EMI/EMC Solution

Transcription

1 E M I / E M C S O L U T I O N 業務據點 / SALES SITE HEADQUATES / CHUNAN PLANT 9 苗栗縣竹南鎮公義里 鄰科義街 號 No., Ke-Yi St., Chunan, Miaoli 9, Taiwan TEL: FAX: info@inpaq.com.tw http: // http: // SHENHEN OFFICE 廣東省深圳市福田區車公廟泰然工業區 棟 室 oom, Bld., Tairan Industrial one, CheGongMiao, FuTian District, Shenzhen City, Guangdong Province, China TEL: FAX: TAIPEI OFFICE 台北縣汐止市大同路二段 7 號 樓 ( 遠東科技中心 B 棟 F) F, No.7, Sec., Datong d., Sijhih City, Taipei County, Taiwan TEL: FAX: ext: (eceiver's Extension) KOEA OFFICE aemian Seocho Univill, -, Secho-Dong, Secho_gu, Seoul, Korea -7 TEL: FAX: SUHOU OFFICE 上海市徐匯區中山西路 號兆豐環球大廈 樓 D 座 No. hongshan West oad, th Floor, hao Feng Universe Building Block D,Xuhui District, Shanghai City, Jiangsu Province, China TEL: FAX: +--- USA OFFICE Echo Brook oad, ochester, NH 9, U.S.A. TEL: +--- FAX: INPAQ TECHNOLOGY CO., LTD. 佳邦科技股份有限公司 Jan.

2 CONTENTS EMI Filter LC Filter Array LFA Series - Thin Film Common Mode Filter TCF Series - Chip Common Mode Filter MCM Series 7- Chip Common Mode Filter Array MCA Series - Wire-wound Common Mode Filter WCM Series - Multilayer Chip Inductor Chip Ferrite Inductor MFI Series 7-9 High Frequency Chip Ceramic Inductor MCI Series - Wire-wound Ceramic Chip Inductor WCI Series 9- Multilayer Chip Bead Chip Ferrite Bead for GHz ange MGB Series - Chip Ferrite Bead MCB-S/B Series -9 Chip Ferrite Bead For High Speed MCB-H/U Series - High Current Chip Ferrite Bead MHC Series -7 Chip Ferrite Bead Array MA-S Series -7 *Specifications subject to change without notice. Please contact INPAQ for further information.

3 EMI / EMC Solution Product ID Product Name Series Size (EIA) Size (EIAJ) LC Filter Array LFA Thin Film Common Mode Filter TCF Chip Common Mode Filter (B type) MCM Chip Common Mode Filter Array MCA Wire-wound Common Mode Filter WCM Chip Ferrite Inductor MFI High Frequency Chip Ceramic Inductor MCI Wire-wound Ceramic Chip Inductor WCI Chip Ferrite Bead for GHz ange MGB Chip Ferrite Bead (S series, B series) (H series, U series) High Current Chip Ferrite Bead MCB MHC Chip Ferrite Bead Array (S series) MA

4 LC Filter Array LFA Series Features SMD Type, elements in one chip, size, suitable for high-density circuit design Construction of dielectric and magnetic materials EMI filtering--steep insertion loss characteristics and removes noise over a wide range Small size and low profile PI(π) type structure filter Applications For cellular phone, digital AV equipment, digital camera, PDA, and MP player LCD module/display Wireless handsets Lap top computer, desk top computer How to Order LFA P P Series Type Size (inch): Length x Width (/EIA) Type: P PI (π)type Cut-off frequency (MHz): XX x N, ex. : MHz= x MHz Packaging: P Embossed paper tape, 7" reel Thickness:.mm ;.mm Dimensions E F C D 7 A 9 B H G Size (EIA) () A.±. B.±. C.±. D.±. E.±. F.±..±. G.±. H.±. Unit:mm

5 LC Filter Array LFA series Specifications Electrical Property Part Number Cut-Off Impedance Frequency at DC Attenuation Max ated Capacitance ated Voltage ated Withstand ated Insulation esistance Part Number Typical (Ω) (Ω) Typical Max (ma) (eference) (V) Current Voltage Voltage Min. (MΩ) (min) -db ~9 MHz LFAPP MHz pf -db ~ MHz ma V MΩ -db LFAPP MHz pf 9~ MHz LFAPP MHz -db ~ MHz 7pF Operation Temperature: - ~ + C Schematics G G Insertion Loss vs. Frequency Characteristics Measurement circuit Sample ohm ohm V.V S.G. Typical insertion loss Insertion Loss (db) LFAPP (7pF) LFAPP (pf) LFAPP (pf) - Package Size (EIA) () Standard packing quantity (pcs/reel),

6 Thin Film Common Mode Filter TCF Series Features TCF series is a thin film common mode filter designed to suppress common mode noise for high speed differential data lines, such as USB., IEEE 9, LVDS, DVI, HDMI, and S-ATA. Applications TCF Series can be used in personal computers, note books, LCD monitors, LCD/PDP/DLP TVs, Blu-ray/DVD players, personal handheld equipments, etc. How to Order TCF H 9 A Series Type: Thin Film Common Mode Filter Chip Size(EIA):, Speed Identification Code: H=High Speed Impedance(at MHz): = Ω, 9= 9Ω Line Code: = lines,= lines Specialized Specification Code Dimensions TCF series E TCF series E B B F F A A C C D D Unit:mm Size (EIA) () () A.±..±. B.±..±. C.±..±. D.±..±. E.±..±. F.±..±.

7 Thin Film Common Mode Filter TCF Series Specifications Part Number ated ated Lead Soldering Voltage Current Temperature Common Mode Impedance (at MHz) Cut-off DC Insulation Frequency esistance esistance Symbol VDC IDC TSOL Typ. Typ. Typ. Min. Units V ma C Ω GHz Ω MΩ TCFHA (NEW) ( sec.) TCFH9A (NEW) ( sec.) 9 TCFHA (NEW) ( sec.) TCFH9A (NEW) ( sec.) 9 Typical Characteristics TCFHA, TCFHA IMPEDANCE vs. FEQUENCY CHAACTEISTICS INSETION LOSS vs. FEQUENCY CHAACTEISTICS Impedance(Ω) Common Mode S(dB) Common Mode Differential Mode - Differential Mode - Frequncy (MHz) - Frequncy (MHz) TCFH9A, TCFH9A IMPEDANCE vs. FEQUENCY CHAACTEISTICS INSETION LOSS vs. FEQUENCY CHAACTEISTICS Impedance(Ω) Common Mode S(dB) Common Mode Differential Mode - Differential Mode - Frequncy (MHz) - Frequncy (MHz) Package Size (EIA) () () Standard packing quantity (pcs/reel),,

