MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) REFLOW FEATURES Compact and Low-profile Low loss and high attenuation Stable temperature characteristics APPLICATIONS Bluetooth module, Wireless LAN, Digital TV ORDERING CODE F I 2 1 2 B 2 4 5 2 5 ー T ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❶Device code Filters for FI High Frequency ❷Electrode code With Plating =Blank space ❸Dimensions code [mm] 325 3.2 2.5 212 2. 1.25 168 1.6.8 15 1..5 EXTERNAL DIMENSIONS/STANDARD QUANTITY B L C P T D ❹Special Code Band Pass Filter Low Pass Filter Balance Filter Diplexer Balun Dual Filter ❺Frequency MHz example 245 24~25 62 47~77 ❻Spec Code 1~ Individual Spec ❼Packaging ー T Tape & Reel FI 325P Type FI 212B Type FI 212B24525/FI 212B19223 FI 212L Type 3.2.2 1.6.1.45max. 1.max.5.15.2.15 FI 212C24533/FI 212C24534 FI 168B/L Type FI 212C Type FI 212C249566/FI 212C35568 2..15 FI 212P Type FI 212P 396A4 FI 168T Type 1.6.1.5max..8.1 2.5.2.8.1 1..1.55.2 FI 212C24575.4.1.5.15.2.15 FI 168D Type FI 168P Type FI 15B/L Type 1.6.1.45max. 1..5.4 Max..8.1.5.5.3.1.5.15.65Max.1.5.3.1.3.1.1.5.2.15 176 chipfilter1_e-1
FI 325P Type FI 212C245XX FI 212C24551 FI 212C249566 FI 212C35568 FI 212P2453 FI 212P2453/ FI212P8928/ FI212P85912 FI 212P89213/ FI 212P8599 FI 212P396A4 FI 168T Type FI 168D8718 FI 168P Type (1) GND Balanced Balanced Balanced GND GND GND Low Band Unbalance High Band IN GND (2) Common GND GND GND Common Common Port Common Port GND GND GND High Band (3) GND Balanced Balanced Balanced GND GND GND High Band Balanced Low Band IN Common (4) High Band GND GND GND HIGH Band High Band Low Band GND Balanced Low Band OUT Low Band (5) GND Unbalance Unbalance Unbalance GND GND GND GND GND GND ー (6) Low Band DC NC NC or DC Low Band Low Band High Band Common NC High Band OUT ー (7) ー NC NC NC ー ー ー GND ー ー ー (8) ー GND GND GND ー ー ー GND ー ー ー Type Standard Quantity [pcs] 325P 2 212B 212L 3 212C 212P 168B 168L 168T 4 168D 168P 15B 1 15L PART NUMBERS Multi-layer band pass filters Applications External dimensions Ordering code Notes 2.4GHz W-LAN Bluetooth 2. 1.25 1. max. FI 212B24525/FI 212B24526/FI 212B24527 1.6.8.5 max. FI 168B2451 1..5.4 max. FI 15B24524 WiMAX 1.6.8.5 max. FI 168B2565/FI168B24956D 2. 1.25 1. max. FI 212B3961 WiMedia Band group 1 UWB 2. 1.25 1. max. FI212B44882 WiMedia Band group 1 TFC 7 PHS 2. 1.25 1. max. FI 212B19223 Multi-layer low pass filters Applications External dimensions Ordering code Notes 2. 1.25.5 max. FI 212L623 for ISDB-T Digital TV 1.6.8.45 max. FI 168L625 Thickness.45 mm max. WiMAX 1.6.8.45 max. FI 168L259764 Thickness.45 mm max. 2.4GHz W-LAN Bluetooth Multi-layer diplexer 1..5.4 max. FI 15L2514 Thickness.4 mm max. Other 1.6.8.45 max. FI 168D8718 Dual band LPF Applications External dimensions Ordering code Notes 2. 1.25 1. max. FI 212P2453 W-LAN FI 168P2451 1.6.8.65 max. FI 168P24523 FI 212P8928 Cellular 2. 1.25 1. max. FI 212P89213 FI 212P8599 FI 212P85912 GPS/ 2.4GHz W-LAN 1.6.8.65 max. FI 168P157519 UWB 2. 