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产品目录 Product List (UL File No.: E21399) 产品类别 Classification 产品名称 Product 特性简述 Feature 固化体系 Curing 填充料 Filler Tg (DSC, ) TD (TGA, ) NY114 符合 RoHS, 普通 Tg FR4 RoHS Compatible, Normal Tg FR4 DICY No 14 31 传统 FR4 NY115 符合 RoHS, 中 Tg FR4 RoHS Compatible, MidTg FR4 DICY No 155 33 Conventional FR4 NY117 符合 RoHS, 高 Tg FR4 RoHS Compatible, HiTg FR4 DICY Yes 175 325 符合 RoHS, 普通 Tg FR4, CTI>6V NY16 RoHS Compatible, Normal Tg FR4, DICY Yes 14 31 CTI>6V 高耐热性, 低 CTE, 中 Tg FR4 无铅制程因应产品 Lead Free Compatible FR4 NY215 NY217 Excellent Thermal Resistance, Low CTE, MidTg FR4 高耐热性, 低 CTE, 高 Tg FR4 Excellent Thermal Resistance, PN Yes 155 345 PN Yes 175 35 Very Low CTE, HiTg FR4 高耐热性, 低 CTE, 普通 Tg FR4, 无卤素 NY314 Excellent Thermal Resistance, DICY Yes 145 37 无卤素 & 无铅制程 Low CTE, Normal Tg FR4, Halogen free 因应产品高耐热性, 低 CTE, 中 Tg FR4, 无卤素 Halogen free & NY315 Excellent Thermal Resistance, PN Yes 155 375 Lead free Low CTE, MidTg FR4, Halogen free Compatible FR4 高耐热性, 低 CTE, 高 Tg FR4, 无卤素 NY317 Excellent Thermal Resistance, PN Yes 175 375 Very Low CTE, HiTg FR4, Halogen free 高频 & 无铅制程因应产品 High Frequency & Lead free Compatible FR4 NY615 NY62 高耐热性, 低 CTE, 中 Tg FR4, 低介电常数 Excellent Thermal Resistance, Low CTE, MidTg FR4, Low Dk & Low Df 高耐热性, 低 CTE, 高 Tg FR4, 低介电常数 Excellent Thermal Resistance, Low CTE, HiTg FR4, Low Dk & Low Df Yes 155 345 Yes 275 备注 Remark: 1. 以上所有产品均符合 RoHS 指令及 SONY SS259 标准要求 ; All the products listed above are compatible with RoHS directive and SONY SS259 standard. 2. 以上所有产品都可生产可激光钻孔半固化片和耐阳离子迁移产品 ; All the products listed above are available for Laser Drillable Prepreg and AntiCAF products. 3. 以上产品特性数据为测试, 仅供参考 All the data listed are typical values for your reference only. 1 of 4

产品编号 :NY114 Normal Tg, DICY Curing, UV Block/AOI Compatible 特点 FEATURES Tg 14 FR4 板材 Tg 14 FR4 优秀的剥离强度 Excellent Peel Strength UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 仪器仪表类 Instrumentations 通讯设备类 Communications, and etc. NY114 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY114 半固化片 NY114 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <.75 <.75 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) Days 18/9 18/9 AABUS 7. 燃烧性 Flammability ( 压合后 as laminated) rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 2 of 4

NY114 基板表 Sheet for Laminate NY114 覆铜箔板 NY114 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.79 (4.5) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1 6 1.5 (6.) 1.4 (8.) 1.93 (11.) 2.1 (12.) 1.9 (1oz) 2.4.8 2.4.8.2 2.4.8.3 4.9 1 8 4.7 1 6 2.5.17.1 5.8 1 7 5.5 1 6 2.5.17.1.8.4 2.6.2.1 4 42 2.5.6 <5.4 <5.4 4.6 <.35 <.35.16 415 345 6 5 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 12 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 135 14 31 65 31 4.5 13 2 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 NY114 产品使用指引 Process guideline 3 of 4

1. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 2. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 3. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 17 摄氏度以上保持 45 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 45 minutes at 17 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 time, min 4. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能适合此款材料, 如有需要可咨询药水供应商并作适当调整 The typical parameters used to desmear Normal FR4 may produce optimum hole topography for NY114. If you need, you can consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能适合此款材料, 如有需要可咨询设备供应商并作适当调整, 如冲床模具类型等 The typical punching parameters may produce optimum hole topography for NY114. If you need, you can consult with your equipment supplier to optimize your punching condition. 以上指引, 仅供参考 The above process guideline is for general reference only. 4 of 4