8 Chip Common Mode Filter MCM Series Features Powerful component with composite co-fired material to solve EMI problem for high-speed differential signal transmission line as USB, IEEE9 and LVDS, without distortion to high speed signal transmission High coupling constant :.99 Small size and low profile Various common mode impedance items of 7 to ohm can be used, considering noise level and signal frequency Small dimension enable higher density packaging Applications Common mode noise suppression of signal lines in high speed and high density digital equipment such as personal computer, facsimiles, modem, and digital telephones. IEEE 9 USB. How to Order MCM B 9 H B 7 LVDS 7 Series Type Size (mm): Length x Width Material Code: B for High Speed Type Impedance Value (Ω)/±% ex.: 9Ω 9; Ω Fixed Decimal Point ated current: A=mA, B=mA, C=mA, D=mA, E=mA, F=mA G=mA, H=mA, I=mA, J=7mA, K=mA Soldering: Green Parts: B Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel 7

9 Chip Common Mode Filter MCM Series Dimensions MCM series MCM series F E B E F B A. A. C. C.. D.7. D.7..7 MCM series MCM series E E F F B B A. A. C.7. C.. D... D.7..7 Unit: mm Size (EIA) () () () () A.±..±..±..±. B.±..±..±..±. C.±..±..±..±. D.±..±..±..7±. E.±..±..±..±. F.±..±..±..±. Signal Quality Test esult differential signal.v Original USB. Signal time, ns Unequal Phase differential signal.v USE MCMB9G time, ns differential signal.v USE MCMB9H time, ns

10 Chip Common Mode Filter MCM Series Specifications Part Number Impedance at at DC Max DC Max. ated Current ated Current ated Voltage ated Withstand Voltage Insulation Withstand esistance Mhz MHz (Ω) (Ω) (Ω) (Ω) Max (ma) (ma) (V) Voltage (V) (V) Voltage Min. (MΩ) (V) (EIA ) MCMBFBP. MCMB7FBP 7. MCMB9FBP 9. MCMBFBP. (EIA ) MCMB7GBE 7. MCMB9GBE 9. MCMBGBE. MCMBGBE. MCMBGBE. MCMBFBE. (EIA ) MCMB9GBE 9. MCMBGBE. MCMBGBE. MCMBFBE. (EIA ) MCMB9HBE 9. MCMBHBE. MCMBGBE. MCMBGBE. 9

11 Chip Common Mode Filter MCM Series Characteristics MCMB series MCMB series Common Mode Common Mode Imp. (ohm) MCMB Imp. (ohm) MCMB MCMB MCMB MCMB9 MCMB7 MCMB Differential Mode MCMB MCMB9 MCMB7 Differential Mode Freq (MHz) Freq (MHz) MCMB series MCMB series Common Mode Common Mode Imp. (ohm) MCMB MCMB MCMB MCMB9 Imp. (ohm) MCMB MCMB MCMB MCMB9 Differential Mode Differential Mode Freq (MHz) Freq (MHz)

12 Chip Common Mode Filter MCM Series Insertion Loss vs. Frequency Characteristics MCMB series MCMB series Differential Mode 7 9 Differential Mode 7 9 Insertion loss (db) - - Common Mode 7 9 Insertion loss (db) - - Common Mode Freq (MHz) - Freq (MHz) MCMB series MCMB series MCMB series Differential Mode 9 Differential Mode 9 Insertion loss (db) Common Mode 9 Insertion loss (db) Common Mode 9 - Freq (MHz) - Freq (MHz) Package Size (EIA) () () () () Standard packing quantity (pcs/reel),,,

13 Chip Common Mode Filter Array MCA Series Features Powerful component with composite co-fired material to solve EMI problem for high-speed differential signal transmission line as USB, IEEE9 and LVDS, because of no distortion to high speed signal transmission High coupling constant :.99 Small size and low profile Various common mode impedance items of 9 to ohm can be used, considering noise level and signal frequency Small dimension enable higher density packaging Applications Common mode noise suppression of signal lines in High speed and high density digital equipment such as personal computer and facsimiles, modem, digital telephones. IEEE 9 USB. How to Order MCA B 9 G B E 7 LVDS 7 Series Type Size (mm): Length x Width Material Code: B for High Speed Type Impedance Value (Ω)/±% Fixed Decimal Point ated current: ex.: 9Ω 9; Ω A=mA, B=mA, C=mA, D=mA, E=mA, F=mA G=mA, H=mA, I=mA, J=7mA, K=mA Soldering: B Lead-Free for whole chip Packaging: E Embossed plastic tape, 7" reel

14 Chip Common Mode Filter Array MCA Series Dimensions MCA series MCA series F E F E B B 7 A A C.7. C.. D.. D.. Unit:mm Size(EIA) () () A.±..±. B.±..±. C.±..±. D.±..±. E.±..±. F.±..±. Signal Quality Test esult differential signal.v Original USB. Signal time, ns differential signal.v USE MCAB9G time, ns differential signal.v USE MCAB9G time, ns Specifications Part Number Impedance at DC Max DC ated Current ated ated Voltage ated Withstand Insulation Withstand esistance Mhz at Mhz(Ω) (Ω) Max. (Ω) Max (ma) Current (ma) (V) Voltage (V) (V) Voltage Min. (MΩ) (V) (EIA ) MCAB9GBE 9. MCABFBE. MCABFBE.7 MCABEBE.7 (EIA ) MCAB9GBE 9. MCABFBE. MCABFBE. MCABFBE.

15 Chip Common Mode Filter Array MCA Series Characteristics MCAB series MCAB series Common Mode Common Mode Imp.(ohm) MCAB MCAB MCAB MCAB9 Imp.(ohm) MCAB MCAB MCAB MCAB9 Differential Mode Differential Mode Freq(MHz) Freq(MHz) Insertion Loss vs. Frequency Characteristics MCAB series MCAB series Differential Mode 9 9 Differential Mode - - Insertion loss(db) - Common Mode 9 Insertion loss(db) - Common Mode Freq(MHz) - Freq(MHz) Package Size (EIA) () () Standard packing quantity (pcs/reel),,