1.25 1. max. FI212P396A4 BS 3.2 2.5 1. max. FI325P1257 Multi-layer balance filters Applications External dimensions Ordering code Notes 2. 1.25 1. max. FI 212C24532 Conjugated match to CSR BC4 2. 1.25 1. max. FI 212C24533 Conjugated match to CSR BC3 Bluetooth 2. 1.25 1. max. FI 212C24534 Conjugated match to CSR BC4-BGA 2. 1.25 1. max. FI 212C24536 Conjugated match to CSR BC5 2. 1.25 1. max. FI 212C24551 Conjugated match to STLC25C-D 2. 1.25.7 max. FI 212C24575 Conjugated match to CSR BC5FM, BC6ROM WiMAX 2. 1.25.5 max. FI 212C249566 Thickness.5 mm max. 2. 1.25.5 max. FI 212C35568 Thickness.5 mm max. Multi-layer Balun Applications External dimensions Ordering code Notes 5GHz 1.6.8.5 max. FI 168T578717 Thickness.5 mm max. BS 1.6.8.5 max. FI 168T15521 Thickness.5 mm max. HIGH FREQUENCY PRODUCTS ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212B24525 Ripple 1. db max. 1.4 db max.(25 deg-c) 1.7 db max.(-3~+85 deg-c) 3 db min.(824-96 MHz) 3 db min.(85 MHz) 3 db min.(9 MHz) 3 db min.(18 MHz) 3 db min.(19 MHz) 27 db min.(171-191 MHz) 2 db min.(48-5 MHz) 2 db min.(5 MHz) FI 212B24526 Pass band frequency 24-25 MHz 2.6 db max.(25 deg-c) 2.9 db max.(-4~+85 deg-c) Ripple at 1. db max. at 4 db min.(8-96 MHz) 3 db min.(171-199 MHz) 25 db min.(211-217 MHz) 3 db min.(48-5 MHz) 3 db min.(72-75 MHz) FI 212B24527 Ripple 1. db max. 1.4 db max.(25 deg-c) 1.7 db max.(-4~+85 deg-c) 3 db min.(8-96 MHz) 3 db min.(171-191 MHz) 6 db min.(211-217 MHz) 2 db min.(48-5 MHz) chipfilter1_e-1 177
ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168B2451 Pass band frequency 24 25MHz Ripple 1. db max. 2.1 max. 2.2 db (25deg-C) 2.5 db (-3~+85deg-C) 25 db min. (88 96MHz) 25 db min. (171 191MHz) 2 db min. (48 5MHz) 2 db min. (72 75MHz) 5 ohm FI 212B19223 Pass band frequency 1884-193MHz Insertion Loss at 1.7 db max. (25deg-C) 1884-192MHz 2. db max. (-3-+85deg-C) Insertion Loss at 1.7 db max. (25deg-C) 192-193MHz 2. db max. (-3-+85deg-C) Ripple at Pass band 1. db max. at Pass band 3 db min. (142MHz) 18 db min. (3768-386MHz) FI 15B24524 Ripple 1. db max. 2.2 max. FI 168B2565 FI 168B24956D 3. db max.(25 deg-c) 3.3 db max.(-4~+85 deg-c) 25 db min.(88-96 MHz) 22 db min.(171-191 MHz) 2 db min.(48-5 MHz) 2 db min.(72-75 MHz) Pass band frequency 23-27 MHz 2.4 db max.(25 deg-c) 23-25 MHz 2.6 db max.(-3~+85 deg-c) 2.3 db max. (25 deg-c) 25-27 MHz 2.5 db max. (-3~+85 deg-c) Ripple at 1.4 db max. 23-25 MHz Ripple at 1.3 db max. 25-27 MHz at 2.4 max. 23-25 MHz at 1.3 max. 25-27 MHz 15 db min.(15-2 MHz) 1 db min.