CHANGE RECORD Ed./Rev. Date Verified and approved by Description Writer 5 05/20/2016 FS/PW/PEB/LLR 1 : this recommendations document now addresses to

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2 DISTRIBUTION LIST In charge of the document: Fabrice Soufflet Process Engineering Group Copy to: Pierre Maurice Marie-Cécile Vassal Dominique Blain Pierre Wang Responsibility President Project Group Manager Quality Assurance Manager High Rel. Product Manager Doc. N : Page 2/28

3 CHANGE RECORD Ed./Rev. Date Verified and approved by Description Writer 5 05/20/2016 FS/PW/PEB/LLR 1 : this recommendations document now addresses to SOP and QFP modules. BGA modules are addressed in 此推荐文档 是基于 SOP 和 QFP 封装的模块.BGA 模块在另一 个篇文档 : four documents in reference added 增加了 4 参考文档 RD3 : Side staking of a SOP module SOP 模块的侧面加固 RD4 : Underfilling of a SOP module SOP 模块的底部填充 RD5 : Validation of the mounting of 3D PLUS memory stacks on pcb 3D PLUS 模块的安装验证 3 : flowchart added 增加了流程图 6 : added note SOP and QFP modules tinning before assembly is mandatory (see annex 2) 增加 了注意 : SOP and QFP 模块在装配前的必须镀锡 ( 见附件 2) 7 : Removed manual soldering allusions in this paragraph. 9 and 10 : Pre-heat time and time above liquidus enlarged to include a wider range of 3D PLUS products 预热时间和液态线上的时间适用于 3D PLUS 广泛的产品. 11 : module replacement recommendations updated 更新了模块更换建议 12 : module reinforcement recommendations updated 更新了模块加固建议 13 : module tinning recommendations added 增 加了模块镀锡建议 14 : new varnish added : SOLITHANE 113 增加 了新的清漆 : SOLITHANE : mini-tray added. Low-temperature plastic tray removed. 删除了低温塑料托盘. 增加了 mini 托 盘 16 : annex 2 presentation changed. 附件 2 表述 改变 WY 4 10/30/2013 FS/AV 4 : Labels updated 标签更新 4.2 : Dry cabinet storage recommendations added 增加了干燥储存箱建议 5: added note mandatory bake after sealed bag opened / what to do after >6H exposure. 增加 注意 : 当包装袋打开后 / 曝光 6 小时后必须烘烤 5.2/ 5.3 : updated sentence about profile WY Doc. N : Page 3/28

4 beyond limitations... corrected 更新了对句子 的 修正 6 : Leads cutting recommendations added 增加 了管脚切割建议 10 : Module reinforcement recommendations added 增加了模块固定建议 11 : Module coating recommendations added 增 加了模块涂层建议 12.1 : updated : the maximum temperature for bake is 135 C 更新 : 烘烤的最高温度为 135 C 13 : Annex 2 : Leads tinning procedure added 附件 2 增加了管脚镀锡处理步骤 Doc. N : Page 4/28

5 TABLE OF CONTENT 1. Scope 引言 Documents in reference 见资料 D PLUS modules storage/assembly flowchart 3D PLUS 模块的储存 / 装配流程图 Handling 操作 Storage 储存 Background 背景 Storage Recommendations 储存建议 Module storage preparation recommendations 模块存储准备的建议 Module storage recommendations 模块储存建议 About 3D PLUS modules packaging 模块的包装 Assembly recommendations 焊接装配建议 Assembly process 装配工艺 SOP and QFP packages SOP 和 QFP 封装 Modules leads cutting 模块管脚切割 Reflow profile specifications 回流焊曲线规格 Convection and/or IR reflow profile recommendations 对流回流焊和 / 或红外回流焊曲线参数设置建议 Vapor phase reflow profile recommendations 汽相回流焊曲线参数设置建议 Module replacement recommendations 模块更换建议 Manual module removal 手动拆卸模块 Module replacement 模块替换 Module reinforcement recommendations 模块加固建议 Module tinning recommendations 模块镀锡建议 Board coating recommendations 电路板涂层建议 Annex 1 : Carriers Description 附件 1 : 承载物描述 High temperature carriers description 高温承载物描述 Low temperature carriers description 低温承载物描述 Annex 2 : Leads Tinning 附件 2 : 管脚镀锡 Material 材料 Modules preparation 模块准备 Degolding 去金 Tinning 镀锡 Tinned lead geometry 镀锡的管脚几何图 Visual inspection criteria 外观检测标准 Doc. N : Page 5/28