16 Wire-wound Common Mode Filter WCM Series Features Powerful component with composite co-fired material to solve EMI problem for high-speed differential signal transmission line as USB, IEEE9 and LVDS, without distortion to high speed signal transmission High coupling constant :.99 Small size and low profile Various common mode impedance items of 7 to ohm can be used, considering noise level and signal frequency Small dimension enable higher density packaging Applications Common mode noise suppression of signal lines in high speed and high density digital equipment such as personal computer, facsimiles, modem, and digital telephones. How to Order WCM B 9 B E 7 7 Series Name Size Code: the first two digitals: length (mm), the last two digitals: width (mm) Material Code Impedance (Ω) ±% ex.: 9=9Ω ; =Ω Fixed Decimal Point Soldering: Green Parts: B Lead-Free for whole chip Packaging: E - Embossed plastic tape, 7" reel. Dimensions Unit:mm Size (EIA) B H () () A.±..±. B.±..±. C.±..±. D.. E.. F.. G.. H.. I.. Specifications Part Number Test Freq. Impedance DC ated Current ated Voltage (MHz) (Ω) ±% Max. (Ω) (ma) (V) Insulation esistance Min. (MΩ) B (EIA ) WCMB9BE 9. WCMBBE. 7 WCMBBE. WCMBBE. H (EIA ) WCMH9BE. 7 General Technical Data Operating Temperature ange Storage Condition - C ~ + C C ~ C and % H (For eference)

17 Wire-wound Common Mode Filter WCM Series Characteristics WCMB9BE WCMBBE Common Mode Common Mode IMPEDANCE (Ω) Normal Mode IMPEDANCE (Ω) Normal Mode. FEQUENCY (MHz) WCMBBE. FEQUENCY (MHz) WCMBBE Common Mode Common Mode IMPEDANCE (Ω) Normal Mode IMPEDANCE (Ω) Normal Mode. FEQUENCY (MHz) WCMH9BE. FEQUENCY (MHz) Common Mode IMPEDANCE (Ω) Normal Mode. FEQUENCY (MHz) Package Size (EIA) () Standard packing quantity (pcs/reel),

18 Chip Ferrite Inductor MFI Series Features The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic leakage and interference Allow for higher mounting density Applications F and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and low-voltage power supply modules. How to Order MFI 7 K B Series type Chip size(mm) : Length x Width Inductance (µh): means decimal point Ex.:.7µH 7 Tolerance : J±%, K=±%, M=±% Soldering : Green Parts: B Lead-Free for whole chip Packaging : P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel Dimensions Unit:mm Size (EIA) () _9 () _ () () L.±..±..±..±. W.±..±..±..±. T.±..9±..±..±. E.±..±..±..±. The thickness of specification under.7µh is.9mm +/-.mm 7

19 Chip Ferrite Inductor MFI Series Specifications Part Number Inductance & Tolerance (µh) Q Min. Test Freq (MHz) SF (MHz) Min. DC Max. (Ω) ated Current Max.(mA) (EIA ) Packaging Code: P MFI7MB_.7±%. MFIMB_.±%. MFIMB_.±%. MFIMB_.±%. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFIKB_.±% 9. MFIKB_.±% 7. MFI7KB_.7±%. MFIKB_.±%. MFI9KB_.9±%. MFI7KB_.7±%. MFIKB_.±%. MFIKB_.±%.7 MFIKB_.±% 9. MFIKB_.±%. MFIKB_.±% 7. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFI7KB_.7±%. MFIKB_.±%. MFI9KB_.9±%. MFI7KB_.7±%. MFIKB_.±%. MFIKB_.±%.9 MFIKB_.±%. MFIKB_ ±% 7. (EIA ) Packaging Code: P, E MFI7MB_.7±%. MFIMB_.±%. MFIMB_.±%. MFIMB_.±% 7. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFIKB_.±% 9. MFI7KB_.7±% 7. MFIKB_.±%. MFI9KB_.9±%. MFI7KB_.7±%. MFIKB_.±%.7 MFIKB_.±%. MFIKB_.±%.

20 Chip Ferrite Inductor MFI Series Part Number Inductance & Tolerance (µh) Q Min. Test Freq (MHz) SF (MHz) Min. DC Max. (Ω) ated Current Max.(mA) (EIA ) Packaging Code: P, E MFIKB_.±%. MFIKB_.±% 7. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFI7KB_.7 ±%.7 MFIKB_.±%. MFI9KB_.9±%.9 MFI7KB_.7±%. MFIKB_.±% 7.9 MFIKB_.±%. MFIKB_.±%. MFIKB_ ±%. MFIKB_ ±%. MFIKB_ ±%. MFIKB_ ±%.9 MFIKB_ ±% 9. (EIA ) Packaging Code: E MFI7MB_.7±%. MFIMB_.±%. MFIMB_.±%. MFIMB_.±% 7. MFIKB_.±% 7. MFIKB_.±%. MFIKB_.±%. MFIKB_.±%. MFIKB_.±% 7. MFI7KB_.7±%. MFIKB_.±%. MFI9KB_.9±%. MFI7KB_.7±%. MFIKB_.±%.7 MFIKB_.±%. MFIKB_.±%.9 MFIKB_.±% 7. MFIKB_.±% 7. MFIKB_.±% 9. MFIKB_.±%. MFIKB_.±%. MFI7KB_.7±%. MFIKB_.±%.7 MFI9KB_.9±%. MFI7KB_.7±%.9 MFIKB_.±%. MFIKB_.±% 9.9 MFIKB_.±%. MFIKB_ ±%. MFIKB_ ±%. MFIKB_ ±%.7 MFIKB_ ±%.7 MFIKB_ ±% 9.9 9

21 Chip Ferrite Inductor MFI Series General Dimensions Technical Data Operating Temperature ange Storage Condition Soldering Method - C ~ + C Less than C and 7% H eflow or Wave Soldering Characteristics MFI 7,. & INDUCTANCE vs. FEQUENCY 7 Q Q vs. FEQUENCY CHAACTEISTICS 7 G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI Q vs. FEQUENCY CHAACTEISTICS Q G G G G G G G G G G MFI & INDUCTANCE vs. FEQUENCY 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G

22 Chip Ferrite Inductor MFI Series MFI & 7 INDUCTANCE vs. FEQUENCY 7 Q MFI & 9 INDUCTANCE vs. FEQUENCY 9 Q Q vs. FEQUENCY CHAACTEISTICS 7 G G G G G G G G G G Q vs. FEQUENCY CHAACTEISTICS 9 G G G G G G G G G G MFI 7, & INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q 7 7 G G G G G G G G G G 9 7 INDUCTANCE vs. FEQUENCY MFI,, & Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G 9 7 INDUCTANCE vs. FEQUENCY 7 MFI, & Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G 7

23 Chip Ferrite Inductor MFI Series 7 9 MFI, 9 & 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q 7 9 G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI K Q vs. FEQUENCY CHAACTEISTICS Q 7 G G G G G G G G G G MFI K INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI K Q G G G G G 9 7 Q vs. FEQUENCY CHAACTEISTICS G G G G G MFI INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G

24 Chip Ferrite Inductor MFI Series MFI 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q G G G G G G G G G G MFI INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q G G G G G G G G G G MFI & INDUCTANCE vs. FEQUENCY 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G MFI INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI,, 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G

25 Chip Ferrite Inductor MFI Series MFI INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G MFI 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G MFI 9 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G MFI 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G

