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: 片式负温度系数热敏电阻器 CHIP NTC THERMISTOR HLCMFD HLCMFA HLCMFB HLCMFC( 系列

1 承认书 APPROVAL SHEET 客户名称 : Customer Name: 产品名称 : Product Name: 制造商料号 : Manufacturer P/N: 客户料号 : Customer P/N: : Version No.: 片式负温度系数热敏电阻器 CHIP NTC THERMISTOR HLCMFD HLCMFA HLCMFB HLCMFC( 系列 ) 制造厂商 Manufacturer 客户承认印章 Approval Signet 拟制 Draft 审核 Check 日期 Date 日期 Date

2 承认书目录 Content 1 外形尺寸与内部结构 Dimension & Inner-configuration 1 2 产品规格型号 Product Spec. Model 2 3 电性能参数表 Electrical Characteristics List 3~6 4 可靠性试验项目 Reliability Testing Items 7~9 5 产品包装 Packaging 10 6 推荐焊接条件 Recommend Soldering Conditions 11~12 7 存储条件 Storage Conditions 13 8 注意事项 Note 13 9 样品反馈信息单 Sample s feedback list 14

3 1/14 1 外形尺寸与内部结构 Dimension & Inner-configuration: 单位 : inch(mm) W T M M 型号 Size L W T M 0402 (1005) 0.040±0.006 (1.0±0.15) 0.020±0.004 (0.5±0.10) 0.020Max. (0.5Max.) 0.004Min. (0.10Min.) 0603 (1608) 0.063±0.006 (1.6±0.15) 0.031±0.006 (0.8±0.15) 0.037Max. (0.95Max.) 0.004Min. (0.10Min.) 0805 (2012) 0.08±0.008 (2.0±0.2) 0.05±0.008 (1.25±0.2) 0.05Max. (1.25Max.) 0.006Min. (0.15Min.) 1206 (3216) 0.126±0.008 (3.2±0.20) 0.063±0.008 (1.6±0.2) 0.060Max. (1.50Max.) 0.008Min. (0.20Min.)

4 2/14 2 产品规格型号表示方法 Ordering Information HLCMF X XXX X XXXX X X X X 产品代号 : 表示片式负温度系数热敏电阻 Product Code:Chip NTC Thermistor 2 尺寸规格代码 Size Code 代码 /Code D A B C 尺寸 ( 英制 ) Size(Inches) 标称电阻值为 25 时的零功率电阻, 单位为 Ω, 前二位为有效数字, 第三位数字表示有效数字后 0 的个数. Rated zero-power resistance(r 25 ) Unit: Ω The first two are significant figure of resistance and the third one expresses number of following zeros. 4 阻值公差代码 (%) Tolerance of R 25 (%) 代码 / Code E F G H J K X 阻值公差 Tolerance of R 25 ±0.5 ±1.0 ±2.0 ±3.0 ±5.0 ±10.0 特殊公差 5 B 值常数, 单位为 K B value constant Unit:K 6 B 值精度代码 (%) Tolerance of B value(%) 代码 / Code E F G H J X B 值公差 Tolerance of B value ±0.5 ±1.0 ±2.0 ±3.0 ±5.0 特殊公差 7 B 值温度代码 ( ) / B value Temperature Code 代码 / Code A B C D E F G H M N T 1 /T 2 25/50 25/ 85 0/25 0/50 0/100 0/80 25/100-18/25-20/25 5/25 8 端电极材料代号 :N 三层电极 Termination Code: N Nickel Barrier 9 包装方式代码 :T 编带包装 B 散包装 Packaging style Code: T Tape & Reel B Bulk

5 3 电性能参数表 Electrical Characteristics List 型号规格 Part Number 客户料号 Customer no. R25(KΩ) 3/14 B25/50(k) HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT HLCMFD ANT 表示阻值的误差 shows the resistance deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%) 表示 B 值的误差 shows the B-constant deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%)

6 3 电性能参数表 Electrical Characteristics List 型号规格 Part Number 客户料号 Customer no. R25(KΩ) 4/14 B25/50(k) HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT HLCMFA ANT 表示阻值的误差 shows the resistance deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%) 表示 B 值的误差 shows the B-constant deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%)