6 TABLES AND FIGURES Figure 1 : 3D PLUS modules storage/assembly flowchart 模块的储存 / 装配流程图... 8 Figure 3 : Automatic or manual soldering label for trays 自动或手动焊接标签 Figure 4 : Automatic or manual soldering label for plastic boxes 自动或手动焊接标签 Figure 4 : Modules leads cutting mechanical drawing Figure 5 : IR / Convection reflow profile Figure 6 : Vapor phase soldering profile Figure 7 : 3D PLUS plastic tray for modules 用于模块放置的塑料拖盘 Figure 8 : Maximum baking temperature indication on trays 可耐最高烘焙温度为 135 C Figure 9 : 3D PLUS plastic mini-tray for modules 3D PLUS 模块 mini 塑料托盘 Figure 10 : 3D PLUS plastic box for modules 用于模块放置的塑料盒 Figure 11 : Tinning zone limit drawing 镀锡区域图 Table 1 : Time equivalence table Table 2 : Bake frequency for dry cabinet storage Table 3: Sn-Pb reflow profile recommendations Table 4 : Sn-Pb reflow profile recommendations Doc. N : Page 6/28

7 1. SCOPE 引言 This document embodies various recommendations concerning 3D PLUS Modules storage, assembly and rework conditions. It is only applicable for modules guaranteed by 3D PLUS for automatic reflow, stated in 3D PLUS certificate of conformity (CoC) and/or end item data package (EIDP). This document addresses to SOP and QFP packages. 此文档集合多种关于 3D PLUS 模块储存, 焊接装配与再加工的条件的建议. 仅适用于 3D PLUS 确保的自动焊模块 (3D PLUS CoC 和 / 或 EIDP 文件中的阐述 ). 此文档基于 SOP 和 QFP 封装的模块. 2. DOCUMENTS IN REFERENCE 见资料 RD1 : IPC/JEDEC J-STD-033B.1 Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices IPC/JEDEC J-STD-033B.1 处理, 包装, 运输和使用的潮湿 / 回流敏感的 表面贴装设备 RD2 : ECSS-Q-ST-70-08C Space product assurance : manual soldering of high-reliability electrical connections, ECSS-Q-ST-70-08C 航天产品保证 : 高可靠性电气连接的手动焊接, Section Pre-tinning of component leads and solid-wire conductors 构件预镀锡管脚和实心 导线 Section Soldering irons and resistance soldering equipment 焊接烙铁和阻焊设备 RD3 : RD4 : RD5 : Side staking of a SOP module SOP 模块的侧面加固 Underfilling of a SOP module SOP 模块的底部填充 Validation of the mounting of 3D PLUS memory stacks on pcb 3D PLUS 模块的安装验证 Doc. N : Page 7/28

8 3. 3D PLUS MODULES STORAGE/ASSEMBLY FLOWCHART 3D PLUS 模块的储存 / 装配流程图 Receipt of 3D PLUS Modules 收到 3D PLUS 模块 (dry sealed bag 干燥密封袋 ) Incoming inspection 来料检验 No 不需要 Use? 需要用? Yes 需要 Module Storage Preparation 模块存储准备 Module Storage 模块存储 (dry pack or dry cabinet) 干燥包装或干燥箱 No 不需要? Use? 需要用? Yes 需要 Modules Leads tinning 模块管脚镀锡 Annex 2 附件 2 (skip if already tinned) 如果引线已镀锡, 忽略 Module Assembly 模块装配 6 Figure 1 : 3D PLUS modules storage/assembly flowchart 模块的储存 / 装配流程图 Doc. N : Page 8/28

