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1 承认书 Specification For Approval 户 称 Customer Name : 产品编 Product ID : 产品型 Product Model : 5WWW4-Y-T-SB 产品规格 Product Specifications : 5MM 圆头 边 送 日期 Date : 户确认 Customer acknowledges that 鹏 光电 Pengyuan Optoelectronics 准 确认业 工程制作 Approved Audit Confirm Business Engineering Make 户确认 Customer acknowledges that : 合格 Qualified 合格 Failure 户意见 Customer feedback :

2 产品型号 Product Model:5WWW4-Y-T-SB 尺寸 Dimensions: 单 Unit: 毫米 mm [ 英 ] [inch] 5.9[.232] 8.6 [.338] 1 [.039] 27[1.063]MIN CATHODE 1.5 [.059]TYP Φ5 [.197] 2.54[0.1] 1.0MAX õ0.5[0.02] 备注 Notes: 1. 所 尺 单 是 mm All dimension units are millimeters. 2. 所 未标注尺 公差 ±0.2mm All dimension tolerance is ±0.2mm unless otherwise noted. 3. 所 胶体 部 引脚处多胶部 大约 1.5mm An epoxy meniscus may extend about 1.5mm down the leads. 4. 胶体 部毛边小于等于 0.5mm Burr around bottom of epoxy may be 0.5mm max. LED Chip LED 芯片 胶体 色 材料 Material InGaN 发光 色 Emitting Color Warm white Lens Color waterclear

3 产品型号 Product Mode l:5www4-y-t-sb 最大绝 定值 ( 室温 = 25 )Absolute Maximum Ratings at (Ta = 25 ) 目 ITEMS 符 SYMBOL 最大绝 定值 ABSOLUTE MAXIMUM RATING 单 UNIT 向电流 Forward Current IF 50 ma 峰值 向电流 Peak Forward Current IFP 220 ma 连续工作电流 Continuous Forward Current IL 20 ma 反向电压 Reverse Voltage VR 5 V 耗 Power Dissipation PD 170 mw 工作温度 Operation Temperature Topr -40 ~ +80 贮存温度 Storage Temperature Tstg -40 ~ +80 引脚镀锡温度 Lead Soldering Temperature Tsol 最大温度 260, 最长时间 5 秒 Max.260 C for 5 sec Max. 要光电特性 ( 室温 = 25 )Typical Electrical & Optical Characteristics (Ta = 25 ) 目 符 测试条件 最小值 型值 最大值 单 ITEMS Symbol Test Condition Min. Typ. Max. Unit 发光强度 Luminous Intensity Iv IF=20mA mcd 向电压 Forward Voltage IF IF=20mA V 峰值波长 Peak Wavelength λp IF=20mA -- nm 波长 Dominant Wavelength λd IF=20mA nm 视角 Viewing Angle 2θ1/2 IF=20mA Deg 光通量 Luminous flux Iv IF=20mA LM 显色指数 标 Color Rendering Index Calculation Spm Spm X Y 色温 Color Temperature IF=20mA k

4 产品型号 Product Mode l:5www4-y-t-sb 可靠性试验 Reliability Performance 测试 类 Test Classification 寿命测试 Life Test 境测试 Environment Test 机械测试 Mechanical Test 测试 目 Test Item 寿命测试 Life Test 热冲 测试 Thermal Shock Test 冷热循 测试 Temperature Cycle Test 高温高湿测试 High Temperature & High Humidity Test 高温贮存测试 High Temperature Storage 温贮存测试 Low Temperature Storage 焊接热度 Resistance to Soldering Heat 引脚 弯 Lead Integrity 测试条件 Test Conditions 持续时间 Test Duration 抽 大小 Sample Size Ta=25 ±5,IF=20mA 1000 小时 (hrs) 10PCS -10 ± ±5 100 循 (cycles) 10PCS 5min. 10sec. 5min. -55 ±5 +85 ±5 100 循 (cycles) 10PCS 30min. 5min. 30min. Ta=85 ±5 240 小时 (hrs) 10PCS RH =85%±0.5 %RH Ta=100 ± 小时 (hrs) 10PCS Ta=-55 ± 小时 (hrs) 10PCS 10PCS Ta=260 ±5 5 秒 (sec.) 负荷 2.5 牛顿 (0.25 千克 ) 3 回合 (times) 10PCS 0 ~ 90 ~ 0 判定 Standard

5 尊敬的用户 : 迎使用 的产品, 在 们 您介绍一些关于 LED 保存及使用的常识, 以避免在储存时或使用过程中造 损失, 使用及保存时请注意以 事 : 存储 : A: 了防潮,LED 要存放在干燥通风的 境中, 储存 境温度在 5-30, 相 湿度在 60% 以 B:LED 在它的原包装条件 3 个 内使用完 佳, 以避免支架生锈, 当 LED 的包装袋开封, 要尽快使用完 清洁 : 要使用 明化学液体清洗 LED, 因 那 可能会损伤 LED 树脂表面, 甚 引起胶体裂缝, 如 必要, 请在常温 把 LED 侵入工业酒精中清洗, 时间在一 钟之内 管脚的 形 要在焊接期間或是在焊接後 形 如 必要的話 形一定在焊接前完 记任何挤压树脂的行 都 可能损伤的 LED 灯内部金线焊接 A: 在焊接过程中, 要 灯体施 任何外部压力, 否则 LED 内部会 裂纹, 会影响 内部金线连接而导 品质 B: 胶体一定 能 入焊锡之中 C: 焊接时, 焊接点离胶体 边 少 2MM 的间隙, 焊接完 需要用 钟的时间让 LED 从高温状态降回到 常温 D: 如用烙铁焊接 一的 PCB 线性排列的 LED, 要 时焊接 一 LED 的 个管脚 E: 烙铁焊接时要求用 30W 以 的铬铁 F:LED 的焊接方式 种规格产品, 体参数如..烙铁焊接温度 :295 C +5 C 间焊接时间 :3 秒以内 仅一 波峰焊焊接温度 :240 C +5 C 焊接时间 :5 秒以内 说明 : 焊接温度或焊接时间 制 当可以引起灯体 形或者灯芯内部开路导 死灯 建议使用方法 : A: 在使用过程中无论是单 使用 是多 使用, 每 LED 的 DC 驱动电流 荐使用 IF 的范围 Ma. 驱动电路 1. 串联方式

6 2. 并联方式 B. 瞬间的脉冲会破 LED 内部固定连接 所以电路必 仔细设计 在线路开启 合时 LED 会 到过压 ( 过流 ) 冲 C.LED 在多 使用时要求发光亮度及 色的一 性 因 于驱动方式及驱动条件要充 了解 常的条件 保证 20MA 光的 色和亮度的一 性 D. 要获得均匀的亮度和 色 批量的 LED 使用 的电流 使用时 可多包混用 以免造 亮度差异 LED 的 VF IF IV WL 以及温度之间的关系特性详见每款的参数表 ESD( 静电的防护 ) A: 静电可以引起 LED 能失效 建议防 ESD 损害 LED 1.LEDs 检测和组装时作业人员一定要带防静电手 及防静电的手套 2. 焊接设备和测试设备 工作桌子 贮存架 等等必 良好接地 3. 使用离子风机消除 LED 在贮存和组装期间由于磨擦而产生的静电 4. 装材料的料盒采用防静电料盒 包装袋采用防静电袋 B: 被 ESD 损伤的 LED 会 的异常 象 : 1. 反向漏电 轻者将会引起亮度降 重者灯 亮 2. 向 电压值 小 3. 电流驱动时 LED 能起动

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