Outline dimensions: + - 单位 Unit 公差 Tolerance 芯片材料 Die material 胶体颜色 Lens color 发光颜色 Emission color mm ±.2mm InGaN Water Clear White 备注 : 承认书之编号和型号可用于查询, 客户如有需要, 请提供相应的编号和型号 Remark:P/N & Model in samples approval sheet can be used to inquire,please provide corresponding P/N& model if customer need.
二 光电参数 Photoelectricity Parameter ( 环境温度 Ambient temperature:25 湿度 humidity:rh6%) Item 正向电压 Forward voltage 反向电流 Reverse current 发光强度 Luminous intensity 主波长 Dominant wavelength 光谱半宽度 Spectrum line half width 视角 Viewing Angle 符号 Symbol 测试条件 Test condition 最小值 Min 典型值 Type 最大值 Max VF IF=2mA 3. -- 3.2 V 单位 Unit IR VR=5V -- -- 5 μa IV IF=2mA 9 -- 12 mcd λd IF=2mA -- -- -- nm Δλ IF=2mA -- 28 -- nm 2θ1/2 IF=2mA -- 25 -- deg 备注 : 亮度测试公差 ±15% 波长测试公差 ±1nm 正向电压测试公差 ±.5V The tolerance of intensity:±15%, The tolerance of wave length:±1nm,the tolerance of forwards voltage: ±.5V. reference for above data when testing. Remark: Only 三 极限参数 Absolute Maximum Rating ( 环境温度 Ambient temperature:25 湿度 humidity:rh6%) 符号 数值 单位 备注 Item Symbol Value Unit Remark 正向电流 Forward Current IF 3 ma --- 正向峰值电流 Peck forward current 反向耐压 Reverse Voltage 耗散功率 Power Dissipation 工作环境温度 Operation temperature 贮藏温度 Storage temperature 焊接温度 Soldering temperature IFM 75 ma F=1KHZ, 占空比 (duty cycle)1/1 VR 15 V --- Pm 8 mw --- Tamb -25 至 +8 --- Tstg -35 至 +85 --- 波峰焊, 离环氧体 3mm 处 5S Tsol 26 Wave soldering, 3mm out of physical body, 5S
9 SBLED White Datasheet 四 典型光电特性曲线图 Typical photoelectricity characteristic curve chart 1 Forward Current VS Forward Voltage 5. Relative Luminous Intensity VS Forward Current Forward Current(mA) 8 6 4 2 Relative Luminous Intensity 4. 3. 2. 1. 1.6 2.2 2.8 3.4 4. 4.6 2 4 6 8 1 Forward Voltage(V) Forward Current(mA) 5 Allowable Forward Current VS Ambient Temperature 2.5 Relative Luminous Intensity VS Ambient Temperature Allowable Forward Current(mA) 4 3 2 1 Relative Iuminous Intensity 2. 1.5 1..5 2 4 6 8 1 Ambient Temperature TA( ) -2 2 4 6 8 Ambient Temperature TA( ) 3 3 6 6 9 1 5 5 1 Relative Luminous Intensity(%)
五 可靠性实验 Reliability Test Project 描述 测试标准 测试条件 测试时间 数量 失效数量 Description Item Test criterion Test condition Test time Qty Fail qty 寿命测试 Life test 常温寿命测试 Life test(room temperature) 高温存储 High temperature store 低温存储 Low temperature store JIS721:B4 Ta=25 ±5,IF=3mA 1Hrs 22 JIS721:B1 MIL-STD-22:21A Ta=85 ±5 1Hrs 22 MIL-STD-75:231 JIS721:B12 Ta= -35 ±5 1Hrs 22 环境测试 Ambience test 高温高湿测试 High temperature/ humidity test 冷热冲击测试 Cold / Heat strike test JIS721:B11 MIL-STD-22:13D JIS721::B4 MIL-STD-22:17D MIL-STD-75:126 Ta=85 ±5 RH=85% 3min -1 ±5 1 ±5 5min 5min 1Hrs 22 5Cycles 22 冷热循环测试 Cold and heat cycle test JIS721:A3 MIL-STD-22:17D MIL-STD-75:15E 5min 5min 5min -35 ~25 ~85 ~-35 3min 5min 3min 5min 5Cycles 22 Judging criterion: Item 符号 Symbol 实验条件 Experiment condition Min. 判断标准 Criteria Max. Forward Voltage VF IF=2mA ---- Initial Datex1.1 Reverse Current IR VR=5V ---- 3μA Luminous Intensity IV IF=2mA Initial Datex.8 ----