9 4. HANDLING 操作 Components manufactured by 3D PLUS must be handled with care. Operators are requested to wear antistatic gloves and wrist straps. 3D PLUS 模块必须小心操作 操作人员须戴防静电手套和手环. The use of tools that could damage sides of components is also prohibited. 不允许使用任何可能导致模块外侧损坏的工具. Note : Manual handling may increase the risk of mechanical and/or ESD damage. 注意 : 手动操作可能导致机械损伤或者 ESD 静电放电损伤. 5. STORAGE 储存 5.1. BACKGROUND 背景 The vapor pressure of moisture inside a non hermetic package increases greatly when the package is exposed to the high temperature of solder reflow. Under certain conditions, this pressure can cause internal delamination of the packaging materials from the die and/or leadframe/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cratering beneath the bonds. In the most severe case, the stress can result in external package cracks. This is commonly referred to as the popcorn phenomenon because the internal stress causes the package to bulge and then crack with an audible pop. 在回流焊的高温情况下, 进入到非密封封装内的湿气会急剧膨胀 特定情况下, 膨胀造成的压力会造成内部各部位物理损伤, 甚至于造成封装外部开裂, 即通常所指的 爆米花 现象 STORAGE RECOMMENDATIONS 储存建议 In order to avoid degradation due to humidity, components must be handled according to the following procedure. 3D PLUS recommends to store the modules in dry environment (dry sealed bags, dry cabinet) for a better use of its products. 为了防止潮湿引起的器件性能退化, 器必须按照以下步骤操作. 3D PLUS 建议在防潮环境下储存模块 MODULE STORAGE PREPARATION RECOMMENDATIONS 模块存储准备的建议 Before any storage operation, 3D PLUS modules must be dry. According to the duration of exposure to ambient conditions (30 C/60% RH), different durations of bake should be performed. 3D PLUS 的模块在存储前必须烘干. 根据暴露于环境条件下的持续时间 (30 C/60% RH), 应执行不同烘烤时间. Short duration exposure ( 30 minutes): Components, which have only been exposed to ambient conditions below 30 C / 60% RH, and for 30 minutes or less, may be resealed with the original dessicant bag without any drying treatment, or stored in a dry cabinet. 短时间暴露 ( 小于或 30 分钟 ) 原本干燥的器件, 如果仅仅暴露在室温不超过 30 C 且相对湿度不超 过 60% 条件下, 模块可以直接和原有干燥剂密封在防潮袋里, 或者在燥箱里储存. Doc. N : Page 9/28

10 Long duration exposure ( 30days): Components which have been exposed only to ambient conditions of 60% RH for a maximum of 30 days may be adequately dried by high temperature baking at 125 C during 24 hours for re-bake prior to reflow or storage in dry cabinet, or at 125 C during 48 hours for drying prior to dry packing. 长时间的暴露 ( 30 天 ): 暴露在室温条件下且相对湿度 60% 的器件, 不超过 30 天的时间, 在经 过 24 小时 125 C 的再次烘焙后, 能够适用于焊接装配或者在干燥箱里储存 ( 见上文 干燥箱储存 部分 ), 或者 125 C 下 48 小时的再次烘焙后能够密封在一个放置了干燥剂的防潮袋里. For longer duration exposure (> 30days), a bake for a minimum duration of 48 hours at 125 C is mandatory. 更长时间的暴露 ( 超过 30 天 ) : 模块必须进行至少 48 小时的 125 C 烘焙. Doc. N : Page 10/28