7 3 电性能参数表 Electrical Characteristics List 型号规格 Part Number 客户料号 Customer no. R25(KΩ) 5/14 B25/50(k) HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT HLCMFB ANT CMFB ANT HLCMFB ANT 表示阻值的误差 shows the resistance deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%) 表示 B 值的误差 shows the B-constant deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%)

8 3 电性能参数表 Electrical Characteristics List 型号规格 Part Number 客户料号 Customer no. R25(KΩ) 6/14 B25/50(k) HLCMFC ANT HLCMFC ANT HLCMFC ANT HLCMFC ANT HLCMFC ANT HLCMFC ANT HLCMFC ANT 表示阻值的误差 shows the resistance deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%) 表示 B 值的误差 shows the B-constant deviation(f 级 ±1% G 级 ±2% H 级 ±3% J 级 ±5% K 级 ±10%)

9 7/14 4 可靠性试验项目 Reliability Testing Items 序号 NO. 项目 Item 标准 Standard 测试方法 Test Method 1 2 工作温度范围 Operating Temperature Range 可焊 Solder ability -40 ~+120 至少 90% 端电极表面被焊锡覆盖 At least 90% of terminal electrode should be covered with solder 预热温度 :100 ~150 预热时间 :2~3Min. 焊锡温度 : 255±5 浸锡时间 : 5±0.5s Preheating Temp. :100 ~150 Preheating Time: 2~3min. Soldering Temp. : 255±5 Immersion Time: 5±0.5s 3 耐焊接热 Resistance to Soldering 至少 75% 的焊锡覆盖在端电极表面, 无可见机械损伤 R25 变化率小于 ±5% B 值 (B25/50) 变化率小于 ±2% At least 75% of terminal electrode should be covered with solder. No mechanical damage. R 25 change shall be less than±5%; B-constant(B 25/50 )change shall 预热温度 :100 ~150 预热时间 :2~3Min. 焊锡温度 : 285±5 浸锡时间 : 10±0.5s Preheating Temp. : 100 ~150 Preheating Time:2~3min. Soldering Temp. : 285±5 Immersion Time: 10±1s be less than ±2%. 瓷体及端头均不受破坏 Ceramic and termination shall not be damaged. 4 端电极强度 External Electrode Strength 类型 Type 推力 (N) Force (N) 时间 (s) Time (s) ± ± ± ±1

10 4 可靠性试验项目 Reliability Testing Items 8/14 序号 NO. 5 项目 Item 标准 Standard 测试方法 Test Method 振动 Vibration 无可见机械损伤 ; R25 变化率小于 ±5%; B 值 (B25/50) 变化率小于 ±2%. Novisible mechanical damage; R 25 change shall be less than±5%; B-constant(B 25/50 )change shall be less than ±2%. 振动频率范围 :10 ~55Hz 全振幅 : 1.52mm 时间 :X\Y\Z 轴各 2hrs Frequency:10 ~55Hz Amplitude: 1.52mm Time: Vibrated for a period of 2hrs,in three directions perpendicularly intersecting each other. 无可见机械损伤 ; 6 抗弯强度 Resistance to flexure R25 变化率小于 ±5%; B 值 (B25/50) 变化率小于 ±2%. No visible mechanical damage; R 25 change shall be less than ±5%; B-constant(B 25/50 )change shall be less than ±2%. 规格 Size code 弯曲度 h (mm) Camber (mm) 条件 : 测试基板 (PCB) 施压速度 :0.5mm/s Condition: print circuit board. Pressing speed: 0.5 mm/s 无可见机械损伤 ; 从高度为 1 米的空中自由落到混凝土地板, R25 变化率小于 ±5%; 重复 10 次跌落 B 值 (B25/50) 变化率小于 ±2%. Drop 10 times on a concrete floor from a high 7 Drop No visible mechanical damage; of 1m. R 25 change shall be less than±5%; B-constant(B 25/50 )change shall be less than ±2%. 外观无可见损伤 ; 温度 :125±2 ( 无负荷 ) R25 变化率小于 ±5%; 试验时间 :500±2hrs 耐高温 B 值 (B25/50) 变化率小于 ±2%. Temp.:125±2 (No Load) 8 Resistance to High No visible damage; Time:500±2hrs Temperature R 25 change shall be less than±5%; B-constant(B 25/50 )change shall be less than ±2%.