产品编号 :NY115 Middle Tg, DICY Curing, UV Block/AOI Compatible 特点 FEATURES Tg 15 FR4 板材 Tg 15 FR4 优秀的剥离强度 Excellent Peel Strength UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 仪器仪表类 Instrumentations 通讯设备类 Communications, and etc. NY115 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY115 半固化片 NY115 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) Days 18/9 18/9 AABUS 7. 燃烧性 Flammability ( 压合后 as laminated) rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 5 of 4

NY115 基板表 Sheet for Laminate NY115 覆铜箔板 NY115 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.8 (1oz) 2.4.8 2.4.8.2 2.4.8.3 4.7 1 8 4.5 1 6 2.5.17.1 5.4 1 7 5.2 1 6 2.5.17.1.8.3 2.6.2.1 4 42 2.5.6 <5.4 <5.4 4.6 <.35 <.35.16 415 345 6 5 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 12 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 15 155 33 58 3 4.2 43 5 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 6 of 4

NY115 产品使用指引 Process guideline 5. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 6. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 7. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 18 摄氏度以上保持 4 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 4 minutes at 18 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 time, min 8. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY115, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床力量模具类型等 The typical punching parameters may not produce optimum hole topography for NY115, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 7 of 4

产品编号 :NY117 High Tg, DICY Curing, UV Block/AOI Compatible 特点 FEATURES Tg 17 FR4 板材 Tg 17 FR4 优秀的剥离强度 Excellent Peel Strength UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 仪器仪表类 Instrumentations 通讯设备类 Communications, and etc. NY117 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY117 半固化片 NY117 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) Days 18/9 18/9 AABUS 7. 燃烧性 Flammability ( 压合后 as laminated) rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 8 of 4

NY117 基板表 Sheet for Laminate NY117 覆铜箔板 NY117 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.8 (1oz) 2.4.8 2.4.8.2 2.4.8.3 5. 1 8 5.1 1 6 2.5.17.1 5.4 1 7 5. 1 6 2.5.17.1.8.25 2.6.2.1 4 53 2.5.6 <5.4 <5.4 4.6 <.35 <.35.16 415 345 596 52 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 114 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 17 175 32 56 295 4. 19 3 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 9 of 4

NY117 产品使用指引 Process guideline 9. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 1. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 11. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 4 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 4 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 time, min 12. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 17 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 17 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY117, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY117, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 1 of 4

产品编号 :NY16 CTI>6V (Grade ), Normal Tg, UV Block/AOI Compatible 特点优秀的耐漏电起痕性 CTI>6V (IEC6112 方法 ) FEATURES Excellent Tracking Resistance CTI>6V (IEC6112Method) Tg 14 FR4 板材 Tg 14 FR4 优秀的剥离强度 Excellent Peel Strength UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 仪器仪表类 Instrumentations 通讯设备类 Communications, and etc. 优秀的耐漏电起痕性 Excellent Tracking Resistance CTI>6V CTI Test NH4CL Solution, drop 12 1 8 6 4 2 Std. FR4 NY16 12 1 8 6 4 2 175 2 225 25 3 35 4 45 5 55 6 Voltage (V) NY16 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 11 of 4

NY16 基板表 Sheet for Laminate NY16 覆铜箔板 NY16 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.6 (1oz) 2.4.8 2.4.8.2 2.4.8.3 4.9 1 8 4.7 1 6 2.5.17.1 5.8 1 7 5.5 1 6 2.5.17.1.8.4 2.6.2.1 4 42 2.5.6 <5.4 <5.4 4.6 <.35 <.35.16 415 345 6 5 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 12 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 135 14 31 65 31 4.5 13 2 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 12 of 4