六 注意事项 Note SBLED White Datasheet ( 一 ) 引脚成形方法 Led bracket forming method (1) 必需离胶体 2 毫米才能折弯支架 The pin of led can be bent where is at least 2mm out of led colloid. (2) 支架成形必须用夹具或由专业人员来完成 Must use fixture to deform the led bracket. (3) 支架成形必须在焊接前完成 Finishing the forming of led bracket must be before soldering. (4) 支架成形需保证引脚和间距与线路板上一致 Guarantee the gap between two pin of led tallys with LED pads in PCB when forming. ( 二 ) 烙铁焊接 Manual soldering 烙铁 ( 最高 3W) 尖端温度不超过 3 ; 焊接时间不超过 3 秒 ; 焊接位置至少离胶体 3 毫米 The tip temperature of soldering iron don t exceed 32 ;soldering time don t exceed 3s and soldering position must be 3mm out of led colloid 可靠性焊接温度 (A 图 B 图 )Soldering temperature curve chart(figure A figure B) Preheat A 图 波峰焊 B 图 回流焊
( 三 ) 防静电措施 ESD countermeasure 静电及高压会对 LED 造成损坏, 特别是晶片材质为 InGaN 的产品对静电防护要求更加严格, 要求在使用和检验 产品时戴防静电手腕带或防静电手套, 焊接工具及设备外壳需可靠接地, 焊接条件遵循此份规格书中的条件 Static electricity and high volt can damage led,the production whose Die material is InGaN must strictly required to prevent ESD,Must put on static glove and static fillet,soldering tool and the cover of device must connect the ground, soldering condition follows the related stating of production specification manual ( 四 ) 过电流保护 Protecting countermeasure when over current 为避免由于电压的变化引起大电流冲击而造成产品损坏, 需要加入保护电阻 Need add the protecting resistor in circuit in order to avoid damaging led due to big current and voltage fluctuation ( 五 )LED 安装方法 LED installation method 1) 注意各类器件外线的排列以防极性装错, 器件不可与发热元件靠得太近, 工作条件不要超过其规定的极限 Pay attention to the led polarity and avoid installation wrong Led can t be close to euthermic component,work condition should tally with it s specification 2) 务必不要在引脚间距变形的情况下安装 LED Don t install the LED under the condition of the led pin deformation 3) 当装配 LED 进入 PCB 或装配孔时,LED 支架不能承受任何压力 The led bracket don t load any pressure when installing the led into PCB or fitting hole 4) 在焊接温度回到正常以前, 必须避免使 LED 受到任何的震动或外力 Must avoid any strike and force on led before the soldering temperature return to room temperature ( 六 ) 存储时间 Storage time 1) 在温度 5 ~35, 湿度 RH6% 条件下, 产品可保存一年 超过保存期的产品需重新检测后方能使用 Led can be stored for a year under the condition: the temperature of 5 ~35 and humidity of RH6%,These production must be re-inspected and tested before use if their storage time exceed a year 2) 如果打开的产品在 5 ~35,RH6% 的空气条件下放置超过一周, 则需要将产品在 65 ±5 的环境中放置 24 小时以上, 并尽量在十五天内使用 If led is exposed in air for a week under the condition: the temperature of 5 ~35,humidity of RH6%,must place the led in the ambience of 65 ±5 for 24 hours and use it in 15 days for best ( 七 ) 清洗 Cleaning 当用化学用品清洗胶体时必须特别小心, 因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯 丙酮等 可用乙醇擦拭 浸渍, 时间在常温下不超过 3 分钟 Be careful of some chemical results in the led colloid fades and damage when using chemical clean the led,such as chloroethylene, acetone etc can use ethanol to wash or soak led but the time don t exceed 3 minutes. ( 八 ) 弯脚 (Kinked) 当 LED 成形弯脚时, 弯脚模具容易刮花 LED 脚支架镀层, 刮伤处容易生锈, 特别是空气湿度大时 为减少生锈机会, 建议使用镀锡支架 The kinked tooling scrape easily the pin of led, where the led bracket is rusting easily, especial expose it in moist air. To decrease the led bracket rust, advise using plated tin led bracket.