Features 特性 Small & compact package and with high efficiency 高效率 小尺寸 紧凑型封装 Typical luminous flux: mA 典型光通量 :90 500mA Typical color tem

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1 DATASHEET Received Mass Production Customer approved : Customer confirm : Page : 12 Revised record Rev. Description Release Date 1 New spec

2 Features 特性 Small & compact package and with high efficiency 高效率 小尺寸 紧凑型封装 Typical luminous flux: mA 典型光通量 :90 500mA Typical color temperature: 5700 K@500mA 典型色温 : 5700 K@500mA Optical efficiency@500ma : 50 lm/w : 50 lm/w ESD protection up to 8KV 高达 8KV 的 ESD 保护 Moisture Sensitivity Level (MSL) Class 1 湿气敏感性等级 : 一级 Grouping parameter: total luminous flux, color coordinates. 分组参数 : 总光通量, 色坐标 RoHS compliant & Pb free. 无铅, 符合 RoHS 标准 Applications 应用 Mobile Phone Camera Flash(Camera flash light /strobe light for mobile devices ) Torch light for DV(Digital Video) application 手机拍摄闪光灯 ( 相机闪光灯 / 移动设备的频闪灯 ),DV 拍摄灯光应用 Indoor lighting applications 室内照明应用 Signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) TFT backlighting 信号及标志方向性照明光源 ( 如楼梯, 出口等 ),TFT 背光 Exterior and interior illumination applications 室内及室外照明应用 Decorative and Entertainment Lighting 装饰和娱乐照明 Exterior and interior automotive illumination 室外和室内汽车照明 2

3 Device Selection Guide 器件选择指南 Chip Materials InGaN Emitted Color White Absolute Maximum Ratings (T solder pad =25 ) 绝对最大额定值 Parameter Symbol Rating Unit DC Forward Current (ma) I F 350 ma Peak Pulse Current (ma) I pulse 500 ma (400ms : ON,3600ms : OFF) ESD Resistance V B 8000 V Reverse Voltage V R [1] V Junction Temperature T J 125 Thermal Resistance(junction to lead) Rs 10 /W Operating Temperature T opr -40 ~ +85 Storage Temperature T stg -40 ~ +110 Power Dissipation (Pulse Mode) P d 1.6 W Soldering Temperature T sol 260 Allowable Reflow Cycles n/a 2 cycles Viewing Angle (2) 2θ 1/2 120 deg 1. The OR-F2016 series LEDs are not designed for reverse bias used. OR-F2016 LED 系列产品反向不能使用 2. View angle tolerance is ± 5. 角度偏差为 ± 5 3. Avoid operating OR-F2016 series LEDs at maximum operating temperature exceed 1 hour. 在允许最大温度下操作 OR-F2016 避免超过一个小时 4. All specification is assured by reliability test for 1000hr, IV degradation less than 30%. 保证所有的可靠性测试为 1000 小时, 加速性可靠性测试少于 30% 5. All reliability items are tested under good thermal management with Φ32 aluminum substrate. 所有测试项目都是在 Φ32 铝基板拥有良好的散热条件下 6. Peak pulse current shall be applied under conditions as max duration time 50ms and max duty cycle 10%. 脉冲峰值电流应该在最大持续时间 50ms, 最大占空比 10% 的条件下应用 7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. 持续性的在最大额定条件下使用 LED 可能导致永久性的伤害和参数数值下降 Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability issue. 不允许多次在最大额定参数下使用 当长期在最大额定参数下使用时可能导致可靠性问题 3

4 JEDEC Moisture Sensitivity 湿气敏感度 Level Floor Life Soak Requirements Standard Time (hours) Conditions Time (hours) Conditions 1 unlimited 30 / 85% RH 168(+5/0) 85 / 85 RH Electro-Optical Characteristics (T solder pad =25 ) 光电特性 Parameter Symbol Min. Typ. Max. Unit Condition Luminous Flux (1) Фv lm Forward Voltage (2) (3) V F V I F =500mA Correlated Color Temperature CCT K 1. Luminous flux measurement tolerance: ±10% 最大光通量测试误差 : ±10% 2. Forward voltage measurement tolerance: ±0.1V 正向电压测试误差 : ±0.1V 3. Electric and optical data is tested at 50 ms pulse condition 光电参数在 50ms 脉冲电流条件下测试 Bin Range of Forward Voltage Binning 正向电压分 Bin 的范围 Bin Code Min. Typ. Max. Unit Condition V I F =500mA Bin Range of Luminous Intensity 发光强度范围 Bin Code Min. Typ. Max. Unit Condition F F lm I F =500mA J