(46-8 MHz) Pass band frequency 23-269MHz Ripple at pass band at pass band FI 212B3961 2.3 db (25deg-C) 2.6 db (-3~+85deg-C).8 db max. 2.1 max. 15 db min. (DC-162MHz) 23 db min. (349-4MHz) 25 db min. (449-8MHz) 5 ohm Pass band frequency 3168 4752 MHz Ripple 2. db max. 2.5 max. FI 212B44882 2.7 db max. (25 deg-c) 3. db max. (-3~+85 deg-c) 33 db min. (9MHz) 25 db min. (15MHz) 22 db min. (19MHz) 13 db min. (25MHz) 1dB min. (515MHz) 5 ohm Pass band frequency 4224 4752 MHz 2.4 db max. (25 deg-c) 4224 4488 MHz 2.7 db max. (-3~+85 deg-c) 2.5 db max. (25 deg-c) 4488 4752 MHz 2.8 db max. (-3~+85 deg-c) Ripple 1.5 db max. 2.2 max. 4 db min. (24-25MHz) 25 db min. (33-36MHz) 1 db min. (5158-585MHz) FI 212L623 Pass band frequency 47 77 MHz.7 db max. (25 deg-c) 47 6MHz.9 db max. (-3~+85 deg-c) 1.5 db max. (25 deg-c) 6 71MHz 1.7 db max. (-3~+85 deg-c) 3.3 db max. (25 deg-c) 71 77MHz 3.7 db max. (-3~+85 deg-c) Ripple at 47 71 MHz 1.2 db max. at 47 71 MHz 2.5 max. 15 db min. (83 84 MHz) (25 deg-c) 11 db min. (83 84 MHz) (-3~+85 deg-c) 15 db min. (888 925 MHz) 15 db min. (94 96 MHz) 7 db min. (1429 1453 MHz) 8 db min. (192 198 MHz) 8 db min. (24 25 MHz) FI 168L625 Pass band frequency 47 77 MHz 1.2 db max. (25 deg-c) 47-6MHz 1.3 db max. (-3~+85 deg-c) 2.2 db max. (25 deg-c) 6-71MHz 2.4 db max. (-3~+85 deg-c) 4. db max. (25 deg-c) 71-77MHz 4.4 db max. (-3~+85 deg-c) Ripple at 47 71 MHz 1.4 db max. (47 71 MHz) 2.5 max. (71 77 MHz) 25 db min. (888 925 MHz) (25 deg-c) 21 db min. (888 925 MHz) (-3~+85 deg-c) 25 db min. (94 96 MHz) 27 db min. (1429 1453 MHz) 26 db min. (192 198 MHz) 26 db min. (24 25 MHz) FI 168L259764 Pass band frequency 47 77 MHz 23 27 MHz.5 db max. (25 deg-c) 47-77MHz.6 db max. (-3~+85 deg-c).5 db max. (25 deg-c) 23-27MHz.6 db max. (-3~+85 deg-c) Ripple at 47 77 MHz.3 db max. Ripple at 23 27 MHz.3 db max. at 47 77MHz at 23 27MHz 2 db min. (46 54 MHz) 2 db min. (69 81 MHz) FI 15L2514.45 db max.(25 deg-c) 24-25 MHz.55 db max.(-4~+85 deg-c) at 1.7 max. 24-25 MHz 21 db min.(48-5 MHz) 21 db min.(72-75 MHz) 178 chipfilter1_e-1
ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168D8718 FI 212C24534-1 -2-3 S11-4 -5. 1. 2. 3. 4. 5. 6. S21 7. 8. -1-2 -3 S11-4 -5. 1. 2. 3. 4. 5. 6. S21 7. 8. Pass band frequency 824 915 MHz 824 915 MHz.6 db max.( -2 to +85 Deg.C) at 824 915 MHz 1.5 max. 25 db min. (1648-183MHz) 25 db min. (2472-2745MHz) Pass band frequency 171 191 MHz 171 191 MHz.6 db max.( -2 to +85 Deg.C) at 824 915 MHz 1.5 max. 25 db min. (342-382MHz) 25 db min. (513-573MHz) Isolation In to In/Out to Out 27 db min. (824-915MHz) 3 db min. (171-191MHz) In to Out 3 db min. (824-915MHz) 3 db min. (171-191MHz) FI 212C24532 Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 35 db min. (88-96MHz) 2 db min. (171-199MHz) 2 db min. (199-217MHz) 2 db min. (48-5MHz) Unbalanced Port 5 ohm Conjugated match to CSR BC4 Ripple Amp. balance at Passband Phase Balance at Passband 2.7 db max.(25 deg-c) 3. db max.(-3~+85 deg-c) 1. db max. 2. db Max. 18 +/- 1 deg Unbalanced Port V.S.W.R at Passband V.S.W.R at Passband 25 db min.(88-96 MHz) 15 db min.(171-199 MHz) 12 db min.(199-217 MHz) 15 db min.(48-5 MHz) Unbalanced Port 5 ohm FI 212C24536 Conjugated to CSR BC4-BGA, BC5-BGA Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 35 db min. (88-96MHz) 2 db min. (171-199MHz) 15 db min. (199-217MHz) 2 db min. (48-5MHz) Unbalanced Port Conjugated match to CSR BC5 HIGH FREQUENCY PRODUCTS FI 212C24533 pass band 2.7 db (25deg-C) 3. db (-3~+85deg-C) Ripple 1. db max. Balanced port 2. db max. 18 +/- 1 deg 25 db min. (88-96MHz) 15 db min. (171-199MHz) 15 db min. (199-217MHz) 15 db min. (48-5MHz) Unbalanced Port Conjugated match to CSR BC3 chipfilter1_e-1 179
ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212C24551 Ripple FI 212C24575 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 4 db min. (824 96MHz) 12 db min. (157-158MHz) 27 db min. (171-1785MHz) 25 db min. (185-188MHz) 23 db min. (188-191MHz) 2 db min. (48-5MHz) Unbalanced Port 5 ohm Conjugated match to STLC25C-D Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. 2.2 max. Balanced port 2.2 max. 2. db max. 18 +/- 1 deg 4 db min. (88-96MHz) 18 db min. (171-199MHz) 12 db min. (199-217MHz) 3 db min. (48-5MHz) Unbalanced Port 5 ohm FI 212C249566 Conjugated match to CSR BC5FM.BC6ROM Pass band frequency 23-269MHz 2.9 db max. (25 deg-c) at 23-2495MHz 3.2 db max. (-3~+85 deg-c) Ripple at 23-2495MHz 1.2 db max. at 23-2495MHz Balanced port at 23-2495MHz 2. db max. at 23-2495MHz 18 +/- 12 deg at 23-2495MHz 2.3 db max. (25 deg-c) at 2495-269MHz 2.6 db max. (-3~+85 deg-c) Ripple at 2495-269MHz 1. db max. at 2495-269MHz Balanced port at 2495-269MHz 2. db max. at 2495-269MHz 18 +/- 12 deg at 2495-269MHz 4 db Min. (824-96MHz) 15 db Min. (171-199MHz) 2 db Min. (49-585MHz) 5 : 1-1 -2-3 2. 3. 4. -4 2 4 6 8 1 12 FI 212C35568 Pass band frequency 33-38MHz Ripple at pass band FI 212P2453.5 db max. (25 deg-c) at 24-25MHz.7 db max. (-3~+85 deg-c) 14 db min. (49-515MHz) 2 db min. (515-535MHz) 14 db min. (547-5825MHz) Pass band frequency 1 49-515MHz Pass band frequency 2 515-535MHz Pass band frequency 3 547-5825MHz 1 2 3 FI 168P2451 2.5 db (25 deg-c) 2.8 db (-3~+85 deg-c) 1. db max. Balanced port Amplitude imbalance at pass 2. db max. band Phase imbalance 18 +/- 12 deg 4 db min. (171-199MHz) 4 db min. (211-217MHz) 35 db min. (24-25MHz) 15 db min. (49-585MHz) 5:1.7 db max. (25 deg-c).9 db max. (-3~+85 deg-c).6 db max. (25 deg-c).8 db max. (-3~+85 deg-c).9 db max. (25 deg-c) 1. db max. (-3~+85 deg-c) (band-1.-2) 2.5 max. (band-2) 2 db min. (24-25MHz).4 db max. (25 deg-c) at 24-25MHz.5 db max. (-3~+85 deg-c) at 24 25 MHz 2 db min. (49-558MHz) 15 db min. (585-85MHz) Pass band frequency 49 585 MHz.6 db max. (25 deg-c) at 49 585 MHz.7 db max. (-4~+85 deg-c) at 49 585 MHz 2 min. (24-25MHz) 18 chipfilter1_e-1
ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168P24523 FI 212P8599-1 -2-3 -4 at 24-25MHz.6 db max. (25 deg-c).7 db max. (-3~+85 deg-c) at 24 25 MHz 2.max. 2 db min. (48-6MHz) 2 4 6 8 1 12 2 db min. (72-75MHz) Pass band frequency 49 595 MHz.8 db max. (25 deg-c) at 49 585 MHz.95 db max. (-4~+85 deg-c) at 49 585 MHz 2.max. 2 db min. (18-25MHz) 2 db min. (98-119MHz) *Referece FI 212P8928 Pass band frequency 698 96 MHz at 698 96 MHz.27 db max.(+25 Deg.C).32 db max.