产品编号 :NY215 Middle Tg, PN Curing and Contains Fillers, Low ZCTE, CAF Resistance 特点 FEATURES Tg 15 无铅兼容 FR4 板材 Tg 15 Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 低 ZCTE 值 Low Zaxis CTE 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 电源仪器仪表类 Power supplies, Instrumentations 通讯设备类 Communications 汽车电子类 Automotives, and etc. 优秀的耐热稳定性 Excellent Thermal Resistance 1 8 6 4 2 2 4 Resistance change() NY215 Std. Fr4 2 4 6 8 1 12 14 16 18 2 Thermal cycles Test condition: (IPCTM65 2.6.7.2) 55 15min. <=> 125 15mins, transfer time 2min. Test samples: PCB 6 layers, thickness 2.mm hole diameter:.4mm pitch:.9mm 优秀的耐 CAF 稳定性 Excellent AntiCAF Performance Insulation Resistance (ohm) 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E+7 1.E+6 1 11 21 31 41 51 61 71 81 91 11 TEST ITEM THTH (.7mm) PAPA (.1/.1mm) THPA (.3mm) CONDITIONS RESULTS >1 hr SONY 6 Layer TV >1 hr 85 /85RH 5V DC bias >1 hr Time (Hours) LALA >1 hr 13 of 4

NY215 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY215 半固化片 NY215 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 14 of 4

NY215 基板表 Sheet for Laminate NY215 覆铜箔板 NY215 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.8 (1oz) 2.4.8 2.4.8.2 2.4.8.3 6.5 1 8 5.6 1 6 2.5.17.1 3.6 1 7 2.8 1 6 2.5.17.1.5.12 2.6.2.1 4 42 2.5.6 <5.4 <5.4 4.8 <.35 <.35.15 415 345 515 45 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 15 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 15 155 325 345 6 3 3.5 3 5 AABUS 5 235 3. >6 18 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 15 of 4

NY215 产品使用指引 Process guideline 13. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 14. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 15. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 4 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 4 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 time, min 16. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY215, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY215, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 16 of 4

产品编号 :NY217 High Tg, PN Curing and Contains Fillers, Very Low ZCTE, CAF Resistance 特点 FEATURES Tg 17 无铅兼容 FR4 板材 Tg 17 Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 非常低 ZCTE 值 Very Low Zaxis CTE 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 较低的吸水率 Lower Water Absorption 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 电源仪器仪表类 Power supplies, Instrumentations 通讯设备类 Communications 汽车电子类 Automotives 军工产品类 Militaries, and etc. 优秀的耐热稳定性 Excellent Thermal Resistance Resistance change() 1 8 6 4 2 2 4 Std. Fr4 NY217 2 4 6 8 1 12 14 16 18 2 Thermal cycles Test condition: (IPCTM65 2.6.7.2) 55 15min. <=> 125 15mins, transfer time 2min. Test samples: PCB 6 layers, thickness 2.mm hole diameter:.4mm pitch:.9mm 优秀的耐 CAF 稳定性 Excellent AntiCAF Performance Insulation Resistance (ohm) 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E+7 1.E+6 1 11 21 31 41 51 61 71 81 91 11 TEST ITEM THTH (.7mm) PAPA (.1/.1mm) THPA (.3mm) CONDITIONS RESULTS >1 hr SONY 6 Layer TV >1 hr 85 /85RH 5V DC bias >1 hr Time (Hours) LALA >1 hr 17 of 4

NY217 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY217 半固化片 NY217 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 18 of 4

NY217 基板表 Sheet for Laminate NY217 覆铜箔板 NY217 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.6 (1oz) 2.4.8 2.4.8.2 2.4.8.3 2.8 1 8 1. 1 7 2.5.17.1 2.5 1 7 3.5 1 6 2.5.17.1.5.1 2.6.2.1 4 58 2.5.6 <5.4 <5.4 4.8 <.35 <.35.15 415 345 58 46 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 124 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 17 175 34 35 6 3 3. 3 15 AABUS 45 24 2.8 >6 >2 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 19 of 4

NY217 产品使用指引 Process guideline 17. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 18. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 19. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 6 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 6 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 166 181 time, min 2. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 17 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 17 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY217, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY217, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 2 of 4