11 Baking at 90 C 90 C 烘焙的情况 If baking at 125 C is not possible, 3D PLUS modules can be baked at 90 C for a longer time. Below, a comparative table of baking duration according to the oven temperature. 如果不能经过 125 C 的烘焙, 3D PLUS 模块也可以进行较长时间 90 C 的烘焙. 以下, 一个烘焙时间对比表. Baking at 125 C 125 C 烘焙 Baking at 90 C 90 C 烘焙 24 hours/24 小时 5 days/5 天 48 hours/48 小时 10 days/10 天 Table 1 : Time equivalence table MODULE STORAGE RECOMMENDATIONS 模块储存建议 After drying up the modules, one can choose to store them either in a dry cabinet or to seal them in a moisture barrier bag with a dessicant bag. 干燥后的模块, 可以选择存放在干燥箱或密封在一个放置了干燥剂的防潮袋里. Dry cabinet storage 干燥箱存储 : Right after the moisture barrier bag opening, 3D PLUS components can be stored in a dry cabinet at 20 C in dryed carriers/ ESD plates (low temperature carrier excluded). According to the relative humidity (RH) level in the cabinet, 3D PLUS modules should be baked on a regular basis at 125 C, during 24 hours, then put back in the cabinet. For example, for a 10% RH cabinet, at 20 C, modules should be baked every 5 days. The cycle can be repeated as long as needed. Below 5% RH, 3D PLUS modules can be stored indefinitely. 防朝袋打开后,3D PLUS 模块可以在已烘焙过的承载物上 ( 不包含低温承载物 )20 C 干燥箱内储存. 根据干燥箱的相对湿度, 模块必须定期进行 24 小时 125 C 的烘焙. 比如说, 在相对湿度不超过 10% 且 20 C 的环境下, 模块必须每 5 天进行一次 125 C 下 24 小时的烘焙. 此过程可循环进行, 在 5% 湿度下,3D PLUS 模块可以无限期储存. RH % 5% 10% 20% Bake frequency (days) C 5 4 Table 2 : Bake frequency for dry cabinet storage Unopened moisture barrier bag : 防潮袋未开启的情况 The calculated shelf life for dry sealed packed components is 12 months from the pack seal date, when stored in a non-condensing atmospheric environment of < 40 C and < 90% RH. Beyond this period, the reconditioning is mandatory; modules shall be baked at 125 C during 48 hours. Doc. N : Page 11/28

12 在温度 < 40 C, 相对湿度 < 90% 的环境下 : 计算得到器件在真空密封干燥袋中保存期限为从封装日 期算起 12 个月. 超过这个保存期, 应对模块进行 125 C 下 48 小时的烘焙重新保存与干燥包装 ABOUT 3D PLUS MODULES PACKAGING 模块的包装 High temperature carriers : Unless indicated otherwise by 3D PLUS, modules shipped in high temperature trays can be baked in the trays at 125 C (see annex 1). 高温承载物 : 除非经 3D PLUS 特别标明, 高温托盘 ( 见附件 1) 运送的模块可在此拖盘中进行 125 C 的烘焙. Low temperature carriers : Modules shipped in low temperature carriers (e.g. plastic box, low temperature trays, tape and reel,...) may not be baked in the carriers at any temperature higher than 40 C or stored in a dry cabinet. If a higher bake temperature is required, modules must be removed from the low temperature carriers to thermally safe carriers, baked, then returned to the low temperature carriers (see annex 1). 低温承载物 : 低温承载物 ( 例如 : 塑料盒, 低温拖盘, 承载带, 轴, ) 运送的模块不能在承载物中经受高于 40 C 的烘焙 如果需要更高的烘烤温度, 必须把模块从低温承载物转移到安全的高温托盘中进行烘烤, 完成烘烤后转移到低温承载物中. Labelling : A specific label that details the recommendations is stamped on the sealed bag, see below. 标签 : 下图是贴在真空密封包上常用的标签. Figure 2 : Automatic or manual soldering label for trays 自动或手动焊接标签 ( 塑料托盘 ) Doc. N : Page 12/28

