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1 组装与封装设备 Assembly and packaging equipment 主要产品 Main product lines 探针 Probers 晶圆研磨 Wafer Grinders 划片机 Wafer Dicing Saws 芯片控制与卡式系统 Die Control and Cassetting Systems 焊片机 Die Bonders 引线键合机 Wire Bonders 晶圆邦定机 Wafer Bonders IC 预处理设备 IC Pretreatment Equipment 激光处理设备 Laser Processing Equipment

2 探针设备 Probing Equipment 亚微米级分析探针台 -EM-6070А 晶圆直径芯片尺寸最小接触尺寸显微器在平台上的固定方式 up to 200 mm (0.4х0.4) (20x20) mm 0.8 um 永磁体半自动探针仪 - EM-6520, EM 晶圆直径芯片尺寸接触精度 up to 200 mm 20х20 mm ±10 um

3 探针设备 Probing Equipment EM-6190А 探针仪晶圆直径接触精度驱动类型 up to 200 mm ±10 um LSM EM-6290 全自动探针仪晶圆直径接触精度驱动类型电脑监视系统, 包括 : 全自动管芯识别全自动晶圆定位 up to 200 mm ±10 um LSM

4 晶圆研磨设备 Wafer Grinding Equipment 化学晶圆研磨机 - EM-3047 晶圆直径耐酸排水系统耐酸通风系统 100, 150, 200 mm 高精度衬底研磨系统 EM-2070 可加工的晶圆直径, mm 100, 150, 200 (300 可选 ) 表面粗糙度, Ra, um ( 取决于所使用的工具 ) 精磨系统 EM-2080 晶圆直径 Wafer Diameter, mm 76, 100, 150 晶圆厚度 Wafer thickness (wafer packages), mm to 3 金刚石工具直径 Diamond tool body diameter, mm 175

Throughput 35 wafer/hour 去膜机 Protective film remover UU-1

5 晶圆研磨设备 Wafer Grinding Equipment 贴膜机 Protective Film Applicator UN-1 晶圆直径 Wafer diameter, mm 76, 100, 150 生产效率 Throughput 35 wafer/hour 去膜机 Protective film remover UU-1 晶圆直径 Wafer diameter, mm 76, 100, 150 生产效率 Throughput 35 wafer/hour

有限公司晶圆切割设备 Wafer Dicing Equpment 晶圆封装系统 System for Wafer Packaging

wafer/hour - 直径 200 至 300for diameter 200 and 300mm 40 wafer/hour 工作区加热温度

Placement on Adhesive Carrier EM-2058 晶圆直径 Wafer diameter 30 150 mm 晶圆厚度

6 有限公司晶圆切割设备 Wafer Dicing Equpment 晶圆封装系统 System for Wafer Packaging EM-2048А 生产效率 Throughput: - 直径 100 至 150for diameter 100 and 150mm 60 wafer/hour - 直径 200 至 300for diameter 200 and 300mm 40 wafer/hour 工作区加热温度 Working area heating temperature up to +80ºС 晶圆胶粘贴片系统 System for Wafer Placement on Adhesive Carrier EM-2058 晶圆直径 Wafer diameter mm 晶圆厚度 Wafer thickness, min/max 460/ 70 um 生产效率 Throughput, 不小于 no less than 20 wafer/hour

electrospindle on axis, mm : X 270 Y 320 Z 24 半自动划片机 Semiautomatic Dicing Saw EM-2085B 最大晶圆直径 Maximal

7 有限公司晶圆切割设备 Wafer Dicing Equpment 半自动基板分离系统 The Semiautomatic substrate s separation EM-2115 可加工半导体晶圆直径 Diameter of the processed semiconducting wafers, mm 76,100, 125, 150, 200 主轴最大行程 The maximum movement of electrospindle on axis, mm : X 270 Y 320 Z 24 半自动划片机 Semiautomatic Dicing Saw EM-2085B 最大晶圆直径 Maximal wafer diameter 200 mm 最大晶圆厚度 Maximal wafer thickness 3 mm 主轴转速 Spindle shaft rotation frequency to min-1

Spindle revolution range (14 000 40 000) rpm-1 晶圆清洗系统 Wafer Washing System EM-3027 晶圆直径