产品编号 :NY314 Normal Tg, Halogenfree, Contains Fillers, CAF Resistance, UL94 V 特点 FEATURES Tg 14 无卤素无铅兼容 FR4 板材 Tg 14 Halogenfree and Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 优秀的 PCB 制程加工性 Excellent PCB Processibility 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 优秀的阻燃性符合 UL94 V 要求 Excellent Flammability Resistance 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 电源仪器仪表类 Power supplies, Instrumentations 通讯设备类 Communications 汽车电子类 Automotives, and etc. 优秀的 PCB 制程加工性 Excellent PCB Processibility 检测韧性之落击试验 Toughness Impact tester : Determine the height to generate interlaminar delamination. The higher is the tougher, and the laminate is better for processibility. Dicy cured Normal FR4: Ranking = 5 (excellent) NY314 (Halogen Free): Ranking = 4~5 (excellent) 优秀的耐 CAF 稳定性 Excellent AntiCAF Performance Insulation Resistance ( ohm) 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E+7 1.E+6 1 11 21 31 41 51 61 71 81 91 11 Time (Hours) TEST ITEM THTH (.7mm) PAPA (.1/.1mm) THPA (.3mm) LALA CONDITIONS RESULTS >1 hr SONY >1 hr 6 Layer TV 85 /85RH >1 hr 5V DC bias >1 hr 21 of 4

NY314 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY314 半固化片 NY314 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 22 of 4

NY314 基板表 Sheet for Laminate NY314 覆铜箔板 NY314 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.6 (1oz) 2.4.8 2.4.8.2 2.4.8.3 4.5 1 8 4.6 1 6 2.5.17.1 5.6 1 7 2.8 1 6 2.5.17.1.8.2 2.6.2.1 4 48 2.5.6 <5.4 <5.4 4.6 <.35 <.35.12 415 345 51 4 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 15 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 13 145 37 6 3 4. 3 5 AABUS 5 26 3.5 >6 >6 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 23 of 4

NY314 产品使用指引 Process guideline 21. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 22. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 23. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 4 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 4 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 time, min 24. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY314, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY314, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 24 of 4

产品编号 :NY315 Middle Tg, Halogenfree, PN Curing and Contains Fillers, CAF Resistance, UL94 V 特点 FEATURES Tg 15 无卤素无铅兼容 FR4 板材 Tg 15 Halogenfree and Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 低 ZCTE 值 Low Zaxis CTE 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 优秀的阻燃性符合 UL94 V 要求 Excellent Flammability Resistance 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 电源仪器仪表类 Power supplies, Instrumentations 通讯设备类 Communications 汽车电子类 Automotives, and etc. 优秀的耐热稳定性 Excellent Thermal Resistance Resistance change() 1 8 6 4 2 2 4 NY315 Std. Fr4 2 4 6 8 1 12 14 16 18 2 Thermal cycles Test condition: (IPCTM65 2.6.7.2) 55 15min. <=> 125 15mins, transfer time 2min. Test samples: PCB 6 layers, thickness 2.mm hole diameter:.4mm pitch:.9mm 优秀的耐 CAF 稳定性 Excellent AntiCAF Performance Insulation Resistance ( ohm) 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E+7 1.E+6 1 11 21 31 41 51 61 71 81 91 11 Time (Hours) TEST ITEM THTH (.7mm) PAPA (.1/.1mm) THPA (.3mm) LALA CONDITIONS RESULTS >1 hr SONY >1 hr 6 Layer TV 85 /85RH >1 hr 5V DC bias >1 hr 25 of 4

NY315 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY315 半固化片 NY315 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 26 of 4

NY315 基板表 Sheet for Laminate NY315 覆铜箔板 NY315 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.5 (1oz) 2.4.8 2.4.8.2 2.4.8.3 1.5 1 8 4. 1 6 2.5.17.1 2. 1 7 4.5 1 6 2.5.17.1.8.15 2.6.2.1 4 58 2.5.6 <5.4 <5.4 4.8 <.35 <.35.1 415 345 48 44 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 98 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 15 155 325 375 6 3 3.5 3 5 AABUS 4 245 3. >6 >6 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 27 of 4

NY315 产品使用指引 Process guideline 25. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 26. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 27. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 4 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 4 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 time, min 28. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY315, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY315, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 28 of 4