13 Figure 3 : Automatic or manual soldering label for plastic boxes 自动或手动焊接标签 ( 塑料盒 ) Doc. N : Page 13/28

14 6. ASSEMBLY RECOMMENDATIONS 焊接装配建议 6.1. ASSEMBLY PROCESS 装配工艺 Note : 3D PLUS SOP and QFP modules leads must be tinned before assembly operation, please refer to annex 2 for leads tinning operation. 3D PLUS 的 SOP 和 QFP 模块必须在装配前进行管脚镀锡操作, 请参阅附件 2 管脚镀锡操作. After sealed bag opening, 3D PLUS modules have to be baked 24 hours at 125 C. If taken out from a dry cabinet within their storage cycle (see 4.2. Storage Recommendations: dry cabinet storage section), 3D PLUS modules may be soldered right away. 防潮袋开启后,3D PLUS 模块应进行 24 小时 125 C 的烘焙. 如果从干燥箱里取出来, 在储存周期之内 ( 见本文 4.2. 部分 ), 模块可以直接进行焊接装配. The maximum storage duration under environmental conditions 30 C and < 60% RH is 6 hours. Beyond 6 hours, a new 24-hour bake at 125 C has to be performed on modules. 器件在 30 C 和相对湿度 <60% 的环境下的待用时间应不超过 6 小时. 过了 6 小时, 模块必须经过 24 小时 125 C 的再次烘焙. Mass reflow : This recommendation applies to bulk solder reflow assembly by convection, convection/ir, infrared (IR), and vapour phase (VPR), processes. It does not apply to bulk solder reflow processes that immerse the component bodies in molten solder (e.g., wave soldering bottom mounted components). 大规模回流焊 : 这项建议适用于大批量焊接装配, 运用对流回流焊, 红外对流回流焊, 红外回流焊和汽相回流焊. 此建议不适用于将器件浸入熔融的焊锡的批量焊接装配. Multiple reflow passes : if more than one reflow pass is used, care must be taken to ensure that the modules (mounted or un-mounted) have not exceeded their floor life prior to the final pass. If any module on the board has exceeded its floor life, the board with its modules needs to be baked prior to the next reflow. 多回流焊线路 : 如果运用不只一条回流焊线路, 必须确保安装或未安装的模块在回流焊之前没有超过暴露时间, 如果超过了暴露时间, 模块需要在下一个回流焊之前重新进行烘烤. Module cleaning after assembly must be done with isopropylic alcohol preferentially, or with de-ionized water otherwise. For other cleaning products, please consult 3D PLUS for further information. 模块装配后必须优先用异丙醇清洗, 或用脱离子水清洗. 对于其他清洗产品, 请咨询 3D PLUS. Doc. N : Page 14/28

15 6.2. SOP AND QFP PACKAGES SOP 和 QFP 封装 The use of any scotch tape (e.g. Kapton) on the side of the module during assembly is prohibited. 焊接装配过程中禁止在模块的任何一边使用胶带. A wide range of tin-lead solder paste is available in the industry. The solder alloy selected should be non-hazardous, mechanically reliable, thermal fatigue resistant, good wetting, and must be compatible with a variety of lead-bearing and surface coatings. 工业生产中适用的焊接料有很多种, 焊接料应选择机械性能可靠, 抗温变的, 湿润性好, 并且和表面漆兼容的合金. 3D PLUS recommends Sn 63 Pb 37 solder paste with melting point at 183 C (eutectic point), or Sn 62 Pb 36 Ag 2 solder paste with melting point at 179 C. 3D PLUS 建议使用熔点始于 183 C 的 Sn 63 Pb 37 作为焊接料 or 179 C 的 Sn 62 Pb 36 Ag 2 作为焊接料. Furthermore, 3D PLUS recommends the use of leads tinning as specified on annex 2. 3D PLUS 建议管脚镀锡程序如附件 2 所示. The temperature of soldering equipment must be defined so that the temperature, measured on body module, is below 215 C. If the profile exceeds the time-temperature limitations beyond the scope of this specification, 3D PLUS should be consulted. 焊接装配设备的温度曲线的设定必需确保模块表面侧面的温度低于 215 C, 超过此温度的限制须向 3D PLUS 咨询. Doc. N : Page 15/28

16 7. MODULES LEADS CUTTING 模块管脚切割 According to the ESA memo TEC-QT/2012/206/CV, in order to facilitate soldering and ensure solders reliability, the length of 3D PLUS modules leads should be kept below or equal to 3,10 mm, as illustrated below. Therefore, in case of greater length of leads, 3D PLUS recommends to cut the leads to ease the soldering process. 按照 ESA 备志录 TEC-QT/2012/206/CV, 为了方便手工焊接, 并确保焊料的可靠性, 模块管脚长度应不 3,10 毫米. 如果太长,3D PLUS 推荐切割管脚. Figure 4 : Modules leads cutting mechanical drawing Doc. N : Page 16/28