(-4 to +85 Deg.C) at 698 96 MHz 13dB min. (171-217MHz) Pass band frequency 171 217 MHz 171 217 MHz.45 db max.( +25 Deg.C).55 db max.(-4 to +85 Deg.C) at 698 96 MHz 19dB min. (698-96MHz) FI 212P89213 Pass band frequency 698 96 MHz at 698 96 MHz.27 db max.(+25 Deg.C).32 db max.(-4 to +85 Deg.C) at 698 96 MHz 13dB min. (171-217MHz) Pass band frequency 171 217 MHz 171 217 MHz.45 db max.( +25 Deg.C).55 db max.(-4 to +85 Deg.C) at 698 96 MHz 19dB min. (698-96MHz) -1-2 -3-4 -5-6.5-1 -2-3 -4-5 -6.5 Pass band frequency 698 96 MHz at 698 96 MHz.7 db max.(+25 deg-.c).75 db max.(-3~+85 deg-.c) at 698 96 MHz 1. 1.5 2. 2.5 19dB min. (1558 157MHz) 2dB min. (157 158MHz) 19dB min. (158 161MHz) Pass band frequency 1 1558 157MHz Pass band frequency 2 157 158MHz Pass band frequency 3 158 161MHz at 1558 157 MHz.75 db max.(+25 deg-.c).85 db max.(-3~+85 deg-.c) at 157 158 MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at 158 161 MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at 1558 157 MHz at 157 158 MHz at 158 161 MHz 35dB min. (698 824MHz) 42dB min. (824 894MHz) 25dB min. (894 96MHz) FI 212P85912 Pass band frequency 698 96 MHz at 698 96 MHz.7 db max.(+25 deg-.c).75 db max.(-3~+85 deg-.c) at 698 96 MHz 1. 1.5 2. 2.5 19dB min. (1558 157MHz) 2dB min. (157 158MHz) 19dB min. (158 161MHz) Pass band frequency 1 1558 157MHz Pass band frequency 2 157 158MHz Pass band frequency 3 158 161MHz at 1558 157 MHz.75 db max.(+25 deg-.c).85 db max.(-3~+85 deg-.c) at 157 158 MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at 158 161 MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at 1558 157 MHz at 157 158 MHz at 158 161 MHz 35dB min. (698 824MHz) 42dB min. (824 894MHz) 25dB min. (894 96MHz) HIGH FREQUENCY PRODUCTS 5 ohm chipfilter1_e-1 181
ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS -1-2 -3-4 -5. 1. 2. 3. -1-2 -3-4 2 4 6 8 1 12 FI 168P157519 Pass band frequency 824 96MHz Pass band frequency 1 1558 1585MHz Pass band frequency 2 1585 161MHz.5 db max.(+25 deg-.c) at 824 96 MHz.6 db max.(-4~+85 deg-.c).4 db max.(+25 deg-.c) at 1558 1585 MHz.5 db max.(-4~+85 deg-.c) at 1585 161 MHz.45 db max.(+25 deg-.c).55 db max.(-4~+85 deg-.c) at 824 96 MHz at 1558 1585 MHz at 1585 161 MHz 13dB min. (24-25MHz) High Band Pass band frequency 24 25 MHz at 24 25 MHz.6 db max.(+25 deg-.c).7 db max.(-4~+85 deg-.c) at 24 25 MHz 12dB min. (824 96MHz) 23dB min. (1558 1585MHz) 2dB min. (1585 161MHz) FI 212P396A4 Pass band frequency 3168-4782MHz 1.2 db max.(+25 deg-.c) at 3168-4782 MHz 1.5 db max.(-4~+85 deg-.c) at 3168-4782 MHz 2.2 max. 18dB min. (6336-954MHz) Pass band frequency 6336-954MHz at 6336-954 MHz 1.2 db max.(+25 deg-.c) 1.5 db max.(-4~+85 deg-.c) at 6336-954 MHz 2.2 max. 13dB min. (3168-4782MHz) FI 168T5787717 Pass band frequency 5725-585MHz FI 168T15521 1. db max.(25 deg-c) 1.2 db max.(-3~+85 deg-c) Phase balance 18 +/- 1 deg 1. db max. 5 : 1 Pass band frequency 9-22MHz 2. db max.(25 deg-c) 2.3 db max.