8 有限公司晶圆切割设备 Wafer Dicing Equpment 半自动划片机 Semiautomatic Wafer Dicing Saw EM-225М 晶圆直径 Wafer diameter, mm 76, 100, 150 Minimal discretion of the table turn drive 12 sec of angle 主轴转速范围 Spindle revolution range ( ) rpm-1 晶圆清洗系统 Wafer Washing System EM-3027 晶圆直径 Wafer diameter, max 清洗时间 Cleaning time 干燥时间 Drying time 200 mm from 10 to 150 s from 10 to 150 s

有限公司晶圆切割设备 Wafer Dicing Equpment 金刚石划片刀 Diamond Dicing Wheels DAR6 外径 Outer diameter, mm 56.0-0.2 ; 58.0-0.2 内径 Inner diameter (fitting), mm 19.

diameter, mm 56.0 内径 Inner diameter (fitting), mm 19.

9 有限公司晶圆切割设备 Wafer Dicing Equpment 金刚石划片刀 Diamond Dicing Wheels DAR6 外径 Outer diameter, mm ; 内径 Inner diameter (fitting), mm 切割对象 Material to be cut Silicon, GaAs, glassceramics, ceramics, polycor, quartz and other 金刚石划片刀 Diamond Dicing Wheels DAR9 外径 Outer diameter, mm 56.0 内径 Inner diameter (fitting), mm 切割对象 Material to be cut Silicon, GaAs and other semiconductors 金刚石划片刀 Diamond Dicing Wheels DAR10 外径 Outer diameter, mm 56.0 内径 Inner diameter (fitting), mm 切割对象 Material to be cut Silicium, GaAs and other semiconductor materials

10 芯片检查设备 Die Inspection and Cassetting Equipment 全自动 VLSI 贴放系统 Automatic VLSI Placement System EM-4138 晶圆直径 Wafer diameter up to 200 mm 生产效率 Throughput 6000 dice/hour 盒尺寸 Cassette size 2 2

8 0.8 to 20 20 mm glue 胶粘焊片机 Die Bonder EM-4105М 晶圆尺寸 Wafer diameter 生产效率

11 焊片机 Die Bonders VLSI 焊片机 Die Bonder VLSI EM-4585 晶圆直径 Wafer diameter 生产效率 Throughput 芯片尺寸 Die size 连接方法 Bonding method up to 300 mm 5000 dice/hour from to mm glue 胶粘焊片机 Die Bonder EM-4105М 晶圆尺寸 Wafer diameter 生产效率 Throughput 芯片尺寸 Dice size up to 150 mm up to 2500 dice/hour ( 取决于芯片尺寸 ) 0.36 х х 3.0 mm

焊片机 Die Bonders FC 焊片机 Die Bonder with Flip-chip Technology

of substrate, 150x150 mm 晶圆 wafer Ø 76, 100, 150 连续操作时间

die holding tools 8 焊片机 Die Bonder EM-4075A-1 最大芯片尺寸 Maximal

12 焊片机 Die Bonders FC 焊片机 Die Bonder with Flip-chip Technology EМ-4336 芯片尺寸范围 Die size range from 1х1 to 15х15 mm 基板尺寸 Size of substrate, 150x150 mm 晶圆 wafer Ø 76, 100, 150 连续操作时间 Continuous operation time 24 hour 焊片机 Die Bonder EM-4025АМ-3 芯片尺寸 Die size from to mm 生产效率 Throughput 2000 dice/h 载片工具数量 Number of die holding tools 8 焊片机 Die Bonder EM-4075A-1 最大芯片尺寸 Maximal die size 振幅 Tool vibration amplitude 振动频率 Tool vibration frequency mm from 0.1 to 0.25 mm from 2 to 10 Hz

13 引线键合机 Wire Bonders 引线键合机 Discrete Cases Wire Bonder EM-4450 引线直径 Wire diameter, mm 引线数量 Number of wires, max, pc. not limited 最大装载芯片数量 Max number of dice in one product for bonding, pcs. 200 全自动引线键合机 Automatic Wire Bonder EM-4020PM 引线直径 Diameter of the bonding wires, mm 最大装载引线数量 The maximum number of installed wires, pieces unlimited 触摸定位设备标配 Determination of touch As part of the welding system

Ultrasonic Wire Bonder EM-4340-А1 铝线直径 Aluminium wire diameter 100 500 um 超常规引线键合 Wire bonding