26 Chip Ferrite Inductor MFI Series INDUCTANCE vs. FEQUENCY G G G G G MFI Q 9 7 Q vs. FEQUENCY CHAACTEISTICS G G G G G 9 7 INDUCTANCE vs. FEQUENCY G G G G G MFI,, & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G INDUCTANCE vs. FEQUENCY MFI, & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G MFI 7,, 9 & 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q 7 G G G G G G G G G G MFI, & INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G

27 Chip Ferrite Inductor MFI Series INDUCTANCE vs. FEQUENCY MFI, & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G 9 7 INDUCTANCE vs. FEQUENCY G G G G G MFI & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G MFI 7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G MFI & INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q G G G G G G G G G G MFI, & INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q G G G G G G G G G G

28 Chip Ferrite Inductor MFI Series INDUCTANCE vs. FEQUENCY MFI Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G INDUCTANCE vs. FEQUENCY 7 G G G G G MFI,, 7 & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS 7 G G G G G INDUCTANCE vs. FEQUENCY 7 9 INDUCTANCE vs. FEQUENCY MFI 9, 7, & Q vs. FEQUENCY CHAACTEISTICS 9 7 Q 9 7 Q 7 9 G G G G G G G G G G MFI & Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G 9 7 MFI, & INDUCTANCE vs. FEQUENCY 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G 7

29 Chip Ferrite Inductor MFI Series INDUCTANCE vs. FEQUENCY 7 MFI & Q Q vs. FEQUENCY CHAACTEISTICS 7 G G G G G G G G G G INDUCTANCE vs. FEQUENCY 7 9 G G G G G MFI, 9 & Q 9 Q vs. FEQUENCY CHAACTEISTICS 7 G G G G G INDUCTANCE vs. FEQUENCY MFI, & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G INDUCTANCE vs. FEQUENCY MFI & 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G MFI & INDUCTANCE vs. FEQUENCY 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G

30 Chip Ferrite Inductor MFI Series INDUCTANCE vs. FEQUENCY MFI 9 7 Q Q vs. FEQUENCY CHAACTEISTICS G G G G G G G G G G Package 9 Size (EIA) () () () () Standard packing quantity (pcs/reel),,,, 9

31 High Frequency Chip Ceramic Inductor MCI Series Features Particular ceramic material and coil structure provide high frequency application range up to GHz High Q at high frequency Small size and low profile Available in various sizes Excellent solderability and heat resistance Applications F and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and lowvoltage power supply modules. How to Order MCI HQ 9N J H B P 7 7 Series type Chip size(mm) : Length x Width HQ High Q Value Inductance (nh): N means decimal point Ex.: 9nH 9N Tolerance : S=±.nH, J=±%, K=±% Mark : H-/ Mark, M-/ Mark, N-No Mark Soldering : Green Parts: B Lead-Free for whole chip Packaging : P Embossed paper tape, 7" reel Dimensions Unit:mm Size (EIA) () () () L.±..±..±. W.±..±..±. T.±..±..±. E.~..~..~.

32 High Frequency Chip Ceramic Inductor MCI Series Specifications Part No. Inductance (nh) Q Min. Test Freq Q(Typical) SF (MHz) DC (Ω) (MHz) Min. Max. ated Current Max.(mA) (EIA ) MCIHQNSHBP. 7. MCIHQNSHBP. 7. MCIHQNSHBP. 9. MCIHQNSHBP. 7.9 MCIHQNSHBP.. MCIHQN7SHBP MCIHQNSHBP. 7. MCIHQN9SHBP MCIHQN7SHBP.7 7. MCIHQNSHBP MCIHQNSHBP.. MCIHQNSHBP.. MCIHQNJHBP MCIHQNJHBP 7. MCIHQNJHBP 7.7 MCIHQNJHBP MCIHQNJHBP 9.9 MCIHQNJHBP. MCIHQ7NJHBP 7. MCIHQNJHBP 7 7. MCIHQ9NJHBP 9. (EIA ) MCIHQNSHBP.. MCIHQNSHBP.. MCIHQNSHBP. 7. MCIHQNSHBP MCIHQNSHBP.. MCIHQNSHBP.. MCIHQNSHBP MCIHQNSHBP MCIHQNSHBP. 9. MCIHQNSHBP MCIHQN7SHBP.7.7 MCIHQNSHBP MCIHQNSHBP MCIHQNSHBP.. MCIHQN9SHBP.9 7. MCIHQNSHBP.. MCIHQN7SHBP MCIHQNSHBP. 9.7 MCIHQNSHBP..7 MCIHQNJHBP MCIHQNJHBP MCIHQNJHBP. 9.7 MCIHQNJHBP 7 7. MCIHQNJHBP MCIHQNJHBP 7. MCIHQNJHBP 9. MCIHQNJHBP 9.

33 High Frequency Chip Ceramic Inductor MCI Series Part No. Inductance (nh) Q Min. Test Freq Q(Typical) SF (MHz) DC (Ω) (MHz) Min. Max. ated Current Max.(mA) (EIA ) MCIHQ7NJHBP MCIHQNJHBP 9 9. MCIHQ9NJHBP 9 -. MCIHQ7NJHBP MCIHQNJHBP 9-7. MCIHQNJHBP 9-7. MCIHQNJHBP MCIHQJHBP - -. MCIHQJHBP (EIA ) MCIHQNSHBP MCIHQNSHBP. 9. MCIHQNSHBP MCIHQNSHBP.. MCIHQNSHBP. 7. MCIHQN7SHBP.7. MCIHQNSHBP. 9. MCIHQN9SHBP MCIHQN7SHBP MCIHQNSHBP. 7. MCIHQNJHBP MCIHQNJHBP MCIHQNJHBP 7 7. MCIHQNJHBP 7. MCIHQNJHBP 7. MCIHQNJHBP. MCIHQNJHBP 9. MCIHQ7NJHBP 7 7. MCIHQNJHBP 7 -. MCIHQ9NJHBP MCIHQ7NJHBP MCIHQNJHBP MCIHQNJHBP - 7. MCIHQNJHBP MCIHQJHBP MCIHQJHBP MCIHQJHBP MCIHQJHBP MCIHQJHBP MCIHQ7JHBP General Technical Data Operating Temperature ange Storage Condition Soldering Method - C ~ + C (: - C~+ C) Less than C and 7% H eflow or Wave Soldering