11 9/14 4 可靠性试验项目 Reliability Testing Items 序号 NO. 项目 Item 标准 Standard 测试方法 Test Method 耐低温外观无可见机械损伤 ; R25 变化率小于 ±5% B 值 (B25/50) 变化率小于 ±2% 在 -40±2 的条件下放置 500±2hrs Temp.:-40±2 Time :500±2hrs 9 Resistance to High Temperature No visible mechanical damage; R 25 change shall be less than±5%; B-constant(B 25/50 )change shall be less than ±2%. 外观无可见机械损伤 ; 在下列条件下放置 500±2hrs R25 变化率小于 ±5%; 温度 :55±2 10 耐潮湿 Resistance to Humidity B 值 (B25/50) 变化率小于 ±2%. No visible mechanical damage; R 25 change shall be less than±5%; 湿度 :90~95%RH Temp.:55±2 Humidity:90~95%RH B-constant(B 25/50 )change shall Time:500±2hrs be less than ±2%. 无负荷, 在下列条件循环 5 次 cycles without load 外观无可见损伤 ; R25 变化率小于 ±5%; 阶段 Step 温度 Temp. 时间 Time (Min.) 11 温度循环 Temperature cycling B 值 (B25/50) 变化率小于 ±2% No visible damage; ±3 2 室温 /Room Temp 10± ±3 R 25 change shall be less than ±5%; 4 室温 /Room Temp 10±2 B-constant(B 25/50 )change shall be less than ±2%.

12 10/14 5 产品包装 Packaging 5.1 外包装 Outer Package 包装 1: 数量 5 卷 Type 1:Box Quantity 5 reels 包装 2: 数量 12 盒 Type 2:Case Quantity12 boxes 5.2 卷标及标识 Label and Mark 纸带胶盘上有卷标, 包括以下内容 The label on reel should contain these information: 1 型号规格 Part No. 2 标称电阻及 B 值 Nominal Resistance and B-constant 3 数量 Quantity 4 误差范围 Tolerance 5 批号 Lot No. 6 日期 Date 7QC 盖章 QC Stamper 包装盒子或箱子标识以下内容 1 型号规格 Part No. 2 标称电阻及 B 值 Nominal Resistance and B-constant 3 数量 Quantity 4 误差范围 Tolerance 5 批号 Lot No. 6 日期 Date 7QC 盖章 QC Stamper

13 11/14 6 推荐焊接条件 Recommend Soldering Conditions 6.1 焊接条件 Recommended Soldering Condition 回流焊 Re-flow soldering 波峰焊 Wave soldering 手工焊接 Iron soldering 烙铁头温度 :350 Max Temp. of iron-tip:350 Max 烙铁功率 : 30W Max Iron wattage: 30W Max 烙铁停留时间 :5s Max Soldering time:5s sec Max 注意 : 烙铁头不得与瓷体直接接触 Caution: Do not allow the iron-tip to directly touch the ceramic body 助焊剂 Flux. 25% 松香,75% 乙醇 /25% Rosin,75% Alcohol 清洗条件 Cleaning 清洗时间 :1 分钟 Time:1min 超声波功率 : 最大为 200W/L Power of ultrasonic Cleaner: 200W/L Max 使用温度范围 :-40 ~+120 Temperature range:-40 ~+120

