability Category 1 No steam conditioning requirements --Typical Coating Durability (for nontin and nontin-lead finishes) Category 2 1 hour ±5 minutes steam conditioning --Typical Coating Durability (for tin and tin-lead finishes) Category 3 8 hours ±5 minutes steam conditioning

3 Page: 3 of 7 Test Method/ Specification-- Continued: Figure 1. Diagram of apparatus for accelerated steam aging process Table 1. Steam Temperature Requirement Altitude (m) Average Local Boiling Point ( ) Steam Temperature Limits ( ) 0~ ±3 305~ ±3 610~ ±3 914~ ±3 1219~ ±3 1524~ ±3 Source: IPC/EIA/JEDEC J-STD-002B

4 Page: 4 of 7 Test Method/ Specification-- Continued: B. Solder Bath/ Dip and Look Test (Leads, Wires, etc.) Test Method: IPC/EIA/JEDEC J-STD-002B Clause Type of Flux: Unactivated Solder Composition: 60Sn/40Pb Test Temperature: 235±5 Immersion Angle: See below item marked, Between 20 o and 45 o 90 o Immersion Speed: 25±6 mm/s Withdraw Speed: 25±6 mm/s Immersion Depth: Within 1.25 mm of the component body or to the seating plane (whichever is further from the component body) Dwell Time: 5 +0/-0.5 seconds * Leads should be immersed in the flux for 5 to 10 seconds before soldering. * Before examination, all leads shall have all visible flux residues removed by alcohol. Test Requirement: All leads shall exhibit a continuous solder coating free from defects for a minimum of 95% of the criteria area of any individual lead. Anomalies other than dewetting, nonwetting, and pin holes are not cause for rejection.

5 Page: 5 of 7 Specimen: Style/Item No.: Quantity: Specimen Type: 7H/ No.1~ No.5 Total 5 pieces See below items marked, Surface Mount Through-Hole Mount L-Lead Gull Wing Wires Test Result: Solder wetting area: Style/Item No. Solder wetting area Note 7H/ No.1 >95% See photo 7, 8 7H/ No.2 >95% Similar to photo 7, 8 7H/ No.3 >95% Similar to photo 7, 8 7H/ No.4 >95% Similar to photo 7, 8 7H/ No.5 >95% Similar to photo 7, 8

6 Page: 6 of 7 Test Photos: 1. Appearance of specimen-- (7H) 2. Testing area of specimen 3. Steam aging device 4. Steam aging for 8 hours 5. Solder Bath / Dip and Look Test 6. Solder Bath / Dip and Look Test

7 Page: 7 of 7 Test Photos--Continued: 7. Appearance of specimen after Solderability test 8. Appearance of specimen after Solderability test The End of Test Report

3.96mm间距直式条形连接器.doc

3.96mm间距直式条形连接器.doc NO.: 产品规格书 PRODUCT SPECIFICATION 顾客型号 Client : 型号 : 3.96mm Pitch 9 &18 Pressure 产品编码 Part Number: 见产品图纸规格书 : 制订 Edit 田野 212.4.28 审核 Check 王富 212.9.24 批准 Approval 朱春燕 212.9.24 浙