19-2818; Rev 2; 7/04, +3.3V, 155Mbps 2.7Gbps,, (ERC) (APC) APC, 5mA 60mA ( 85mA) 100mA, FP/DFB () (TX_FAULT),, APC SFF-8472 SFP MSA 32 5mm x 5mm QFN QFN, -40 C +85 C OC-3 OC-48 FEC SFF/SFP GBIC 1Gbps/2Gbps SFF/SFP GBIC +3.3V 47mA 85mA 100mA (APC) PART TEMP RANGE PIN-PACKAGE ETJ -40 C to +85 C 32 Thin QFN ETJ+ -40 C to +85 C 32 Thin QFN EGJ -40 C to +85 C 32 QFN +Denotes lead-free packaging. TOP VIEW MODTCOMP TH_TEMP 32 31 MODBCOMP MODSET 30 29 28 APCSET 27 APCFILT2 26 APCFILT1 25 VMD GND 1 24 MD 2 23 3 22 IN+ IN- 4 5 EGJ 21 20 6 19 PC_MON 7 18 BC_MON 8 17 BIAS 9 10 11 12 13 MC_MON 14 GND VCC TX_FAULT SHUTDOWN VBS GND GND 15 16 功能图及典型应用电路参见数据资料的末尾部分 5mm x 5mm QFN *THE EXPOSED PADDLE MUST BE SOLDERED TO SUPPLY GROUND TO ACHIEVE SPECIFIED PERFORMANCE. Pin Configurations continued at end of data sheet. Maxim Integrated Products 1 Maxim Maxim Maxim Maxim www.maxim-ic.com.cn
, ABSOLUTE MAXIMUM RATINGS Supply Voltage...-0.5V to +6.0V IN+, IN-,, TX_FAULT, SHUTDOWN, MC_MON, BC_MON, PC_MON, VBS, VMD, APCFILT1, APCFILT2, MD, TH_TEMP, MODTCOMP, MODBCOMP, MODSET, and APCSET Voltage...-0.5V to + 0.5V,, BIAS Current...-20mA to +150mA Continuous Power Dissipation (T A = +85 C) 32-Pin QFN (derate 21.2mW/ C above +85 C)...1.3W Operating Junction Temperature Range...-55 C to +150 C Storage Temperature Range...-55 C to +150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = +2.97V to +3.63V, T A = -40 C to +85 C. Typical values are at = +3.3V, I BIAS = 60mA, I MOD = 60mA, T A = +25 C, unless otherwise noted.) (Notes 1, 2) POWER SUPPLY PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Current I CC (Note 3) 47 60 ma Power-Supply Noise Rejection PSNR f 1MHz, 100mV P-P (Notes 4, 6) 33 db I/O SPECIFICATIONS Differential Input Swing V ID DC-coupled, Figure 1 0.2 2.4 V P-P Common-Mode Input V CM 1.7 LASER BIAS Bias-Current Setting Range 1 100 ma Bias Off Current = high 0.1 ma Bias-Current Monitor Ratio I BIAS /I BC_MON 68 82 95 ma/ma LASER MODULATION Modulation-Current Setting Range Output Edge Speed - V ID /4 I MOD (Note 5) 5 85 ma 20% to 80% 5mA I MOD 10mA 71 80 (Notes 6, 7) 10mA < I MOD 85mA 52 80 Output Overshoot/Undershoot (Note 7) ±6 % Random Jitter (Notes 6, 7) 0.65 1.3 ps Deterministic Jitter (Notes 6, 8) Modulation-Current Temperature Stability 2.7Gbps 1.25Gbps 622Mbps 155Mbps 5mA I MOD 10mA 25.6 40 10mA < I MOD 85mA 16 40 5mA I MOD 10mA 32 41 10mA < I MOD 85mA 15 41 5mA I MOD 10mA 39 46 10mA < I MOD 85mA 21 46 5mA I MOD 10mA 65 100 10mA < I MOD 85mA 46 70 V ps ps P-P (Note 6) ±150 ±480 ppm/ C 2