(-3~+85 deg-c) Phase balance 18 +/- 2 deg +/-2 db max. 5 : 75-1 -2-3 -4-5 -6-7 1 2 3 FI 325P1257 Pass band frequency at 9 145 MHz Ripple at 9 145 MHz at 9 145 MHz 9 145 MHz 4. db max.(+25 deg-.c) 4.4 db max.(-4~+85 deg-.c) 3. db max.(+25 deg-.c) 3.4 db max.(-4~+85 deg-.c) 2.2 max. 44dB min. (165 22MHz)(+25 deg-.c) 4dB min. (165 22MHz)(-4~+85 deg-.c) 45dB min. (165MHz)(+25 deg-.c) 41dB min. (165MHz)(-4~+85 deg.-c) High Band Pass band frequency 165 22 MHz 4. db max.(+25 deg-.c) at 165 22 MHz 4.4 db max.(-4~+85 deg-.c) Ripple 3. db max.(+25 deg-.c) at 165 22 MHz 3.2 db max.( -4 to +85 Deg.C) 2.25 max. at 165 22 MHz 44dB min. (9 145MHz)(+25 deg-.c) 4dB min. (9 145MHz)( -4~+85 deg-.c) 45dB min. (145MHz)(+25 deg-.c) 41dB min. (145MHz)(-4~+85 deg-.c) 182 chipfilter1_e-1
HIGH FREQUENCY PRODUCTS chipfilter1_e-1 183
PACKAGING 1Minimum Quantity 2Tape Material Type Embossed Tape [pcs] 325P 2 212B 212L 3 212C 212P 168B 168L 168T 4 168D 168P 15B 1 15L Type (EIA) 325P 212B 212L Tape Thickness Chip cavity Insertion Pitch max. A B F K T 2.75±.2 3.55±.2 4.±.1 1.35.3 (.18±.8) (.14±.8) (.157±.4) (.53) (.12) 1.5±.25 2.3±.2 4.±.1 1.6.3 (.59±.8)(.91±.8)(.157±.4) (.63) (.12) 1.55±.2 2.3±.2 4.±.1.65.65 (.61±.8)(.91±.8)(.157±.4) (.26) (.26) 212C 1.55±.2 2.3±.2 4.±.1 1.6.3 (.61±.8) (.91±.8) (.157±.4) (.63) (.12) 212C-.5 1.55±.2 2.3±.2 4.±.1 1.3.3 212C-.7 (.61±.8)(.91±.8)(.157±.4) (.51) (.12) 212P 168B 168L 168T 168D 168P 15B 15L 1.55±.2 2.3±.2 4.±.1 1.6.3 (.61±.8)(.91±.8)(.157±.4) (.63) (.12) 1.±.5 1.8±.5 4.±.1.55.55 (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.±.1.55.55 (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.±.1.55.55 (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.±.1.55.55 (.39±.2)(.71±.2)(.157±.4) (.22) (.22).95±.5 1.8±.5 4.±.1.8.8 (.37±.2)(.71±.2)(.157±.4) (.31) (.31).62±.3 1.12±.3 2.±.5.45.45 (.24±.1)(.44±.1)(.79±.2) (.18) (.18).62±.3 1.12±.3 2.±.5.45.45 (.24±.1)(.44±.1)(.79±.2) (.18) (.18) (inch) 4Leader and Blank Portion Taped package Type (EIA) Thickness mm (inch) Standard Quantity [pcs] 325P.9 typ.(.35) 2 212B.9 typ.(.35) 212L.45 typ.(.18) 212C.9 typ.(.35) 212P.9 typ.(.35) 3 212C-.5.45 typ.(.18) 212C-.7.6 typ.(.24) 168B.45 typ.(.18) 168L.45 typ.(.18) 168T.45 typ.(.18) 4 168D.45 typ.(.18) 168P.6 typ.(.24) 15B.3 typ.(.118) 15L.3 typ.(.118) 1 5Reel size 16mm or more 1mm or more 3Taping Dimensions Embossed tape.315 inches wide (325P Type, 212B Type, 212C Type, 212C-.7 Type) Paper tape.315 inches wide (212L Type, 212C-.5 Type, 168B Type, 168L Type, 168 Type, 168T Type, 168DType, 15B Type, 15L Type) 6Top Tape Strength (inch) The top tape requires a peel-off force of.1~.7n in the direction of the arrow as illustrated below. (inch) chipfil_reli-prp1 chipfil_reli_e-1