34 High Frequency Chip Ceramic Inductor MCI Series Characteristics INDUCTANCE (nh) 9 7 INDUCTANCE vs. FEQUENCY N N N MCIHQ N, N, N 9 7 Q Q vs. FEQUENCY CHAACTEISTICS N N N INDUCTANCE (nh) 9 7 INDUCTANCE vs. FEQUENCY N N N7 MCIHQ N, N, N7 Q 9 7 Q vs. FEQUENCY CHAACTEISTICS N N N7 INDUCTANCE (nh) INDUCTANCE vs. FEQUENCY N9 N MCIHQ N, N9 Q Q vs. FEQUENCY CHAACTEISTICS N9 N INDUCTANCE (nh) INDUCTANCE vs. FEQUENCY N7 N N MCIHQ N7, N, N Q Q vs. FEQUENCY CHAACTEISTICS N N N7 INDUCTANCE (nh) INDUCTANCE vs. FEQUENCY N N N MCIHQ N, N, N Q Q vs. FEQUENCY CHAACTEISTICS N N N

35 High Frequency Chip Ceramic Inductor MCI Series MCIHQ N, N INDUCTANCE (nh) INDUCTANCE (nh) INDUCTANCE (nh) INDUCTANCE (nh) INDUCTANCE (nh) INDUCTANCE vs. FEQUENCY N N INDUCTANCE vs. FEQUENCY N N INDUCTANCE vs. FEQUENCY 7N N 9N Q Q Q Q vs. FEQUENCY CHAACTEISTICS N N INDUCTANCE vs. FEQUENCY N N N N INDUCTANCE vs. FEQUENCY N N N MCIHQ N, N MCIHQ 7N, N, 9N MCIHQ N, N, N, N Q Q MCIHQ N, N, N 9 7 Q vs. FEQUENCY CHAACTEISTICS N N N N N N N N N Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS 7N N 9N

36 High Frequency Chip Ceramic Inductor MCI Series INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE vs. FEQUENCY N N INDUCTANCE vs. FEQUENCY N N INDUCTANCE vs. FEQUENCY INDUCTANCE vs. FEQUENCY INDUCTANCE vs. FEQUENCY N N N9 N7 N N N7 N N N N N N N N MCIHQ N, N, N, N7 Q Q MCIHQ N, N, N, N MCIHQ N, N7, N, N MCIHQ N, N, N, N MCIHQ N, N, N Q Q Q Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS N7 N N N N N N9 N N N N7 N N N N N N N N

37 High Frequency Chip Ceramic Inductor MCI Series INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE vs. FEQUENCY N 7N N INDUCTANCE vs. FEQUENCY 7N N N 9N MCIHQ N, 7N, N, 9N Q Q MCIHQ 7N, N, N Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS 7N N N N 7N N 9N INDUCTANCE (NH) INDUCTANCE vs. FEQUENCY N MCIHQ N,, Q Q vs. FEQUENCY CHAACTEISTICS N INDUCTANCE (NH) 9 7 MCIHQ N, N, N, N INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS N N N N 9 7 Q N N N N INDUCTANCE (NH) 9 7 MCIHQ N, N7 INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS Q N N7 9 7 N7 N

38 High Frequency Chip Ceramic Inductor MCI Series INDUCTANCE (NH) MCIHQ N, N9, N7, INDUCTANCE vs. FEQUENCY Q vs. FEQUENCY CHAACTEISTICS 9 7 Q N7 N9 N N7 N9 N INDUCTANCE (NH) INDUCTANCE vs. FEQUENCY N N N MCIHQ N, N, N Q 9 7 Q vs. FEQUENCY CHAACTEISTICS N N N INDUCTANCE (NH) 9 7 INDUCTANCE vs. FEQUENCY N N N N MCIHQ N, N, N, N Q 9 7 Q vs. FEQUENCY CHAACTEISTICS N N N N INDUCTANCE (NH) INDUCTANCE (NH) 9 7 MCIHQ N, 7N INDUCTANCE vs. FEQUENCY Q 7N N INDUCTANCE vs. FEQUENCY Q 9N N MCIHQ N, 9N Q vs. FEQUENCY CHAACTEISTICS N 7N Q vs. FEQUENCY CHAACTEISTICS N 9N 7

39 High Frequency Chip Ceramic Inductor MCI Series INDUCTANCE (NH) INDUCTANCE (NH) INDUCTANCE vs. FEQUENCY 7N N INDUCTANCE vs. FEQUENCY N N MCIHQ 7N, N, N Q Q MCIHQ N,, Q vs. FEQUENCY CHAACTEISTICS Q vs. FEQUENCY CHAACTEISTICS 7N N N N INDUCTANCE (NH) 9 7 INDUCTANCE vs. FEQUENCY 7 MCIHQ,,, 7 Q Q vs. FEQUENCY CHAACTEISTICS 7 Package Size (EIA) () () () Standard Packing Quantity (pcs / reel),,,

40 Wire-wound Ceramic Chip Inductor WCI Series Features Particular ceramic material and coil structure provide high frequency application range up to GHz High Q at high frequency Small size and low profile Available in various sizes Excellent solderability and resistance Applications F and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and low-voltage power supply modules. How to Order WCI - NO J Series Name Size Code: the first two digitals: length (mm), the last two digitals: width (mm) Inductance (N=decimal point), unit: nh Tolerance: J=±%, K= ±% Dimensions TYPE A(Max.) B(Max.) C(Max.) D E F G () ref.... Unit:mm 9

41 Wire-wound Ceramic Chip Inductor WCI Series Specifications Part Number Inductance (nh) Q Min. Test Freq (MHz) S..F. (MHz) Min. DC Max. (Ω) Irms (ma) Max. Tolerance (±%) WCI-N_. 7., WCI-N9_.9.7, WCI-N_..7, WCI-N_ , WCI-N_.. 79, WCI-N7_.7., WCI-N_. 9 7., WCI-N_. 9., WCI-N9_.9 9., WCI-N_..9 7, WCI-N7_.7 77., WCI-N_.., WCI-N_.. 7, WCI-N_.. 7, WCI-N_.., WCI-7N_ 7.., WCI-N_.., WCI-N7_.7., WCI-9N_ 9.., WCI-9N_ 9.., WCI-9N_ 9.., WCI-N_ 9., WCI-N_., WCI-N_., WCI-N_., WCI-N_.7, WCI-N_., WCI-N_., WCI-9N_ 9., WCI-N_., WCI-N_., WCI-N_ 7., WCI-N_ 7., WCI-7N_ 7., WCI-N_., WCI-N_., WCI-N_., WCI-9N_ 9., WCI-N_., WCI-N_., WCI-7N_ 7., WCI-N_ 7., WCI-N_ 7.97, WCI-N_., WCI-N_., WCI-_, Test Instruments Agilent/HP 9A+ Agilent/HP 97A for L, Q Agilent /HP 7D/Agilent/HP 7ES for SF CHBC/HPB for DC Irms for C rise above C ambient OSC test level: mv Dimensions General Technical Data Operating Temperature ange Storage Condition - C ~ + C C ~ C and % H (For eference) Package Size (EIA) () Standard Packing Quantity (pcs / reel),

42 Chip Ferrite Bead for GHz ange MGB Series Features Effectively filtering capability over a wide range of frequency ( Several MHz to GHz) Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk Excellent solderability and heat resistance High reliability Applications F and wireless communication, information technology equipment which includes computer, laptop, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and Navigator systems. How to Order MGB G E B P 7 7 Series Name Size Code: the first two digitals : length(mm), the last two digitals : width(mm) Product Characteristics : G = for signal line Impedance (Ω)/±% ex.: Ω ; Ω Fixed Decimal Point ated current: C=mA, D=mA, E=mA, F=mA, G=mA, H=mA, L=mA, M=mA, N=mA Soldering: Green Parts: B- Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel Dimensions Unit:mm Size(EIA) () L.±. W.±. T.±. E.±.