, ELECTRICAL CHARACTERISTICS (continued) ( = +2.97V to +3.63V, T A = -40 C to +85 C. Typical values are at = +3.3V, I BIAS = 60mA, I MOD = 60mA, T A = +25 C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Modulation-Current Setting Error 15Ω load, 5mA I MOD 10mA ±20 T A = +25 C 10mA < I MOD 85mA ±15 Modulation Off Current = high 0.1 ma Modulation-Current Monitor Ratio I MOD /I MC_MON 223 262 302 ma/ma EXTINCTION RATIO CONTROLS M oni tor - D i od e Inp ut C ur r ent Rang e I MD Average current into the MD pin 18 1500 µa MD Pin Voltage 1.4 V MD-Current Monitor Ratio I MD /I PC_MON 0.85 1.0 1.15 ma/ma APC Loop Time Constant C APC_FILT = 0.01µF, I MD / I BIAS = 1/70 3.3 µs APC Setting Stability ±100 ±480 ppm/ C APC Setting Accuracy T A = +25 C ±15 % I MOD Compensation Setting Range by Bias K K = I MOD / I BIAS 0 1.5 ma/ma % I MOD Compensation Setting Range by Temperature Threshold Setting Range for Temperature Compensation TC TC = I MOD / Τ (Note 6) 0 1.0 ma/ C T TH (Note 6) 10 60 C LASER SAFETY AND CONTROL Bias and Modulation Turn-Off Delay C APC_FILT = 0.01µF, I MD / I BIAS = 1/80 (Note 6) 5 µs Bias and Modulation Turn-On Delay C APC_FILT = 0.01µF, I MD / I BIAS = 1/80 (Note 6) 600 µs Threshold Voltage at Monitor Pins V REF Figure 5 1.14 1.3 1.39 V INTERFACE SIGNALS Input High V HI 2.0 V Input Low V LO R PULL = 7.5kΩ 0.8 V Input Current V HI = 15 V LO = GND -450-800 TX_FAULT Output Low Sinking 1mA, open collector 0.4 V Shutdown Output High Sourcing 100µA Shutdown Output Low Sinking 100µA 0.4 V Note 1: AC characterization is performed using the circuit in Figure 2 using a PRBS 2 23-1 or equivalent test pattern. Note 2: Specifications at -40 C are guaranteed by design and characterization. Note 3: Excluding I BIAS and I MOD. Input data is AC-coupled. TX_FAULT open, SHUTDOWN open. Note 4: Power-supply noise rejection (PSNR) = 20log 10 (V noise (on VCC) / V OUT ). V OUT is the voltage across the 15Ω load when IN+ is high. Note 5: The minimum required voltage at the and pins is +0.75V. Note 6: Guaranteed by design and characterization. Note 7: Tested with 00001111 pattern at 2.7Gbps. Note 8: DJ includes pulse-width distortion (PWD). - 0.4 µa V 3
, ( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) OPTICAL EYE DIAGRAM (2.7Gbps, 2 7-1PRBS, 2.3GHz FILTER) 1310nm FP LASER E r = 8.2dB toc01 OPTICAL EYE DIAGRAM (1.25Gbps, 2 7-1PRBS, 940MHz FILTER) 1310nm FP LASER E r = 8.2dB toc02 54ps/div 116ps/div OPTICAL EYE DIAGRAM (155Mbps, 2 7-1PRBS, 117MHz FILTER, C APC = 0.1µF) ELECTRICAL EYE DIAGRAM (I MOD = 30mA, 2.7Gbps, 2 7-1PRBS) toc03 toc04 75mV/div 920ps/div 52ps/div SUPPLY CURRENT (ma) SUPPLY CURRENT (I CC ) vs. TEMPERATURE (EXCLUDES BIAS AND MODULATION CURRENTS) 65 I MOD = 60mA I BIAS = 60mA 60 55 50 45 40 = 3.63V = 2.97V = 3.3V toc05 IBIAS/IBC_MON (ma/ma) 90 88 86 84 82 80 78 76 74 72 BIAS-CURRENT MONITOR GAIN vs. TEMPERATURE toc06 IMD/IPC_MON (ma/ma) 1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 PHOTO-CURRENT MONITOR GAIN vs. TEMPERATURE toc07 35-40 -20 0 20 40 60 80 TEMPERATURE ( C) 70-40 -15 10 35 60 85 TEMPERATURE ( C) 0.80-40 -15 10 35 60 85 TEMPERATURE ( C) 4
, ( ) ( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) IMOD/IMC_MON (ma/ma) 300 290 280 270 260 250 240 230 220 210 200 MODULATION-CURRENT MONITOR GAIN vs. TEMPERATURE -40-15 10 35 60 85 TEMPERATURE ( C) toc08 IMOD (ma) 90 80 70 60 50 40 30 20 10 0 MODULATION CURRENT vs. R MODSET 1 10 100 R MODSET (kω) toc09 IMD (ma) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 PHOTODIODE CURRENT vs. R APCSET 0 0.1 1 10 100 R APCSET (kω) toc10 50 45 40 35 DETERMINISTIC JITTER vs. MODULATION CURRENT toc11 2.0 1.5 RANDOM JITTER vs. MODULATION CURRENT toc12 DJ (psp-p) 30 25 20 RJ (psrms) 1.0 15 10 0.5 5 0 0 10 20 30 40 50 60 70 80 90 I MOD (ma) 0 0 20 40 60 80 100 I MOD (ma) 10 COMPENSATION (K) vs. R MODBCOMP toc13 100 90 TEMPERATURE COMPENSATION vs. R TH_TEMP (R MODTCOMP = 500Ω) R TH_TEMP = 12kΩ toc14 1 80 R TH_TEMP = 7kΩ K (ma/ma) 0.1 IMOD (ma) 70 60 50 R TH_TEMP = 4kΩ R TH_TEMP = 2kΩ 40 0.01 0 0.1 1 10 100 R MODBCOMP (kω) 30-20 0 20 40 60 80 100 TEMPERATURE ( C) 5
, ( ) ( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) IMOD (ma) 44 42 40 38 36 34 TEMPERATURE COMPENSATION vs. R TH_TEMP (R MODTCOMP = 10kΩ) R TH_TEMP = 12kΩ R TH_TEMP = 7kΩ R TH_TEMP = 4kΩ R TH_TEMP = 2kΩ toc15 FAULT HOT PLUG WITH 0V 3.3V t_init = 60ms toc16 32 30-20 0 20 40 60 80 100 TEMPERATURE ( C) LASER OUTPUT 20ms/div 3.3V TRANSMITTER ENABLE toc17 3.3V TRANSMITTER DISABLE toc18 FAULT FAULT HIGH t_on = 75µs t_off = 134ns HIGH LASER OUTPUT LASER OUTPUT 20µs/div 40ns/div RESPONSE TO FAULT toc19 FAULT RECOVERY TIME toc20 V PC_MON EXTERNALLY FORCED FAULT t_fault = 0.9µs V PC_MON EXTERNAL FAULT REMOVED FAULT HIGH FAULT HIGH HIGH LASER OUTPUT LASER OUTPUT t_init = 68ms 1µs/div 100ms/div 6
, PIN NAME FUNCTION 1, 10, 15, 16 GND Ground 2 Transmitter,TTL Disable, TTL. Laser, output is disabled when is asserted high or left unconnected., The laser output is enabled when this pin is asserted low. 3, 6, 11, 18, 23 +3.3V Supply Voltage 4 IN+ Noninverted Data Input 5 IN- Inverted Data Input 7 PC_MON Photodiode-Current, Monitor Output. Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the monitor-diode current. 8 BC_MON Bias-Current Monitor Output., Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the bias current. 9 MC_MON Modulation-Current Monitor, Output. Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the modulation current amplitude. 12 TX_FAULT Open-Collector Transmit Fault Indicator ( 1) (Table 1) 13 SHUTDOWN Shutdown Driver Output. Voltage output to control an external transistor for optional shutdown, circuitry. 