14 12/14 6 推荐焊接条件 Recommend Soldering Conditions 6.2 PC 板的设计 1 当片式 NTCR 被安装在 PC 板上后, 所使用的焊料的量 ( 焊盘的大小 ) 会直接影响到片式 NTCR 的性能, 因此在设计基板时, 必须慎重考虑焊盘的大小和配置, 这些对组成基板的焊料的量有着决定的作用, 过量的焊料会影响到芯片耐机械应力的能力 2 基板配置 : 将片式 NTCR 安装在板上之后, 芯片将承受在下一加工过程中产生的机械应力, 出于这个原因, 在设计焊盘和片式 NTCR 的位置时, 应注意考虑将应力减少到最低点 6.3 自动安装应考虑到的问题 1 在将片式 NTCR 安装在 PC 板上时, 不能让其承受过量的冲击力 2 应定期对安装机器进行维护和检查 3 当 PC 板沿着接缝孔切割开时, 片式 NTCR 所受机械应力的大小因使用的方法不同而不同以下方法按应力从小到大进行排列 : 推板割裂 V 形凹槽接缝孔因此任何理想的片式 NTCR 的布局必须考虑到 PC 板的分割方法 6.4 焊膏的印刷 1 焊膏的印刷厚度建议在 150μm~200μm 2 焊接后, 爬锡高度为 0.2mm 至本产品的厚度 3 过多的焊料将给本产品过大的机械应力, 这些应力将导致断裂或机械损伤, 也可能破坏产品的电性能 6.5 粘合剂作用和处理 1 在流体焊过程中, 如果黏性不好或粘合剂不够坚硬, 可能会导致产品和底板松散连接 2 黏胶的黏性太低将导致焊接后产品在板上滑动 6.2 PCB design 1 When chip thermistors are mounted on a PCB, the amount of solder used(size of fillet) can directly affect thermistor performance Therefore, when design land- patterns it is necessary to consider the appropriate size and configuration of the solder pads, which determines the amount of solder necessary to form the fillets. Excess solder can affect the ability of chips to withstand mechanical stress. 2 Pattern configurations: After chip thermistor have been mounted on the board, chips can be subject to mechanical stresses in subsequent manufacturing process, for this reason, planning pattern configurations and the position of SMD thermistors should be carefully performed to minimize stress. 6.3 Considerations for automatic placement. 1 Excessive impact load should not be imposed on the thermistor when mounting on the PCB. 2 The maintenance and inspection of the mounting devices should be conducted periodically. 3 When beating PCB along their perforations, the amount of mechanical stress on the thermistor can vary according to the method used.the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. Thus, any ideal SMD thermistor layout must also consider the PCB splitting procedure. 6.4 printing solder paste 1 Recommendable thickness of solder paste printing should from 150μm to 200μm. 2 After soldering, the solder fillet shall be a height from 0.2mm to the thickness of chip thermistor. 3Too much solder gives too strong mechanical stress to chip thermistor, such stress may cause cracking or any mechanical damage. And also, it can destroy the electrical performance of this product. 6.5 Adhesive Application and curing 1 If insufficient adhesive is applied or if the adhesive is not sufficiently hardened this product may have a loose contact with the land, during flow soldering. 2 Too low viscosity of adhesive causes chip thermistor to slip on broad, after mounting.

15 13/14 7 贮存条件 Storage Conditions 8 注意事项 Note 7 贮存条件 1 贮存条件 : 温度 :-10~40 Temperature: -10 ~40 2 相对湿度 :45~75% Humidity: 45~75 RH 3 保存期限 : 在交付六个月内使用本产品, 如果超过六个月或更长时间, 使用前请检查可焊性 Storage Term: Use this product within 6 months after delivery. If 6 months or more elapsed, please check the solderability before use. 4 打开包装后的存放 : 拆包装后, 迅速地重新封好或将产品放入有干燥剂的密封容器内 Handling after unpacking: After unpacking, reseal promptly this product or store it in a sealed container with a drying agent. 5 贮存地点 : 存放在没有腐蚀性气体 (SO x Cl 等 ) 的地方 ; 避免日光直接照射 Storage place: store this product in no corrosive gas (SOx, Cl, etc).avoid direct sunlight.

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<4D F736F F D204E5443CFB5C1D0BBAFB3D0C8CFCAE92DA3A D0C2B0E6A3A92E646F63> 承认书 APPROVAL SHEET 客户名称 : Customer Name 产品名称 : Product Name 制造商料号 : Manufacturer P/N 客户料号 : Customer P/N 版本号 : Version No. 15.01 片式负温度系数热敏电阻器 CHIP NTC THERMISTOR CMF 系列标准类型 : 标准品 Standard product Standard