43 Chip Ferrite Bead for GHz ange MGB Series Specifications Part Number Part Number Impedance at Impedance DC Max (Ω) ated Test Current Freq. ated Voltage DCWithstand Insulation ated Current esistance Mhz (Ω) +/-% (Ω) Max (ma) (MHz) (V) (Ω) Max Voltage (V) Min. (ma) (MΩ) (EIA ) MGBGEBP (NEW). MGBGEBP (NEW). Dimensions General Technical Data Operating Temperature ange Storage Condition Storage Time Soldering Method - C ~ + C Less than C and 7% H months Max. eflow or Wave Soldering,, AND vs. FEQUENCY X L MGBG E vs. FEQUENCY Impedance Under DC Bias A.A 7 9,, AND vs. FEQUENCY X L MGBG E 7 9 vs. FEQUENCY Impedance Under DC Bias A.A Package Size (EIA) () Standard Packing Quantity (pcs / reel),

44 Chip Ferrite Bead MCB-S/B Series Features Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk SMD Type & suitable for reflow and wave soldering Available in various sizes Excellent solderability and heat resistance High reliability Effectively filtering capability over a wide range of frequency Applications Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between F noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted F energy from corrupting the power generation circuitry, high frequency EMI prevention of computer, printers, VCs, TVs and portable telephones. How to Order MCB S F B 7 7 Series type Size (mm): Length x Width Material Code Impedance (Ω)/±% Fixed Decimal Point ated current: ex.: Ω ; Ω A=mA, B=mA, C=mA, D=mA, E=mA, F=mA G=mA, H=mA, I=mA, J=7mA, K=mA Soldering: Green Parts: B Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel Dimensions Unit:mm Size (EIA) () () ex.: 99Ω9; () Ω () () () () () L.±..±..±..±..±..±..±..±. W.±..±..±..±..±..±..±..±. T.±..±..±..9±..±..±..±..±. E.±..±..±..±...±...±..±..±.

45 Chip Ferrite Bead MCB-S/B Series Specifications Dimensions Part Number Impedance Test Freq. DC +/-% (Ω) (MHz) (Ω) Max ated Current (ma) Part Number Impedance Test Freq. DC +/-% (Ω) (MHz) (Ω) Max ated Current (ma) (EIA ) MCBBFBP (NEW). (EIA ) MCBSFBP. MCBSFBP. MCBSFBP. MCBSFBP. MCBS7FBP 7. MCBSFBP. MCBSEBP.7 MCBSEBP. MCBBFBP. MCBBEBP. MCBBDBP. (EIA ) Packaging Code: P, E MCBSIB_. MCBSIB_. MCBSIB_. MCBSIB_. MCBSIB_. MCBSIB_. MCBS7IB_ 7. MCBSIB_. MCBSIB_. MCBSIB_. MCBSFB_. MCBSFB_. MCBSFB_. MCBSFB_. MCBS7FB_ 7. MCBSEB_. MCBS7CB_ 7. MCBSCB_. (EIA ) Packaging Code: P, E MCBS7KB_ 7. MCBSKB_. MCBS7KB_ 7. MCBSKB_. MCBSKB_. MCBSKB_. MCBSKB_. MCBSKB_. MCBS9KB_ 9. MCBSKB_. (EIA ) Packaging Code: P, E MCBSKB_. MCBSHB_. MCBSHB_. MCBSHB_. MCBSHB_. MCBSHB_. MCBS7FB_ 7. MCBSFB_. MCBSFB_. MCBSEB_. (EIA ) Packaging Code: E MCBS9KB_ 9. MCBSKB_. MCBSKB_. MCBSKB_. MCBS7KB_ 7. MCBS9KB_ 9. MCBSIB_. MCBSIB_. MCBSIB_. MCBSIB_. MCBSIB_. MCBSHB_. MCBSHB_. MCBSHB_. MCBSHB_. MCBSEB_. MCBSEB_. (EIA ) MCBSKBE. MCBSKBE. MCBS9KBE 9. (EIA ) MCBSKBE. MCBSKBE. MCBSKBE. MCBSKBE. (EIA ) MCBS7KBE 7. MCBSKBE. MCBSKBE.

46 Chip Ferrite Bead MCB-S/B Series Dimensions General Technical Data Operating Temperature ange Storage Condition Soldering Method - C ~ + C Less than C and 7% H eflow or Wave Soldering MCBB F 7 9 vs. FEQUENCY Impedance Under DC Bias A.A MCBS-F & F MCBSF MCBSF 9 7 MCBS-F & F MCBSF MCBSF G G MCBS-7F & F MCBS-E & E MCBSF MCBS7F MCBSE MCBSE G G 9 7 MCBB-F,, AND vs. FEQUENCY X L 9 7 Impedance Under Dc Bias A.A

47 Chip Ferrite Bead MCB-S/B Series MCBB-E,, AND vs. FEQUENCY MCBB-D,, AND vs. FEQUENCY X L Impedance Under Dc Bias VS. FEQUENCY A.A Impedance Under Dc Bias VS. FEQUENCY A.A MCBS I MCBS-I & I MCBSI G MCBSI MCBSI G MCBS-I, I & I MCBS-7I, I, I & I 9 7 MCBSI MCBSI MCBSI G MCBSI MCBSI MCBSI MCBS7I G MCBS-F & F MCBSF 7 9 MCBSF MCBSF G MCB SF G

48 Chip Ferrite Bead MCB-S/B Series 9 7 MCBS - F, 7F, E & 7C MCBSF MCBS7F MCBSE MCBS7C G MCBSC MCBSC G MCBS - 7K & K MCBSK MCBS7K G 7 9 MCBS7K MCBS7K G MCBS - K & K MCBS - K & K MCBSK MCBSK G 9 7 MCBSK MCBSK G MCBS - K, 9K, K & K MCBS - H & H MCBSK MCBS9K MCBSK MCBSK G 7 9 MCBSH MCBSH G MCBS-H & H MCBS-H & 7F MCBSH MCBSH G 9 7 MCBSH MCBS7F G 7