14 VBS Bias Voltage Sense., Isolated tap (3kΩ ±15%) on the bias output reduces (3kΩ ±15%) component count when a precision bias sense resistor is used. 17 BIAS Laser Bias-Current Output 19, 20 21, 22 24 MD 25 VMD 26 APCFILT1 Inverted Modulation-Current Output (Connect Pins 19 and 20 Together). I MOD flows into this pin ( 19 20 ),I when input data is low. MOD Noninverted Modulation-Current Output (Connect Pins 21 and 22 Together). I MOD flows into this pin ( 21 22 ),I when input data is high. MOD Monitor Photodiode Input. Connect this pin to the anode of a monitor, photodiode. A capacitor to ground is required to filter the high-speed AC monitor photocurrent. Monitor Photodiode Voltage,MD Sense. Isolated tap (3kΩ ±15%) on the input reduces (3kΩ ±15%) component count when a precision photodiode current-sense resistor is used. Connect 26 a (APCFILT1) 27 capacitor (C ) between (APCFILT2), C pin 26 (APCFILT1) and pin 27 (APCFILT2) APC to set the dominant pole of the APC feedback loop. 27 APCFILT2 (See ( 26 Pin 26.) ) 28 APCSET A, resistor connected from this pin to ground sets the desired average optical power. 29 MODSET 30 MODBCOMP 31 TH_TEMP A resistor connected from this pin to ground sets the desired constant portion of the modulation, current. Modulation-Current Compensation from Bias. Couples the I BIAS bias current to the modulation current. Mirrors, I BIAS through an external resistor. Leave open for zero coupling. Threshold for Temperature Compensation. A resistor at this pin programs the temperature, above, which compensation is added to the modulation current. 32 MODTCOMP EP Exposed Pad Modulation-Current Compensation from Temperature. A resistor at this pin sets the temperature coefficient, of the modulation current when above the threshold temperature. Leave open for zero temperature compensation. Ground. Solder the exposed pad to the circuit board ground for specified thermal and electrical, performance. 7
, VOLTAGE V IN + V IN - (V IN +) - (V IN -) CURRENT I OUT + SINGLE ENDED DIFFERENTIAL 100mV (MIN) 1200mV (MAX) 200mV P-P (MIN), 2400mV (MAX) I MOD 30Ω 30Ω Z 0 = 30Ω 0.5pF I + OUT Z 0 = 30Ω 30Ω 75Ω Z 0 = 50Ω 50Ω TIME OSCILLOSCOPE 1. 2. SOURCE NOISE HOST BOARD FILTER DEFINED BY SFP MSA L1 1µH OPTIONAL MODULE TO LASER DRIVER VOLTAGE SUPPLY C1 0.1µF C2 10µF C3 0.1µF OPTIONAL 3. : ERC (+3.3V) ( 4) 15Ω 60mA, 0.7V 60mA 85mA 0.75V 60mA,,, (R D ) 15Ω, RC Maxim HFAN 02.0: Interfacing Maxim s Laser Drivers to Laser Diodes 2.7Gbps, BIAS, BIAS, (r e ), : r e = (2P AVG + P P-P ) / (2P AVG - P P-P ) APC, (η) : I P MD AVG = ρmon P P-P = η x I MOD 8
, IN+ INPUT BUFFER DATA PATH I MOD IN- SHUTDOWN R D SHUTDOWN TX_FAULT SAFETY LOGIC AND POWER DETECTOR I MOD ENABLE I BIAS ENABLE BIAS I BIAS R PULL = 7.5kΩ PC_MON I MD 1 I BIAS V BG R APCSET APCSET R MDMON BC_MON R BC_MON MC_MON I BIAS 82 I MOD 268 T > T H T xtc x268 xk X1/2 I APCSET X1 MD I MD C MD R MC_MON V BG TH_TEMP MODTCOMP MODSET MODBCOMP APCFILT1 APCFILT2 R TH_TEMP R MODTCOMP R MODSET R MODBCOMP C APC 4. (K), Maxim HFAN-02.2.1: I K = MOD I BIAS, (T TH ), () (TX_FAULT) ( 5), ( 1) SFP MSA,TX_FAULT 4.7kΩ 10kΩ, GND 2,,,, 9
