References AEC-Q101 JESD22-A113,Pre-conditioning JESD22-A108,High Temperature Reverse Bias JESD22-A101, High Humidity High Temp. Reverse Bias JESD22-A104,Temperature Cycling JESD22-A102, Autoclave MIL-STD-750 Method 1037, Intermittent Operational Life MIL-STD-750 Method 1037, Operating Lift Test JESD22-B-106, Resistance to Solder Heat J-STD-002, Solder-ability MIL-STD-202F METHOD-103B,High-temperature High-humidity storage test JESD22-A103, High Temperature Storage MIL-STD-750 Method 4066,Forward Surge MIL-STD-750 Method 2036, Bending Strength MIL-STD-750 Method 2036, Terminal Strength AEC-Q101-001/ 002, ESD Characterization
The equipment list NO. Test Item Abrv Reference Test Condition Sample Siz e Failure Noted 1 Pre-conditioning PC JESD22A-113 Performed on surface mount devices (SMD s) prior to TC,AC, H3TRB & IOL/PTC stres ses only. 308 0 2 High Temperature Re verse Bias HTRB JESD22A-108 TJ:150 C, 80%VR,1000H 77 0 3 High Humidity High T emp. Reverse Bias H3TR B JESD22A-101 85 C, 85%RH, 80%VR,1000H 77 0 4 Temperature Cycling TC JESD22A-104 150 (+15,-0)/25min, -55 (+0,-10)/25min, 1000 cycles; 77 0 5 Autoclave AC JESD22A-102 121 ±5,100%RH,15 psig,96h 77 0 6 Intermittent Operation al Life IOL MIL-STD-750-1 037 Ta=25 C,2on 2off, TJ 100 C;15000 cy cles; 22 0 7 Operating Lift Test OP/L MIL-STD-750-1 037 25 ±5, 100% IO,1000H 22 0 8 Resistance to Solder Heat RSH JESD22B-106 Axial:270±5,7sec(+2, -0) SMD: 260 (+5,-0),10sec 30 0
Procedures and criteria NO. Test Item Abrv Reference Test Condition Sample Siz e Failure Noted 9 Solder-ability SD J-STD-002 235 ±5,3sec S 95% 10 0 10 11 12 High-temperature Hig h-humidity storage tes HTHH MIL-STD-202F METHOD-103B t High Temperature Sto rage Low Temperature stor age 85±2,85±5%,1000H 77 0 HTS JESD22-A103 150 (+10,-0),1000H 77 0 LTS 规格书 -55,1000H 22 0 13 Forward Surge FS MIL-STD-750 Method 4066 8.3ms,single,half-wave 22 0 14 Bending Strength BS MIL-STD-750 Method 2036 φ0.6mm/0.78mm W=0.5Kg; φ1.27mm W=2Kg; 90±5,3times 22 0 Applied to axial Diode 15 Terminal Strength TS MIL-STD-750 Method 2036 φ0.6mm/φ0.78mm W=1Kg; φ1.27mm W=3Kg; 15sec 22 0 Applied to axial Diode 16 Electrostatic Discharg ESD e AEC-Q101-001/ 002 HBM:100pF,1500Ω,2KV MM:200pF,0Ω,200V 22 0
Pre-conditioning Bake Moisture Soak Reflow ESD22A-113; Test Condition:@Bake:125 C/24H Moisture Soak:85 C/85%RH/168H Reflow 3 times: TP=260 C Test purposes: 模拟 SMD 产品在安装回流焊过程中的耐热能力.
High Temperature Reverse Bias TEST HTRB-80B16C; Product company: GAO YU; JESD22A-108; Test Condition: TJ:150 C/80%VR 1000H; 5 Sets Test purposes: 加速老化测试元器件, 去模拟产品在使用状况下反向使用寿命.
High Humidity High Temp. Reverse Bias HTRB-EL-04KA; Product company: GAO YU; Test Condition: JESD22A-101; 85 /85%RH/80%VR 1000H; Test purposes: 加速老化测试元器件, 去模拟产品在高温高湿状况下反向使用寿命.
Temperature Cycling CZ-H-80B; Product company: ZHONG ZHI; Test Condition: JESD22A-104; -55 ~+150 /25mims 1000 cycles; Test purposes: 测试元器件满足高低温环境所带来的抗应力的冲击能力.
Autoclave Test EHL-321; Product company: JU FU; Test Condition: JESD22A-102; 121, 100%R.H,15psig, 96H Test purposes: 测试塑封型元器件在高压力下的抗湿性能力.
Intermittent Operational Life. ELEC-V01; Product company: HANG KE; Test Condition: MIL-STD-750-1037; 25,2on2off,ΔTJ 100, 15000cycles ; Test purposes: 通过元器件重复的开与关以加速老化芯片与安装表面之间所有焊接和界面的应力.
Operating Life Test ELEC-V01; Product company: HANG KE; Test Condition: MIL-STD-750-1037; 25 ±5, 100% IO,1000H; Test purposes: 在常温下模拟正常工作状态下的条件, 测试长期使用下引起的电性参数退化及寿命能力.
Resistance to Solder Heat TEST CM141; Product company: CMEI; JESD22B-106; Test Condition: Axial:270±5,7sec(+2, -0) SMD: 260 (+5,-0),10sec; Test purposes: 评估元器件满足耐焊锡热的能力.
Solder-ability CM141; Product company: CMEI; J-STD-002; Test Condition: 235 ±5,3sec ; Test purposes: 检验元器件引脚或其它形式的端子在使用时, 是否满足焊接浸润性的标准.
High-temperature High-humidity storage test HTRB-EL-04KA; Product company: GAO YU; Test Condition: MIL-STD-202F METHOD-103B; 85 C/85%RH,1000H; Test purposes: 测试产品的封装在高温高湿环境下对水汽的抵抗能力.
High Temperature Storage 1014-2S; Product company: DONG QI; JESD22-A103; Test Condition: 150 (+10,-0),1000H; 2 Sets Test purposes: 测试元器件在无电气的负荷施加下, 高温和时间对材料的影响.
Low Temperature storage : CZ-H-80B; Product company: ZHONG ZHI; Test Condition: KE HU; -55,1000H; Test purposes: 测试元器件在无电气的负荷施加下, 低温和时间对材料的影响.
Forward Surge : PIF8000; Product company: GUAN KUI; MIL-STD-750 Method 4066; Test Condition: 8.3ms,single,half-wave; Test purposes: 检测元器件能够承受瞬间正向脉冲电流冲击的能力.
Bending Strength YJ-SB-011; Product company: YANG JIE; MIL-STD-750Method 2036; Test Condition: φ0.6mm/φ0.78mm W=0.5KG φ1.27mm W=2Kg; 90±5,3times Test purposes: 检测插件产品引线的弯曲能力.
Terminal Strength YJ-SB-011; Product company: YANG JIE; MIL-STD-750Method 2036; Test Condition: φ0.6mm/φ0.78mm W=1KG φ1.27mm W=3Kg; 15sec Test purposes: 检测插件产品引线的终端牢度.
Electrostatic Discharge Testing-Human Body Model/Machine Model SKS-0230; Product company: SHANGHAI SANJI; AEC-Q101-001/002; Test Condition: HBM:C=100PF R=1500Ω,2KV MM: C=200PF R=0Ω,200V Test purposes: 模拟操作人员或物体在接触元器件时产生的放电及人或物体相对对邻近物体之放电, 以检测被测试元器件抵抗静电放电之干扰能力.