49 Chip Ferrite Bead MCB-S/B Series 9 7 MCBSF MCBSF G MCBS-F & E MCBSE MCBSF G MCBS9K MCBS-K & K 7 9 MCBS9K G MCBSK MCBSK G 9 7 MCBSK MCBSK MCBS-7K, 9K, I & I MCBS7K MCBS9K MCBSI MCBSI G G 7 9 MCBS-I & I MCBSI MCBSI G MCBSI MCBSI G 9 7 MCBS-H & H MCBSH MCBSH G 9 7 MCBS-H & H MCBSH MCBSH G

50 Chip Ferrite Bead MCB-S/B Series MCBSE MCBSE MCBSE G 7 9 MCBSE G MCBSK MCBSK MCBSK G 9 7 MCBSK G MCBS9K MCBSK MCBS9K G 9 7 MCBSK G MCBS-K,K & K MCBSK MCBSK MCBSK G MCBS7K MCBS7K G MCBS-K & K MCBSK MCBSK G Package Size (EIA) () () () () () () () () Standard packing Quantity (pcs/reel),,,,,,,, 9

51 Chip Ferrite Bead For High Speed MCB-H/U Series Features Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk SMD Type & suitable for reflow and wave soldering Available in various sizes Excellent solderability and heat resistance High reliability With a sharp and high frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal Applications Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between F noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted F energy from corrupting the power generation circuitry. Sharp impedance characteristics can effectively minimize attenuation, high frequency EMI prevention of LCD monitor, PDA, Computers, Computer Peripherals, Cellular Equipment, Digital TV, Digital Cameras, Audio/Visual Equipment, DVD, Wireless Communication Devices, MP. How to Order MCB H E B Series type Size (mm): Length x Width Material Code Impedance (Ω)/±% ex.: Ω ; Ω Fixed Decimal Point ated Current : A =ma, B=mA, C=mA, D=mA, E=mA, F=mA, G=mA, H=mA, I=mA, J=7mA, K=mA Soldering: Green Parts: B Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel Dimensions Unit:mm Size (EIA) () () () L.±..±..±. W.±..±..±. T.±..±..9±. E.±..±..±.

52 Specifications Chip Ferrite Bead For High Speed MCB-H/U Series Part Part Number Number Impedance at Impedance DC (Ω) Max ated Test Current Freq. ated Voltage DCWithstand Insulation ated Current esistance Mhz (Ω) +/-% (Ω) Max (MHz) (ma) (V) (Ω) Max Voltage (V) Min. (ma) (MΩ) (EIA ) MCBH7FBP 7. (EIA ) Packaging Code: P, E MCBHHB_. MCBHHB_. MCBH7EB_ 7. MCBHHB_. MCBHEB_. MCBHEB_. MCBHEB_. MCBHEB_. MCBHEB_. MCBUHB_. MCBU7FB_ 7. MCBUEB_. MCBUEB_. (EIA ) Packaging Code: P, E MCBHEB_. MCBHEB_. MCBHEB_. MCBHEB_. MCBHEB_. MCBH7EB_ 7. MCBHEB_. General Technical Data Operating Temperature ange Storage Condition Soldering Method - C ~ + C Less than C and 7% H eflow or Wave Soldering MCBH7F vs. FEQUENCY Impedance Under DC Bias A.A 9 7 MCBHH 9 7 A.A G G Impedance Under DC Bias vs. FEQUENCY

53 Chip Ferrite Bead For High Speed MCB-H/U Series MCBHH 7 9 G 7 9 Impedance Under DC Bias vs. FEQUENCY A.A G MCBH7E Impedance Under DC Bias vs. FEQUENCY A.A 7 9 G MCBHH MCBHE 7 9 Impedance Under DC Bias vs. FEQUENCY A.A G G Impedance Under DC Bias vs. FEQUENCY A.A G MCBHE 9 7 G 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G

54 Chip Ferrite Bead For High Speed MCB-H/U Series MCBHE 9 7 G 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G MCBHE Impedance Under DC Bias vs. FEQUENCY A.A X L MCBHE Impedance Under DC Bias vs. FEQUENCY A.A G MCBUH MCBU7F Impedance Under DC Bias vs. FEQUENCY A.A G G Impedance Under DC Bias vs. FEQUENCY A.A G

55 Chip Ferrite Bead For High Speed MCB-H/U Series MCBUE 9 7 G 9 7 Impedance Under DC Bias vs. FEQUENCY G A.A MCBUE G Impedance Under DC Bias vs. FEQUENCY A.A G MCBHE 7 9 G 7 9 Impedance Under DC Bias vs. FEQUENCY A.A G MCBHE G G Impedance Under DC Bias vs. FEQUENCY A.A MCBHE 7 9 G 7 9 Impedance Under DC Bias vs. FEQUENCY A.A G

56 Chip Ferrite Bead For High Speed MCB-H/U Series MCBHE G Impedance Under DC Bias vs. FEQUENCY A.A G MCBHE 9 7 G 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G MCBH7E 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G G G MCBHE 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G Package Size (EIA) () () () Standard packing quantity (pcs/reel),,,

57 High Current Chip Ferrite Bead MHC Series Features Combination of high frequency noise suppression with capability of handing high current The current rating up to Amps with low DC Applications High current DC power lines Circuits where a stable ground in unavailable How to Order MHC S P B 7 7 Series type Chip size(mm) : Length x Width Product Characteristics : S For Standard Application Impedance (Ω)/±% ex.: Ω ; Ω Fixed Decimal Point ated Current: L =ma, M=mA, N=mA, P=mA Q=mA, =ma, U=mA, W=mA Soldering: Green Parts: B Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel Dimensions Unit:mm Size (EIA) () () () () () () () L.±..±..±..±..±..±..±. W.±..±..±..±..±..±..±. T.±..±..9±..±..±..±..±. E.±..±..±..±..±..±..±.