, 1. If any of the I/O pins is shorted to GND or V 1 CC (single-point failure; see Table 2), and the bias current or the photocurrent exceed the programmed threshold. 2 End-of-life (EOL) condition of the laser diode. The bias current and/or the photocurrent exceed the programmed threshold. 3 Laser cathode is grounded and photocurrent exceeds the programming threshold. 4 No feedback for the APC loop (broken interconnection, defective monitor photodiode), and the bias current exceeds the programmed threshold. 2. PIN CIRCUIT RESPONSE TO OVERVOLTAGE OR SHORT TO CIRCUIT RESPONSE TO UNDERVOLTAGE OR SHORT TO GROUND TX_FAULT Does not affect laser power. Does not effect laser power. Modulation and bias currents are disabled. Normal condition for circuit operation. IN+ The optical average power increases and a fault occurs if V PC_MON exceeds the threshold. The APC loop responds by decreasing the bias current. The optical average power decreases and the APC loop responds by increasing the bias current. A fault state occurs if V BC_MON exceeds the threshold voltage. IN- The optical average power decreases and the APC loop responds by increasing the bias current. A fault state occurs if V BC_MON exceeds the threshold voltage. The optical average power increases and a fault occurs if V PC_MON exceeds the threshold. The APC loop responds by decreasing the bias current. MD SHUTDOWN BIAS This disables bias current. A fault state occurs. Does not affect laser power. If the shutdown circuitry is used, laser current is disabled. In this condition, laser forward voltage is 0V and no light is emitted. The APC circuit responds by increasing the bias current until a fault is detected, then a fault state* occurs. The APC circuit responds by increasing bias current until a fault is detected, then a fault* state occurs. Does not affect laser power. Fault state* occurs. If the shutdown circuitry is used, laser current is disabled. Fault state* occurs. If the shutdown circuitry is used, laser current is disabled. Does not affect laser power. Does not affect laser power. PC_MON Fault state* occurs. Does not affect laser power. BC_MON Fault state* occurs. Does not affect laser power. MC_MON Fault state* occurs. Does not affect laser power. APCFILT1 APCFILT2 I BIAS increases until V BC_MON exceeds the threshold voltage. I BIAS increases until V BC_MON exceeds the threshold voltage. MODSET Does not affect laser power. Fault state* occurs. APCSET Does not affect laser power. Fault state* occurs. I BIAS increases until V BC_MON exceeds the threshold voltage. I BIAS increases until V BC_MON exceeds the threshold voltage. *A fault state asserts the TX_FAULT pin, disables the modulation and bias currents, and asserts the SHUTDOWN pin. (MC_MON BC_MON PC_MON) (I MOD ) (I BIAS ) (I MD ), MC_MON PC_MON BC_MON V REF, 10