17 8. REFLOW PROFILE SPECIFICATIONS 回流焊曲线规格 The characterization and optimization of the reflow process is the most important factor to be considered for tin-lead soldering. The reflow process window (RPW) for conventional soldering is relatively wide. The melting point of the eutectic solder alloy is 183 C. The lower temperature limit for reflow is usually 200 C. The upper limit is 215 C, which is the maximum temperature that body package can be exposed to. 对回流焊曲线参数的设置和优化是焊接过程中最重要的因素 回流焊的温度变化范围比较广, 焊料的熔化点在 183 C. 焊接的低温限制通常是 200 C 焊接中的高温限制通常为 215 C, 与模块表面能承受的最高温度相同. These high and low temperature limits provide a process window of 15 C. 根据这些温度限制, 在同一时间整个焊装过程中板上温度差别应该控制在 15 C 内. Note : The major factors contributing to the development of an optimal thermal profile are the size and weight of the assembly, the density of the components, the mix of large and small components and the solder paste chemistry being used. The reflow profile determination should be performed by attaching calibrated thermocouples embedded in the solder balls of the BGA modules or in the leads of SOP/QFP modules, as well as in other critical locations on the board, to make sure that all the components are heated to temperature above the minimum reflow temperature and that the modules do not exceed their maximum temperature limit. 决定温度曲线设置的关键因素 : 装配的尺寸大小重量, 板上器件密度, 大小器件的混合程度以及焊接料化学成分. 曲线的分布测试过程应该使用电耦测温计. 测温计应深入到 BGA 器件的底部和 SOP/QFP 器件的管脚以及板上其它受热过快或过慢的区域, 一保证所有器件都受热都在规定范围内. Doc. N : Page 17/28

18 9. CONVECTION AND/OR IR REFLOW PROFILE RECOMMENDATIONS 对流回流焊和 / 或红外回流焊曲线参数设置建议 The reflow profiles studied and recommended by 3D PLUS are based on real tests to ensure that all packages can be successfully and reliably assembled. Figure 5 shows the range of temperature profiles and Table 3 lists the reflow parameters and peak temperatures as recommended by 3D PLUS. 以下回流焊曲线是 3D PLUS 基于经验建议, 适用于各种不同封装器件成功可靠的装配. 图 5 显示温度范围曲 线, 表 3 则列出 3D PLUS 推荐的回流焊的指标参数和可承受最高温度. Figure 5 : IR / Convection reflow profile Reflow parameter Sn-Pb Eutectic Assembly Minimum preheat temperature (Ts MIN ) 100 C Maximum preheat temperature (Ts MAX ) 150 C Preheat Time 60 to 120 seconds Ts MAX to T L ramp-up rate 3 C/second maximum Time above temperature T L = 183 C (t L ) seconds Body package peak temperature 210 C +5 C/-5 C maximum Time 25 C to T P 6 minutes maximum Time within 5 C of peak T P seconds Ramp-down rate 6 C/second maximum Table 3: Sn-Pb reflow profile recommendations Doc. N : Page 18/28

19 10. VAPOR PHASE REFLOW PROFILE RECOMMENDATIONS 汽相回流焊曲线参数设置建议 The reflow profiles studied and recommended by 3D PLUS are based on real tests to ensure that all packages can be successfully and reliably assembled. Figure 6 shows the range of temperature profiles and Table 4 lists the reflow parameters and peak temperatures as recommended by 3D PLUS. 以下回流焊曲线是 3D PLUS 基于实际测试, 适用于各种不同封装器件成功可靠的装配. 图 6 显示温度范围曲线, 表 4 则列出 3D PLUS 推荐的回流焊的指标参数和可承受最高温度. Figure 6 : Vapor phase soldering profile Reflow parameter Sn-Pb Eutectic Assembly Minimum preheat temperature (Ts MIN ) 100 C Maximum preheat temperature (Ts MAX ) 150 C Preheat Time 60 to 120 seconds Ts MAX to T L ramp-up rate 3 C/second maximum Time above temperature T L = 183 C (t L ) seconds Body package peak temperature 215 C maximum Time 25 C to T P 6 minutes maximum Time within 5 C of peak T P seconds Ramp-down rate 6 C/second maximum Table 4 : Sn-Pb reflow profile recommendations Doc. N : Page 19/28