产品编号 :NY317 High Tg, Halogenfree, PN Curing and Contains Fillers, CAF Resistance, UL94 V 特点 FEATURES Tg 17 无卤素无铅兼容 FR4 板材 Tg 17 Halogenfree and Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 低 ZCTE 值 Low Zaxis CTE 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 优秀的阻燃性符合 UL94 V 要求 Excellent Flammability Resistance 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 消费电子类 Consumer Electronics 电源仪器仪表类 Power supplies, Instrumentations 通讯设备类 Communications 汽车电子类 Automotives 军工产品类 Militaries, and etc. 优秀的耐热稳定性 Excellent Thermal Resistance Resistance change() 1 8 6 4 2 2 4 Std. Fr4 NY317 2 4 6 8 1 12 14 16 18 2 Thermal cycles Test condition: (IPCTM65 2.6.7.2) 55 15min. <=> 125 15mins, transfer time 2min. Test samples: PCB 6 layers, thickness 2.mm hole diameter:.4mm pitch:.9mm 优秀的耐 CAF 稳定性 Excellent AntiCAF Performance Insulation Resistance ( ohm) 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E+7 1.E+6 1 11 21 31 41 51 61 71 81 91 11 Time (Hours) TEST ITEM THTH (.7mm) PAPA (.1/.1mm) THPA (.3mm) LALA CONDITIONS RESULTS >1 hr SONY >1 hr 6 Layer TV 85 /85RH >1 hr 5V DC bias >1 hr 29 of 4

NY317 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY317 半固化片 NY317 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 3 of 4

NY317 基板表 Sheet for Laminate NY317 覆铜箔板 NY317 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.4 (1oz) 2.4.8 2.4.8.2 2.4.8.3 2. 1 9 2.5 1 7 2.5.17.1 1. 1 8 5. 1 6 2.5.17.1.8.12 2.6.2.1 4 6 2.5.6 <5.4 <5.4 4.6 <.35 <.35.8 415 345 49 449 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 13 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 17 175 34 375 6 3 3. 3 15 AABUS 4 23 2.7 >6 >6 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 31 of 4

NY317 产品使用指引 Process guideline 29. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 3. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 31. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 6 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 6 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 166 181 time, min 32. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 17 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY317, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 一般情况下普通的冲模条件可能不适合此款材料, 建议咨询设备供应商并作适当调整, 如冲床重量模具类型等 The typical punching parameters may not produce optimum hole topography for NY317, so you should consult with your equipment supplier to optimize your punching condition, as punching power or die type, etc. 以上指引, 仅供参考 The above process guideline is for general reference only. 32 of 4

产品编号 :NY615 Middle Tg, Low Dk (Dk 3.6) & Low Df (Df.6), Low ZCTE, CAF Resistance 特点低介电常数 (Dk 3.6, 1GHz) 和介质损耗 (Df.6, 1GHz) Low Dk (Dk 3.6, 1GHz) and Low loss (Df.6, 1GHz) FEATURES Tg 15 无铅兼容板材 Tg 15 Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 高频高速低损耗通讯设备及 4C 电子产品类 High Frequency, High Speed, Low Loss Communications or 4CElectronics, and etc. Dk & Df 测试 DK Value 4.8 4.5 4.2 3.9 3.6 3.3 3 Dk Test (.8mm) NY615 Std. FR4.1 1 2 5 1 Frequency, GHz.25.2 Df Test (.8mm) NY615 Std. FR4 Df Value.15.1.5.1 1 2 5 1 Frequency, GHz 33 of 4

NY615 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY615 半固化片 NY615 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 34 of 4

NY615 基板表 Sheet for Laminate NY615 覆铜箔板 NY615 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.5 (1oz) 2.4.8 2.4.8.2 2.4.8.3 6.5 1 8 5.6 1 6 2.5.17.1 3.6 1 7 2.8 1 6 2.5.17.1.5.12 2.6.2.1 4 42 2.5.6 <5.4 <5.4 3.6 <.35 <.35.6 415 345 515 45 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 15 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 15 155 325 345 6 3 3.5 3 5 AABUS 5 235 3. >6 18 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 35 of 4

NY615 产品使用指引 Process guideline 33. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 34. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 35. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 6 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 6 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 166 181 time, min 36. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 15 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 15 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY615, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 不可采用冲模外型加工 Not to punch for the materials. 以上指引, 仅供参考 The above process guideline is for general reference only. 36 of 4