, 100Ω, : V MC_MON = (I MOD / 268) 100Ω V BC_MON = (I BIAS / 82) 100Ω V PC_MON = I MD 100Ω, 3 50 (P AVG ) (r e ), 3, (ρ MON ) (η) APC, APCSET : I P MD AVG = ρmon APCSET APCSET, MODSET I MD R APCSET, +25 C R APCSET I MD 1 = 2 V R REF APCSET, : I IAVG = I MOD BIAS + 2 : P I AVG MOD = 2 η re -1 re + 1 (I MODS ) I BIAS MOD SET I MOD, V REF I MOD R MODSET, +25 C R MODSET 3. PARAMETER SYMBOL RELATION Average power P AVG P AVG = (P 0 + P 1 ) / 2 Extinction ratio r e r e = P 1 / P 0 Optical power of a 1 P 1 P 1 = 2P AVG r e / (r e + 1) Optical power of a zero P 0 P 0 = 2P AVG / (r e + 1) Optical amplitude P P-P P P-P = P 1 - P 0 Laser slope efficiency η η = P P-P / I MOD Modulation current I MOD I MOD = P P-P / η Threshold current I TH P 0 at I I TH Bias current (AC-coupled) I BIAS I BIAS I TH + I MOD / 2 Laser to monitor transfer ρ MON I MD / P AVG Note: Assuming a 50% average input duty cycle and mark density. 11
, IMOD = IMODS + K IBIAS + IMODT I MODS = 268 V R REF MODSET IMODT = TC ( T- TTH) T> TTH IMODT = 0 T TTH MODBCOMP I BIAS MODBCOMPI BIAS I MOD : 1700 K = ± 10% 1000 + R MODBCOMP I MOD I MOD1 I MOD2,, : (I MOD > 60mA) 60mA,,,, ( ), 85mA, Maxim HFAN 02.0: Interfacing Maxim s Laser Drivers to Laser Diodes : V OUT ( ) I MOD V R R V + = CC - D + 075. 2 L K = I MOD2- I MOD1 IBIAS2- IBIAS1 TH_TEMP : 145. MΩ TTH = -70 C + C ± 10% 92. kω + RTH_ TEMP T TH R MODTCOMP MODT- COMP: 1 ma TC = ± 10% 05. + RMODTCOMP( kω) C 0.7V : V DIODE (1.2V ) R L (5Ω ) R D (20Ω ) : (I MOD 60mA) ( ) V V V I R R I R V = - - CC DIODE MOD D + - 07. L BIAS L C APC APC C APC, : 68 11 CAPC( µ F) ( η ρmon). f3db( khz) MD C MD : C C APC MD 4, 1ms, (η x ρ MON ) C APC,, 6 7, 12
, POR AND COUNTER 60ms DELAY COUNTER 60ms DELAY 100ns DELAY I MOD ENABLE I BIAS ENABLE PC_MON R PC_MON I MD 1 V REF COMP R RS LATCH Q CMOS SHUTDOWN BC_MON R BC_MON MC_MON I BIAS 82 I MOD 268 V REF V REF COMP S TTL OPEN COLLECTOR TX_FAULT R MC_MON COMP EXCESSIVE MODULATION CURRENT 5. PACKAGE 0.83nH 0.11pF 0.83nH 0.11pF 16kΩ 5kΩ 5kΩ 24kΩ,, EMI, IEC825 IEC 825, Maxim, Maxim 6. 13
, 32 QFN IC,, Maxim HFAN-08.1:Thermal Considerations for QFN and Other Exposed Pad Packages, www.maxim-ic.com.cn ( ) TOP VIEW MODTCOMP TH_TEMP 32 31 MODBCOMP MODSET 30 29 28 APCSET 27 APCFILT2 26 APCFILT1 25 VMD GND 1 24 MD 2 23 3 22 IN+ IN- 4 5 ETJ 21 20 PACKAGE PC_MON 6 7 19 18 0.82nH BC_MON 8 17 BIAS 9 10 11 12 13 14 15 16 0.82nH 0.11pF 0.11pF MC_MON GND VCC TX_FAULT SHUTDOWN VBS 5mm x 5mm THIN QFN GND GND *THE EXPOSED PADDLE MUST BE SOLDERED TO SUPPLY GROUND TO ACHIEVE SPECIFIED PERFORMANCE. 7. TRANSISTOR COUNT: 2727 PROCESS: SiGe/Bipolar 14