14 引线键合机 Wire Bonders 全自动引线键合机 Automatic Wire Bonder EM-4370 引线直径 Wire diameter from 0.02 to 0.05 mm 引线数量 Number of wires (max for one cycle) 1000 焊头旋转角度 Welding head turn angle 370º 超声引线键合机 Ultrasonic Wire Bonder EM-4340-А1 铝线直径 Aluminium wire diameter um 超常规引线键合 Wire bonding in excess 引线从键合方向增大到 900 度进行键合 Wire add bonding with the turn up to from the bonding direction

JSC «Planar-SO» Wire Bonders 通用引线键合机 Universal Wire Bonders EM-4320U 金线直径 Gold wire diameter, mm 0.017 0.075 铝线直径 Aluminum wire diameter, mm 0.02 0.

5 全自动引线键合机 Automatic Wire Bonders EM-4320 EM-4320-1 金线热超声球 - 楔键合 thermosonic ball-to-wedge wire bonding of gold wires; EM-4320-2 金线 / 铝线超 / 热超声楔 - 楔键合 ultrasonic/thermosonic

15 JSC «Planar-SO» Wire Bonders 通用引线键合机 Universal Wire Bonders EM-4320U 金线直径 Gold wire diameter, mm 铝线直径 Aluminum wire diameter, mm 烧球直径 Diameter of melted ball managed by wire diameter, Ø wire from 1.8 to 2.5 全自动引线键合机 Automatic Wire Bonders EM-4320 EM 金线热超声球 - 楔键合 thermosonic ball-to-wedge wire bonding of gold wires; EM 金线 / 铝线超 / 热超声楔 - 楔键合 ultrasonic/thermosonic wedge-to-wedge wire bonding of aluminium and gold wires EM 至 500um 铝线超声楔 - 楔键合 ultrasonic wedge-to-wedge wire bonding of thick aluminium wire with diameter from 100 to 500 mkm EM 金铜铂钯等引线楔 - 楔键合 bonding of wires of gold (copper, platinum, palladium, etc.) using the contact bonding wedge-to-wedge method

0 ( 晶圆直径 100, 150 mm) 封装系统 Encapsulation System UG PCB 尺寸 PCB dimensions 100x200 mm 最小化合物层厚度

16 晶圆邦定机 IC 预处理设备 Wafer Bonder, IC Pretreatment Equipment 晶圆键合机 Wafer bonder EM-4044 晶圆直径 Wafer diameter, mm 76, 100, 150 晶圆厚度 Wafer thickness, mm ( 晶圆直径 76mm); - from 0.3 to 1.0 ( 晶圆直径 100, 150 mm) 封装系统 Encapsulation System UG PCB 尺寸 PCB dimensions 100x200 mm 最小化合物层厚度 Minimal compound layer thickness 0.4 mm XY 轴复合精度 XY compound application accuracy, not more than ± 0.8 mm

激光处理设备 Laser Processing Equipment 激光处理设备 Laser Processing EM -250 К 激光类型 Laser type Nd:YAG

Equipment EM-290 晶圆厚度 Wafer thickness from 150 to 1000 um 最小孔径 Minimal diameter of the hole 0.

Case EM-247 自动流水线宽度调节 Diapason of automatic flow width regulation from10 to 75m 生产效率 Number of

17 激光处理设备 Laser Processing Equipment 激光处理设备 Laser Processing EM -250 К 激光类型 Laser type Nd:YAG with diode pumping 精度 Accuracy 5 um 线速度 Linear speed up to 400 mm /s 激光处理设备 Laser Processing Equipment EM-290 晶圆厚度 Wafer thickness from 150 to 1000 um 最小孔径 Minimal diameter of the hole 0.1 mm 裁剪尺寸 Shear size, max No more than 4 % 塑封件 LIC 激光打标系统 LIC Laser Marking System in Plastic Case EM-247 自动流水线宽度调节 Diapason of automatic flow width regulation from10 to 75m 生产效率 Number of marked LIC (plastic, 0.8mm font, 10 characters), excluding load-unload time no more than 7000 pcs/hour

我國IC封裝設備技術現況及展 [唯讀]

我國IC封裝設備技術現況及展 [唯讀] IC : ( ) TEL03-5639999 ext 102 E-Mail: jclin@mail.kingbond.com.tw http://www.kingbond.com.tw IC IC Standard Assembly Process Taping Grinding Detaping Wafer Mount Curing Die Saw Die Bond Cure Wire Bond