产品编号 :NY62 Very High Tg, Low Dk (Dk 3.8) & Low Df (Df.8), Low ZCTE, CAF Resistance 特点低介电常数 (Dk 3.8, 1GHz) 和介质损耗 (Df.8, 1GHz) Low Dk (Dk 3.8, 1GHz) and Low loss (Df.8, 1GHz) FEATURES Tg 2 无铅兼容板材 Tg 2 Leadfree compatible 优秀的剥离强度 Excellent Peel Strength 优秀的耐 CAF 性能 Excellent AntiCAF Performance UV Blocking 和 AOI 兼容 UV Blocking/AOI Compatible 优秀的尺寸安定性 Excellent Dimension Stability 应用领域 APPLICATIONS 高频高速低损耗通讯设备及 4C 电子产品类 High Frequency, High Speed, Low Loss Communications or 4CElectronics, and etc. Dk & Df 测试 Dk Value 4.8 4.5 4.2 3.9 3.6 3.3 3 Dk Test NY62 Std. FR4.1 1 2 5 1 Frequency, GHz.25.2 Df Test NY62 Std. FR4 Df Value.15.1.5.1 1 2 5 1 Frequency, GHz 37 of 4

NY62 采购信息 PURCHASING INFORMATION 基板厚度厚度公差铜箔 Thickness Tolerance Copper foil.3mm to 3.2mm IPC411 Class C/M 1/4 oz to 6 oz 915 122mm (36 48 ), 12 122mm (4 48 ), 17 122mm (42 48 ), 183 122mm (72 48 ), 24 122mm (8 48 ), 214 122mm (84 48 ) * 其它尺寸和厚度亦可供应 Other sheet size and thickness could be available upon request. 半固化片 Prepreg 常用玻纤布型号 Normal Glass Type AntiCAF LDPP 49.5 115 m For AntiCAF (16, 18, 2113, 2313, 3313, 2116, 1652, 156, 7628) For Laser Drillable (16, 137, 167,178, 186) * 其它裁片尺寸和卷长度亦可供应 Other sheet size and roll length could be available upon request. 半固化片表 Sheet for Prepreg NY62 半固化片 NY62 Prepreg 单位 Units 1. 玻纤布 Reinforcement As per IPC4412 or AABUS 2. 树脂含量 Resin Content ±2 ±2 2.3.16.1C By treated weight 3. 胶化时间 Gel Time sec ±2 ±2 2.3.18A 4. 树脂流量 Resin Flow ±5 ±5 2.3.17D 5. 挥发份含量 Volatile content <1.5 <1.5 2.3.19C 6. 储存期 Shelf Life ( 条件 1Condition 1 / 条件 2Condition 2) 7. 燃烧性 Flammability ( 压合后 as laminated) Days 18/9 18/9 AABUS rating V V UL94 8. 其它 Other As per IPC411 or AABUS * 储存期 Shelf Life ( 条件 1Condition 1 / Temp.: <5, 条件 2Condition 2/Temp.: <23 R.H.: <5). 38 of 4

NY62 基板表 Sheet for Laminate NY62 覆铜箔板 NY62 Laminate 1. 抗剥强度 Peel Strength, 收货时 As received A. 1/2 盎司及以下铜箔 17 micron copper B. 1 盎司铜箔 35 micron copper C. 2 盎司铜箔 7 micron copper D. 3,4,5 盎司及以上铜箔 15, 14, 175 micron copper and above 2. 体积电阻 Volume Resistivity, A. 恒温恒湿 C96/35/9 E24/125 3. 表面电阻 Surface Resistivity, A. 恒温恒湿 C96/35/9 E24/125 4. 吸水率 Moisture Absorption 5. 击穿电压 Dielectric Breakdown 6. 介电常数 Permittivity at 1 MHz, 7. 介质损耗 Loss Tangent at 1 MHz, 8. 弯曲强度 Flexural Strength, A. 纵向 Length direction B. 横向 Cross direction 9. 高温弯曲强度 Flexural Strength at Elevated Temperature, length direction, 1. 耐电弧性 Arc Resistance 11. 热应力冲击 Thermal Stress A. 未蚀刻 Unetched B. 蚀刻 Etched 12. 电气强度 Electric Strength 13. 燃烧性 Flammability 14. 玻璃态转化温度 Glass Transition Temperature 15. 热分解温度 Decomposition Temperature 16. 膨胀系数 ZAxis CTE A. Alpha 1 B. Alpha 2 C. 5 to 26 17. 耐热性 ( 除去铜箔 ) Thermal Resistance (Copper removed) A.T26 B.T288 C.T3 单位 Units Metric(English) <.5mm.5mm 1.6mm CCL IPCTM65 N/mm(Ib/inch), MΩcm, MΩ, kv N/mm 2, N/mm 2 S 1 sec at 288 kv/mm.7 (4.).79 (4.5).88 (5.).96 (5.5) 1 6.7 (4.) 1.5 (6.) 1.4 (8.) 1.58 (9.) 1.5 (1oz) 2.4.8 2.4.8.2 2.4.8.3 2. 1 9 2.5 1 7 2.5.17.1 1. 1 8 5. 1 6 2.5.17.1.5.12 2.6.2.1 4 6 2.5.6 <5.4 <5.4 3.8 <.35 <.35.8 415 345 49 449 2.5.5.5 2.5.5.6 2.5.5.9 2.4.4 2.4.4.1 6 6 13 2.5.1 2.4.13.1 3 2.5.6.2 Rating V V V UL94 2 21 34 375 6 3 3. 3 15 AABUS 4 23 2.7 >6 >6 2.4.25 TBD (5 wt loss).1 18. 耐 CAF 性能 CAF Resistance /Fail AABUS 2.6.25 39 of 4

