Microsoft Word - LH-16058C1-W1-CC0-04 Rev 1_羚洋_.doc

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凤严薛
5 years ago
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1 Approval Sheet 承認書 Product/ 产品 Part Number/ 型号 RGB SMD LED WS-5050RGB Customer/ 客户 Issue Date / 发行日期 MAKER 制定 CUSTOMER 客戶 Prepared 製作 Checked 審核 Approved 核准 Prepared 製作 Checked 審核 Approved 核准 TF-5050RGB-04 WI-ENG-DS-001 Rev:A/0 1/5

2 Dimensional drawing/ 尺寸圖 All dimensions are in millimeter/ 圖中所有尺寸均以毫米為單位 Tolerance is ±0.25mm(0.10 )unless otherwise noted/ 若無特別標注, 圖中尺寸公差為 ±0.2mm Shape Specification / 外觀要求, 胶体结构 No. 序號 ITEM 項目 Lens 膠體 PIN PIN 腳 Configuration 結構 SPEC OR DESCRIPTION 規格要求描述 No change color/ 不可有膠體變色 No Disrepair/ 不可有破損 Scratch/ 劃傷 (length 2.0mm,Width 0.25mm) macula/ 黑點異物 ( 0.25mm and 2EA in Encapsulation reverse) bubble/ 氣泡 ( 0.3mm and 2EA Encapsulation reverse) No oxidation/ 不可有氧化 No electropolar reverse/ 不可有極性反 No Encapsulation reverse/ 不可封反 No PIN loosen/pin 腳不可鬆動 4 硅胶硬度 70 软硅胶, 混合粘度 4000 Opto-Electronical Characteristics / 光電特性 Red Blue/Green LED Chip Forward Current vs. 芯片伏安特性 LED Chip Maximum Forward Current vs. Ambient Temperature 芯片環境溫度與電流的關係 TF-5050RGB-04 WI-ENG-DS-001 Rev:A/0 2/5

3 Absolute maximum ratings/ 最大絕對額定值 Parameter 參數 Forward Current 正向電流 Reverse Voltage 反向電壓 Operating Temperature 工作溫度 Storage Temperature 儲存溫度 Soldering temperature 焊接溫度 Symbol 符號 Lighting Angle / 發光角度 : Value 數值 Unit 單位 If R/G/B=20 ma Vr 5 V Topr -25~+85 Tstg -35~+85 Tsol 260±5 (for4sec) Power Dissipation R=40 Pd mw 功率消耗 G/B=60 Pulse Current 脈衝電流 IFP 100 ma Opto-Electronical Specification/ 光電參數規格 Parameter 參數 Symbol 符號 Category 类型 Min 最小值 Typ 平均值 Max 最大值 Unit 單位 Tolerance 误差值 Test Conditinos Luminous Intensity Wavelength 波长 Chromatic current 光譜座標 Luminous Flux 光通量 Vf IV WD R G B R G B R G B V ± 0.05V mcd nm ± 60 mcd ±1nm X / / ±0.005 Y / / ±0.005 Φ R G B Lm ±0.1 Lm IF/ 正向電流 R/G/B=20 ma Test Temperature 測試溫度 =25 Lighting Angle 發光角度 θ / deg ±2 Reverse Current 反向電流 IR / μa ±0.1μA Vr=5V TF-5050RGB-04 WI-ENG-DS-001 Rev:A/0 3/5