RELIABILITY DATA 1. Operating Temperature Range 2. Storage Temperature Range Note : ー 2 to +4 in taped packaging 3. Resistance to Flexure of Substrate Warp : 2mm Testing board : Glass epoxy-resin substrate Thickness :.8mm -3~+85-3~+85 No mechanical damage. 4. Adhesion of Electrode Applied force : 5N Duration : 1 sec. 5. Solderability Solder temperature : 23±5 Preconditioning : Immersion into flux. Duration : 4±1 sec. Immersion and Removal speed : 25mm/sec. 75% or more of immersed surface of terminal electrode shall be covered with fresh solder. 6. Resistance to Solder Heat Preheating : 15 for 2 min. Preconditioning : Immersion into flux. Solder temperature : 26±5 Immersion and Removal speed : 25mm/sec. Duration : 5±.5 sec. Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 7. Thermal Shock According to JIS C 25. Conditions for 1 cycle Step Temperature ( ) Duration (min) 1 ー 4±3 3±3 2 Room Temperature Within 3 3 85±2 3±3 4 Room Temperature Within 3 Number of cycles : 1 Mounting method : Soldering onto PC board. Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 8. Humidity (steady state) Temperature : +4±2 Duration : 96 hrs Humidity : 9~95%RH Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 9. High temperature life test Temperature : +85±2 Duration : 96 hrs Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 1. Low temperature life test Temperature : ー 4±2 Duration : 96 hrs Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Note on standard condition: "standard condition" referred to herein is defined as follows : 5 to 35 of temperature, 45 to 85% relative humidity and 86 to 16kPa of air pressure. When there are questions concerning measurement result : In order to provide correlation data, the test shall be conducted under condition of 2±2 of temperature, 6 to 7% relative humidity and 86 to 16kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition". chipfil_reli-prp2 chipfil_reli_e-1
PRECAUTIONS 1. PCB Design Land pattern design Land pattern dimension examples FI325P Type FI212B Type FI212B24525/FI212B19223 FI212L Type 1.5 1. 1.5.8 FI168T/D Type FI168B/L Type FI168P Type FI212C Type.5.25.45 Technical considerations.55.45.6.6.3.3.25.25 1.1 FI212P Type FI212 P396A4 FI15B/L Type.3.45.2.5.7.3.45.2 2. Soldering Conditions for Reflow soldering (for reference) Reflow Profile Technical considerations Components should be preheated to within 1 to 13 from soldering temperature. Assured to be reflow soldering for 2 times. Note : The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. 3. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : ー 2~+4 Precautions Humidity : Below 7%RH The ambient temperature must be kept below 3. Even under ideal storage conditions, the solderbility of electrodes decreases gradually, so filters should be mounted within 6 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air. Technical considerations Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check the solderability before using the filter. Please contact of our offices for further details of specifications. All of the standard values listed here are subject to change without notice. Therefore,please check the specifications carefully before use. chipfil_reli-prp3 chipfil_reli_e-1