Part Number: UV -5050F-,Working Features Package Size:5.0 (L) 5.0(W) 1.5 (T) mm Silicone Packed Suitable for different working enviro

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1 承认书 SPECIFICATION FOR APPROVAL 客户名称 : Customer 客户型号 : Customer Part No. 工厂型号 : Manufacturer Part No. 5050UV 产品规格 : Specification 制订人 : Issued By 审核 : Approved By 客户回签 : Customer Confirmation 日期 :Date 日期 : 日期 : 确认结果 (Confirm result): 合格 Approve ( 请于认可栏中签名 Please sign in the confirmation column.) 不合格 Reject( 请填写原因 Please write down the reason for rejecting.) 原因 Reason: 版本 Version :

2 Part Number: UV -5050F-,Working Features Package Size:5.0 (L) 5.0(W) 1.5 (T) mm Silicone Packed Suitable for different working environment Super long lifetime:50000hrs Wide viewing angle (2θ =120 ) 产品特征 封装尺寸 : 5.0 ( 长 ) 5.0 ( 宽 ) 1.5 ( 厚 ) mm 采用硅胶封装 适应多种工作环境 超长寿命 :50000 小时 宽角度 (2θ =120 ) Device Selection Guide 物料选用指南 ITEM 项目 Resin 胶体 MATERIALS 物料 Silicone 硅胶 Bonding wire 焊线 Φ0.8mil Au Lens color 胶体颜色 Water Clear 水清透明 Dice 晶片 InGaN ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Most suitable for displayers Landscape lighting products Decorative lighting: light strip 产品应用 最适合用于显示屏 景观照明产品 装饰照明 : 柔性灯条

3 Package Outline Dimensions 封装外形尺寸 0 Recommended solder pad forta series 建议用于 TA 系列的焊盘 Note: The tolerances unless mentioned is ±0.01 mm. 除非另有说明, 以上尺寸的公差为 ±0.01 mm

4 Absolute Maximum Ratings 单颗极限参数 (Ta=25 ) Parameter 参数 Symbol 符号 Rating 额定值 Unit 单位 Reverse Voltage 反向电压 Forward Current 正向电流 Operating Temperature 工作温度 Storage Temperature 储存温度 Soldering Temperature 焊接温度 Power Dissipation 功耗 Peak Forward Current 峰值正向电流 (Duty 1KHz) V R 5 V I F 20*3 ma Topr -20 ~ +80 Tstg -20 ~ +80 Tsol 265(for 30seconds) Pd 110 mw I FP 100 ma Electro-Optical Characteristics 单颗光电特性 (Ta=25 ) Parameter 参数 Symbol Min. Typ. Max. Unit Condition 条件 Viewing Angle 角度 2θ1/ deg If=20mA Reverse Current 反向电流 IR μa VR=5V Dominant Wavelength( 主波长 ) λd nm If=20mA Forward Voltage(V) 正向电压 Luminous Intensity(mcd) 发光强度 Vf V If=20mA IV mcd If=20mA Notes: 1. Tolerance of Luminous Intensity is ±15%. 发光强度的公差为 ±15% Tolerance of Forward Voltage is ±0.1V. 正向电压的公差为 ±0.1V

5 Directive Characteristics 配光曲线特性 Reflow Temp/Time 回流焊温度曲线 Handing of an SMD LED Should be done only when the Package has been cooled down to below 40 or less. This is to Prevent SMD LED failures due to thermal-mechanical stress during handing. l Reflow soldering Temperature (top surface of the SMD LED )profile:

6 1.Use with all SMDsSolder=Sn63-Pb37 Average ramp-up rate= 4 /sec.max. Preheat temperature:100 ~150 Preheat time =120sec.max. Ramp-down rate = 6 /sec.max. Peak temperature = 230 max Time within 5 of actual peak temperature = 10 sec.max. Duration above 183 is 60 sec.max. 2.Solder = Lead-Free Average ramp-up rate = 4 /sec.max Preheat temperature:150~200 Preheat time =120 sec.max. Ramp-down rate = 6 /sec.max. Peak temperature = 250 max. Time within 5 of actual peak temperature =10 sec.max. Duration above 217 is 60 sec.max.

7 Test circuit 测试电路 Handling precautions 处理注意事项 1. Over-current-proof 过电流保护 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 客户必须采用电阻进行保护, 否则轻微电压漂移将导致电流发生巨大变化 ( 产品将被烧坏 ) 2. 清洗 2.1 When necessary, cleaning should occur only with isopropyl alcohol (IPA) at room temperature (25ºC) for a duration of no more than one minute. Dry at room temperature for 15 minutes before use. 产品如需清洗, 只能在室温 (25ºC) 下采用异丙醇 (IPA) 清洗, 清洗时间不超过 1 秒 使用前在室温 下放置 15 分钟晾干产品 2.2 The influence of ultrasonic cleaning on the SMD LED depends on factors such as ultrasonic power and the way the SMD LEDs are mounted. Ultrasonic cleaning should be pre-qualified to ensure this will not cause damage to the SMD LEDs. 超声波清洗对 SMD LED 的影响取决于超声波功率及 SMD LED 的贴装方式等因素 超声波清洗需经过 预审合格, 以确保此举不会对 SMD LED 造成损害 3. Storage 储存 3.1 It is recommended to store the products in the following conditions 推荐在下列环境下储存 : Humidity: 60% R.H. Max. 湿度 : 相对湿度 60% Temperature: 5 ~30 (41 ~86 ) 温度 : 5 ~30 (41 ~86 ) 3.2 Shelf life in sealed bag: 12 month at <5 ~30 and <30% R.H. after the package is opened, the products should be used within 24hrs or they should be kept stored at 20% R.H. with zip-lock sealed. 以密封袋储存保质期 : 12 个月,-5 ~30, 相对湿度 <30% 产品开封后应在 24 小时内使用, 或在相对湿 度 20% 环境下储存, 并以拉连锁密封

8 4. Baking 烘烤 It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions are as followings: 如包装敞开超过 24 小时, 我们建议焊线前对产品进行烘烤 烘烤条件如下 : ±3 x(15-25hrs) and <5%RH, taped reel type 卷带 ±3 x (1hr~2hrs), bulk type 散装 ±3 x (45min ~1hr), bulk type 散装

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