4 Opto-Electronical Grading Specification / 光电分级规格 Luminous Intensity Wavelength 波长 Chromatic current 光譜座標 X / / / / / Y Test Conditinos IF/ 正向電流 =60mA Test Temperature 測試溫度 =25 Reliability Test Items/ 可靠度測試項目 No Item 測度項目 Soldering Heat Test 焊接試驗 Thermal Shock 熱衝擊 High Temp. Storage 高溫儲存 Low Temp. Storage 低溫儲存 Temperature Cycle Test 高低溫循环 High Temp. High Humidity Test 高溫高濕 Operation Life Test 1 常溫老化 Operation Life Test 2 常溫老化 High Temp. Operation Life Test 高溫老化 Low Temp. Operation Life Test 低溫老化 Judgment Criteria/ 判定標準 : Condition Time/Cycle 測試時間或週期 Number of Damaged 不良數 / 測試數 260±5 o C 10 sec 0/60 0 o C (15sec) ~ 100 oc(15sec) 20 cycle 0/ o C 1000Hrs 0/60-40 o C 1000Hrs 0/60-40 o C ~ 80 o C 100 Cycles, 200 Hrs 0/60 60 o C, 90 % RH 1000 Hrs 0/60 Room Temp., 20mA 1000 Hrs 0/60 Room Temp., 30mA 500 Hrs 0/60 85 o C, 5mA 1000 Hrs 0/60-30 o C, 20mA 1000 Hrs 0/60 Item 項目 Leakage Current 反向漏電流 Luminous Intensity Luminous Flux 光通量 Symbol Test Conditions Judgment Criteria Vf I F = 60 ma Δ% < 10 % Ir Vr = 5V < 20 ua Iv I F = 60 ma Δ% <10 % lm IF = 60 ma Δ%<10 % TF-5050RGB-04 WI-ENG-DS-001 Rev:A/0 4/5

5 Caution/ 注意事項 1 After open the package, the LED should be kept at 25 o C, 65 % RH environment or less. 打開包裝後請在溫度 25±3 o C 濕度 65±5% 的環境下使用 2 The LED should be soldered within 6 hours after opening the package. 打開包裝後請在 6 小時內作焊接. 3 The LAMP LED is an ESD sensitive device. All the equipment and machine must be properly grounded. LED 是靜電敏感器件, 使用時所有設備機構都需有適當的接地導電措施 4 when make use of it,please use static-free container,operator showld ware antistatic clothes and rope-satic-ring also should make effective ground. 使用時請使用防靜電的盛裝容器, 作業人員應穿著防靜電服裝及佩戴有繩之靜電環並作有效接地 5 Damaged device will appear some symptoms,lower forward voltage,higher leak current,or even short curcuit 受靜電與突波破壞之 LED 的電性特性上, 會有明顯的漏電流, 或驅動電壓明顯變低, 甚至是短路現象 6 ferrochromium soldering :power keep no more than 40W,tip temperature should not pass 280 o C,soldering time within 3 second 鉻鐵焊接時鉻鐵功率不要超過 40W, 尖端溫度不要超過 280 o C, 焊接時間不要超過 3 秒 7 wave-soldering: temperature should not pass 265 o C, soldering time within 5 second, 波峰焊接時溫度不超過 265 o C, 焊接時間不要超過 5 秒 8 After soldering the LED should keep out off any shake or outer force before it come to normal tempreture 在焊接溫度回到正常以前, 必須避免使 LED 受到任何震動或外力 9 LED is one-way continuity, please check electrode before mount, if amount wrong,the LED chip will damage or fail when LED applied voltage 單嚮導通性, 安裝前確認極性, 若裝反, 在施加電壓時容易造成 LED 晶片損傷或失效 10 please design the PCB board to keep a distance between LED and other emit heat component 線路設計時, 請不要將 LED 與發熱元件靠得過近 11 strongly recommend design the board according setting current other than setting voltage.if you are really need setting voltage type please consider there may cause influence arise by difference voltage of difference LED 電路設計上, 建議以定電流設計, 若為定電壓設計, 請考慮 LED 之間不同所可能造成之影響 12 the outer voltage change will bring the current index change.unsuitable design and current control,easy cause LED fail.for example excess current will cause LED life short or even burn down, too little electricity will cause lacking light LED 之外加電壓變化, 會造成電流指數級變化, 不當之設計與電流控制, 易造成 LED 失效, 如電流過大引起壽命問題甚至燒毀, 電流過小引起亮度不足 13 If you need make difference BIN LED in the one module.please confirm whether it can meet the electric and optics characteristic require such as the current balance, emitting and brightness consistency. 不同 BIN 號之 LED 需安裝在同一個組件時, 請先確認是否可滿足相關電氣及光學之特性要求, 如電流是否均衡, 光色亮度的一致性等 TF-5050RGB-04 WI-ENG-DS-001 Rev:A/0 5/5

OVLFx3C7_Series_A3_bgry-KB.pub

OVLFx3C7_Series_A3_bgry-KB.pub (5 mm) x High brightness with well-defined spatial radiation patterns x U-resistant epoxy lens x Blue, green, red, yellow Product Photo Here Each device in the OLFx3C7 series is a high-intensity LED mounted