, +3.3V OPTIONAL SHUTDOWN CIRCUITRY +3.3V CDR 0.1µF 0.1µF IN+ TX_FAULT VCC SHUTDOWN 15Ω +3.3V 10Ω 0.01µF R MODBCOMP R MODTCOMP IN- MODBCOMP MODTCOMP BIAS MD FERRITE BEAD GND MODSET APCSET APCFILT1 APCFILT2 MC_MON BC_MON C MD R TH_TEMP TH_TEMP PC_MON C APC R MODSET R APCSET R MC_MON R BC_MON RPC_MON REPRESENTS A CONTROLLED-IMPEDANCE TRANSMISSION LINE 15
, ( www.maxim-ic.com.cn/packages ) 32L QFN.EPS 16
, ( ) ( www.maxim-ic.com.cn/packages ) MARKING D D/2 XXXXX 0.15 C A E/2 0.15 C B k D2 C L D2/2 b 0.10 M C A B E2/2 QFN THIN.EPS E (NE-1) X e LC E2 L k PIN # 1 I.D. DETAIL A e (ND-1) X e PIN # 1 I.D. 0.35x45 DETAIL B e L1 L C L C L L L 0.10 C e e A 0.08 C C A1 A3 -DRAWING NOT TO SCALE- PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 F 1 2 PKG. 16L 5x5 SYMBOL MIN. NOM. MAX. A A1 A3 b D E e L1 N ND NE JEDEC NOTES: 0.70 0.75 0.80 0 0.02 0.05 0.20 REF. 0.25 4.90 4.90 16 4 4 WHHB COMMON DIMENSIONS 0.30 0.35 0.25 0.30 5.00 5.10 4.90 5.00 5.00 5.10 4.90 5.00 0.80 BSC. 0.65 BSC. k 0.25 - - L 0.30 0.40 0.50 20L 5x5 MIN. NOM. MAX. 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0.25 0.45 0.20 REF. - 0.55 - - - - - - 20 5 5 WHHC 0.35 5.10 5.10-0.65 28L 5x5 MIN. NOM. MAX. 0.20 4.90 4.90 0.25 0.45 0.20 REF. 0.25 5.00 5.00 0.50 BSC. - 0.55 - - - 28 7 7 WHHD-1 0.30 5.10 5.10-0.65 32L 5x5 MIN. NOM. MAX. 4.90 4.90 0.25 0.30 0.20 REF. 0.20 0.25 0.30 5.00 5.00 0.50 BSC. - 0.40 - - - 32 8 8 WHHD-2 5.10 5.10-0.50 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. EXPOSED PAD VARIATIONS PKG. D2 E2 L DOWN CODES BONDS MIN. NOM. MAX. MIN. NOM. MAX. ±0.15 ALED T1655-1 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T1655-2 3.00 3.10 3.20 3.00 3.10 3.20 ** YES T1655N-1 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T2055-2 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T2055-3 3.00 3.10 3.20 3.00 3.10 3.20 ** YES T2055-4 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T2055-5 3.15 3.25 3.35 3.15 3.25 3.35 0.40 Y T2855-1 3.15 3.25 3.35 3.15 3.25 3.35 ** NO T2855-2 2.60 2.70 2.80 2.60 2.70 2.80 ** NO T2855-3 3.15 3.25 3.35 3.15 3.25 3.35 ** YES T2855-4 2.60 2.70 2.80 2.60 2.70 2.80 ** YES T2855-5 2.60 2.70 2.80 2.60 2.70 2.80 ** NO T2855-6 3.15 3.25 3.35 3.15 3.25 3.35 ** NO T2855-7 2.60 2.70 2.80 2.60 2.70 2.80 ** YES T2855-8 3.15 3.25 3.35 3.15 3.25 3.35 0.40 Y T2855N-1 3.15 3.25 3.35 3.15 3.25 3.35 ** N T3255-2 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T3255-3 3.00 3.10 3.20 3.00 3.10 3.20 ** YES T3255-4 3.00 3.10 3.20 3.00 3.10 3.20 ** NO T3255N-1 3.00 3.10 3.20 3.00 3.10 3.20 ** NO ** SEE COMMON DIMENSIONS TABLE 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3 AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. -DRAWING NOT TO SCALE- PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 F 2 2 Maxim Maxim Maxim 17 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 2004 Maxim Integrated Products Printed USA Maxim Integrated Products, Inc.