5 White Bin Structure 白光 Bin 结构 Notes: 1. Color Bin (1) : 4550K 2. Color Bin (2) : 5057K 3. Color Bin (3) : 5770K White Bin Coordinate 白光分 Bin 坐标 Bin CIE X CIE Y CCT Reference Range Bin CIE K ~ 5000K 5000K ~ 5700K 5700K ~ 7000K 1. Color coordinates measurement allowance: ±0.01 色坐标测试允许误差 : ± Color bins are defined at I F = 500mA and 50ms pulse operation condition. 光色分 bin 的条件为 50ms 下 I F = 500mA 脉冲电流 5

6 Typical Electro-Optical Characteristics Curves 典型的光电特性曲线 Relative Spectral Distribution, I F =500mA@50ms, T solder pad = θ 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2θ 1/2 是灯中线偏轴角, 光强为 1/2 的峰值 2. View angle tolerance is ± 5 角度公差为 ± 5 6

7 Forward Voltage vs Forward Current, T solder pad =25 Correlated Color Temperature(CCT) vs. Forward Current Luminous Flux vs Forward Current, T solder pad =25 Forward Current Derating Curve, Derating based on T j MAX =125 C at torch mode 1. All correlation data is tested under superior thermal management with Φ32 aluminum substrate 所有的相关数据都是在 Φ32 的铝基板拥有良好散热管理条件下测试的 7

8 Package Dimension 封装尺寸 Anode pad Cathode pad 1. Dimensions are in millimeters. 尺寸的单位为毫米. 2.Tolerances unless mentioned are ± 0.1mm. 除非说明的其他误差都是 ± 0.1mm. 8

9 Moisture Resistant Packing Materials 防潮包装材料 Label Explanation 标签说明 P/N: Orient Production Number LOT No: Lot Number QTY: Packing Quantity REF: Forward Voltage Bin CAT: Luminous Flux (Brightness) Bin CCT: Correlated Color Temperature HUE: Color Bin Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel 载带尺寸 : 装载数量每卷 2000 个 Progress Direction 1. Dimensions are in millimeters. 尺寸以毫米为单位 2.Tolerances unless mentioned are ± 0.1mm. 除非说明提及的尺寸误差为 ± 0.1mm. 9

10 Reel Dimensions 1. Dimensions are in millimeters. 尺寸以毫米为单位 Moisture Resistant Packing Process 防潮包装流程 10

11 Reflow Soldering Characteristics 回流焊特性 Soldering and Handling 焊接和处理 1.Over-current-proof 过流保护 Though OR-F2016 series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen. 虽然 OR-F2016 系列产品使用了 ESD 保护, 客户不能反向使用应该接电阻进行额外的保护 否则, 轻微的电压变化都可能导致巨大的电流变化引起烧毁 2.Storage 贮存 i.do not open the moisture-proof bag before the products are ready to use. 当产品还没准备使用时不要打开防潮袋 ii.before opening the package, the LEDs should be stored at temperature less than 30 and less and relative humidity less than 90%. After opening the package, the LEDs should be stored at temperature less than 30 and relative humidity less than 85%. 在开启包装袋之前,LED 产品应该贮存在温度不超过 30 和湿度低于 90% 的环境中, 包装袋开启后,LED 产品应该贮存在温度低于 30 和相关湿度低于 85% iii. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5 for 24 hours. 假如防潮物质 ( 硅凝胶 ) 已褪色或者 LED 超过贮存时间, 烘烤处理的条件为在 60±5 条件下预固化 24 小时 3.Thermal Management 热管理 i. For maintaining the high flux output and achieving reliability, OR-F2016 series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. 为保持高光通量和实现可靠性,OR-F2016 系列 LED 产品应该按照在金属基印刷电路板 (MCPCB) 上, 并进行适当的散热连接, 能在 正常情况下约 1W 至 5W 的热能消散 ii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically. 必须进行足够的散热管理, 否则在大电流驱动下结温将超过限定值,LEDs 的寿命将减短 iii. When operating, the solder pad temperature ( or the board temperature nearby the LED) must controlled under 70. 操作时, 焊盘的温度 ( 或附近的 LED 电路板温度 ) 必须控制在 70 下 4. Soldering Condition 焊接条件 4.1 Soldering Pad 焊盘 Anode pad Cathode pad 11

12 4.2 For Reflow Process 回流焊工艺 i. Lead reflow soldering temperature profile 铅回流焊温度示意图 i. Reflow soldering should not be done more than two times. 回流焊完成不宜超过两次 ii. While soldering, do not put stress on the LEDs during heating. 当回流焊时,LEDs 在加热过程中不要对它施加压力 iii. After soldering, do not warp the circuit board. 焊接后, 不要弯曲线路板 12

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