NY62 产品使用指引 Process guideline 37. 搬运及储存要求 Handling and Storage: 半固化片和基板必须水平平坦放置, 轻拿轻放, 避免折伤 Prepreg and Laminate should always be stored flat and horizontally. To avoid damage is recommended. 半固化片可以在干冷的环境下保存 3 个月 ( 温度 <23, 相对湿度 : <5) Shelf life is 3 months when prepreg stored in a cool dry environment (Temp.: <23 R.H.: <5). 基板可以在常温干燥的环境下保存 1 年 Shelf life is 1 year when laminate stored in a dry environment. 38. PCB 内层制作指引 PCB Inner Layer Process guideline: 基板在用于量产前, 必须先做首板测试并得到合适制作参数 ( 尺寸补偿系数等 ) First around must be taken and find a suitable parameter (as dimension compensation, etc) before mass production. 内层线路板在棕化后必须烘烤 12 摄氏度 3 分钟以上, 以去除水气 Inner layers should be baked for at least 3 min at 12 after black or brown oxides treatment 39. PCB 压合制作参考 Multilayer Lamination Suggestion: 升温速率 Heating rate (8 ~ 14 ) / 高压设定 Highest Pressure: 慢升温速率 :1.~2. /min 高压设定 :35~4 psi, 快升温速率 :2.~3. /min 高压设定 :3~35 psi Slow heating rate: 1.~2. /min, Pressure: 35~4 psi. Fast heating rate: 2.~3. /min, Pressure: 3~35 psi. 固化条件 : 压机每本中间层板温必须在 19 摄氏度以上保持 6 分钟, 以保证树脂完全固化 Curing condition: Temperature of the inner boards, keep at least 6 minutes at 19 and above. 降温速率 : 中间层板温高于 14 摄氏度时, 降温速率应在 2. /min 以下, 以确保热应力完全释放 Cooling rate: <2. /min, when the temperature of the inner boards is over 14, in order to relax the thermal stress. ( 建议压合程式如下图 Recommended Press Cycle as below). Press Cycle reference 2 4 temperature, 15 1 5 Temperature, Pressure, psi 3 2 1 pressure, psi 1 16 31 46 61 76 91 16 121 136 151 166 181 time, min 4. 其它制程 The other processes: 钻孔 : 钻孔参数必须依据钻咀质量孔径铜厚板厚层数及叠板高度等条件设定, 并且在量产前必须进行首板试验 Drilling parameters are mainly dependent on the drill bit quality, hole size, copper thickness, layer thickness, layer number and stack height, and etc. First around must be taken and find a suitable parameter before mass production. 烘烤 : 建议钻孔后及除胶渣前烘烤 2 摄氏度 2 小时以上, 以去除释放机械应力 To bake after drilling 2 C/ 2 hours, in order to relax the mechanical stress. 除胶渣 : 一般情况下普通 Fr4 的除胶渣条件可能不适合此款材料, 建议咨询药水供应商并作适当调整, 如除胶时间温度等 The typical parameters used to desmear Normal FR4 may not produce optimum hole topography for NY62, so you should consult with your chemical supplier to optimize your desmear condition, as desmear time or temperature, etc. 外型加工 : 不可采用冲模外型加工 Not to punch for the materials. 以上指引, 仅供参考 The above process guideline is for general reference only. 4 of 4