58 Specifications High Current Chip Ferrite Bead MHC Series Part Number Impedance Impedance at (Ω) DC Max Test ated Freq. Current ated Voltage DC (Ω) Withstand Insulation ated Current esistance Mhz +/- (Ω) % (Ω) (MHz) Max (ma) (V) Max. Voltage (V) (ma) Min. (MΩ) (EIA ) MHCSNBP.9 MHCSNBP.9 MHCSLBP. MHCSMBP. (EIA ) Packaging Code: P, E MHCSQB_. MHCSQB_. MHCSQB_. MHCSPB_.7 MHCSNB_.9 MHCSNB_.9 MHCSMB_. MHCSLB_. (EIA ) Packaging Code: P, E MHCSWB_. MHCSWB_. MHCSB_. MHCSQB_. MHCSUB_. MHCS9UB_ 9. MHCSUB_. MHCSQB_. MHCSQB_. MHCSNB_.9 MHCSNB_.9 MHCSNB_.9 (EIA ) Packaging Code: E MHCSWB_. MHCSQB_. MHCS7QB_ 7. MHCSB_. MHCS9QB_ 9. MHCSWB_. MHCSNB_.9 MHCSPB_.7 MHCSPB_.7 MHCSLB_. (EIA ) MHCSMBE. MHCSNBE.9 (EIA ) MHCSWBE. MHCSWBE. MHCS7NBE 7.9 MHCSMBE. (EIA ) MHCSWBE. MHCSWBE. MHCSWBE. MHCSQBE. MHCSQBE. MHCSQBE. 7

59 High Current Chip Ferrite Bead MHC Series General Dimensions Technical Data Operating Temperature ange Storage Condition Soldering Method - C ~ + C Less than C and 7% H eflow or Wave Soldering MHC SN Impedance Under DC Bias vs. FEQUENCY A A MHC SN Impedance Under DC Bias vs. FEQUENCY A A 9 7 MHC SL 9 7 Impedance Under DC Bias vs. FEQUENCY A A MHC SM Impedance Under DC Bias vs. FEQUENCY A.A

60 High Current Chip Ferrite Bead MHC Series 9 7 A A G G Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY 9 7 A A G G Impedance Under DC Bias vs. FEQUENCY A A G G A.A G G G MHCSQ MHCSQ MHCSQ MHCSP MHCSN Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY G A A 9

61 High Current Chip Ferrite Bead MHC Series MHCSN G G G G G MHCSM 9 7 MHCSL 9 7 MHCSW MHCSW Impedance Under DC Bias vs. FEQUENCY G G A A Impedance Under DC Bias vs. FEQUENCY A.A Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY G G A A A A A Impedance Under DC Bias vs. FEQUENCY A

62 High Current Chip Ferrite Bead MHC Series G G G G G MHCS 9 7 MHCSQ 9 7 MHCSU MHCS9U MHCSU Impedance Under DC Bias vs. FEQUENCY G G A A A A A Impedance Under DC Bias vs. FEQUENCY G A Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY A G A A A

63 High Current Chip Ferrite Bead MHC Series G G G G G MHCSQ 7 9 MHCSQ MHC SN MHCSN MHCSN 9 7 Impedance Under DC Bias vs. FEQUENCY A G A G A A Impedance Under DC Bias vs. FEQUENCY G A Impedance Under DC Bias vs. FEQUENCY G A A Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY A A A

64 High Current Chip Ferrite Bead MHC Series G G G MHCSW 9 7 MHCSQ 9 7 MHCS7Q 9 7 MHCS MHCS9Q Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY G A A Impedance Under DC Bias vs. FEQUENCY A A A A A Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY G A A A

65 High Current Chip Ferrite Bead MHC Series G G G G G MHCSW MHCSN 7 9 MHCSP 9 7 MHCSP 9 7 MHCSL Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY A G Impedance Under DC Bias vs. FEQUENCY G A A A.A A.A Impedance Under DC Bias vs. FEQUENCY A G A A

66 High Current Chip Ferrite Bead MHC Series G G G G MHCSM G 9 7 MHCSN 9 7 MHCSW 9 7 MHCSW 9 7 MHCS7N Impedance Under DC Bias vs. FEQUENCY A G A Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY G A.A Impedance Under DC Bias vs. FEQUENCY G A A A Impedance Under DC Bias vs. FEQUENCY A A A

67 High Current Chip Ferrite Bead MHC Series G G G G G MHCSM 9 7 MHCSW MHCSW MHCSW 7 9 MHCSQ 9 7 Impedance Under DC Bias vs. FEQUENCY A G Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY G Impedance Under DC Bias vs. FEQUENCY G A A A A A A.A Impedance Under DC Bias vs. FEQUENCY A G A

68 High Current Chip Ferrite Bead MHC Series 9 7 G G MHCSQ 9 7 MHCSQ Impedance Under DC Bias vs. FEQUENCY A G A G A Impedance Under DC Bias vs. FEQUENCY A Package Size (EIA) () () () () () () () Standard packing Quantity (pcs/reel),,,,,,, 7

69 Chip Ferrite Bead Array MA-S Series Features Combines single (EIA ) chips into one package (EIA ) to reduce board space and placement time The.mm terminal pitch makes easy to apply EMI prevention in multiple-lines such as connectors and IC pins Material and construction design minimize cross talk between adjacent circuits Effective filtering capability over a wide range of frequency Applications Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between F noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted F energy from corrupting the power generation circuitry, high frequency EMI prevention of computer, printers, VCs, TVs and portable telephones. How to Order MA S E B 7 7 Series type Size(mm) : Length x Width Product Characteristics : S - For Standard Application Impedance (Ω)/±% Fixed Decimal Point ated current: ex.: Ω ; Ω A=mA, B=mA, C=mA, D=mA, E=mA, F=mA G=mA, H=mA, I=mA, J=7mA, K=mA Soldering: Green Parts: B Lead-Free for whole chip Packaging: P Embossed paper tape, 7" reel E Embossed plastic tape, 7" reel Dimensions Unit:mm Size (EIA) () () L.±..±. W.±..±. T.±..±. C.±..±. C.±..±. D.±..±. Specifications Dimensions General Technical Data Part Number Impedance (Ω) Test Freq. DC (Ω) ated Current +/-% (MHz) Max. (ma) (EIA ) MASFBP. MASFBP. MASEBP. MAS7EBP 7.9 MASEBP. (EIA ) MASFBE. MASEBE. MASEBE. MASCBE. MASABE. Operating Temperature ange Storage Condition Soldering Method - C ~ + C Less than C and 7% H eflow or Wave Soldering

70 Chip Ferrite Bead Array MA-S Series MASF MASF MASE Impedance Under DC Bias vs. FEQUENCY A.A Impedance Under DC Bias vs. FEQUENCY A.A Impedance Under DC Bias vs. FEQUENCY A.A MAS7E Impedance Under DC Bias vs. FEQUENCY A.A MASE Impedance Under DC Bias vs. FEQUENCY A.A 9

71 Chip Ferrite Bead Array MA-S Series MASF 9 7 G 9 7 Impedance Under DC Bias vs. FEQUENCY A.A G MASE Impedance Under DC Bias vs. FEQUENCY A.A 9 7 G G 9 7 Impedance Under DC Bias vs. FEQUENCY Impedance Under DC Bias vs. FEQUENCY A.A G A.A G A.A G G MASE MASC MASA Impedance Under DC Bias vs. FEQUENCY Package Size (EIA) () () Standard packing quantity (pcs/reel),, 7