20 11. MODULE REPLACEMENT RECOMMENDATIONS 模块更换建议 The replacement process for 3D PLUS SOP/QFP modules typically consists of the following steps: 3D PLUS SOP/QFP 模块更换处理包含以下步骤 : Thermal pre-heating depending on board structure 对板的结构进行预热 Manual removal of the defective component 手动拆卸损坏的部件 Cleaning of the area 清洗取下部件后的区域 Solder replenishment or flux application 补充焊料或应用助焊剂 New component placing 放置新的器件 Manual or automatic reflow soldering 手动或自动回流焊 Post-reflow inspection 回流焊后检测 MANUAL MODULE REMOVAL 手动拆卸模块 Solder from each lead shall be removed with the soldering iron and desoldering braid to remove solder, 每个管脚的焊料应用烙铁和吸锡带去除 Soldering iron temperature is +310 C maximum for SOP and QFP package, SOP 和 QFP 封装的模块, 烙铁的温度不能超过 +310 C. Module has to be carefully removed from the board, 必须仔细小心地拆卸模块. For these steps, the recommended flux is: Pure Rosin Flux (ROL 0); solvent : Isopropylic Alcohol. 以上步骤中, 推荐使用 : 纯松香焊剂 (ROL0); 溶剂 : 异丙醇 MODULE REPLACEMENT 模块替换 After cleaning the pads and the leads of the removed module, a new module may be resoldered on the board according to the reflow guidelines (see 9-10 of this document), or manually with a soldering iron temperature at +310 C maximum, with a maximum soldering duration time of 4s per lead. 清洗取下模块后的焊盘和管脚, 用一个新的模块根据回流焊曲线 ( 见此文档的 9-10) 重新焊接, 或手动焊接, 但是焊接的烙铁温度不超过 C 和每个管脚受热时间不超过 4 秒. Doc. N : Page 20/28

21 The replacing module should be baked prior to reflow if they have been exposed to moisture (see 5 of this document). 用于再加工的模块如一旦受湿, 需要在回流焊前进行烘焙 ( 见此文档的 5) Module cleaning after assembly must be done with isopropylic alcohol preferentially, or with deionized water otherwise. For other cleaning products, please consult 3D PLUS for further information. 装配后的模块清洗应优先采用异丙醇清洗, 或用脱离子水清洗. 对于其它的清洗材料, 请见 3D PLUS 进一步的信息. Doc. N : Page 21/28

22 12. MODULE REINFORCEMENT RECOMMENDATIONS 模块加固建议 To guarantee a high level of mechanical requirements (vibrations, accelerations, and shocks), modules may be reinforced with epoxy adhesive products. 3D PLUS recommends the use of 3M 2216B/A Gray Scotch- Weld epoxy adhesive. Eccobond 285 with catalyst 11 seems to be a good alternative, with greater workability and closer CTE to module s, but it has only been tested on one 3D PLUS product. 为满足高水平的机械要求 ( 振动, 加速度, 冲击 ), 可用环氧胶粘剂对模块进行加固. 3D PLUS 推荐使用 3M 2216B/A Gray Scotch-Weld. Eccobond 285 与 Catalyst11 也是一个很好的选择, 有更大的流动性和接近模块的热膨胀系数, 但它只是在一个 3D 产品进行测试过. Two methods using epoxy adhesives are proposed : 使用环氧胶粘剂的两种方法 : Module s underfilling 模块的底部填充 Module s side staking 模块的侧面加固 For further information on the process, please refer to [RD3] [RD4] for SOP modules. 关于这个过程的进一步信息, 请见 [RD3] [RD4]. These documents are available on 3D PLUS website or on demand. 这些文档可以在 3D PLUS 网站上下载或直接提供. For mechanical reinforcement of QFP package modules, or for any other questions, please contact 3D PLUS. 有关 QFP 封装模块的机械加固或其它任何问题, 请与 3D PLUS 联系. Doc. N : Page 22/28

23 13. MODULE TINNING RECOMMENDATIONS 模块镀锡建议 Upon customer request, modules may be delivered with tinned leads. 根据客户的要求,3D PLUS 可以镀锡模块管脚. Caution: Tinned leads are sensitive to oxidation. Storage conditions and duration impact modules tinning quality and solderability. 3D PLUS does not guarantee its tinned modules solderability after delivery. 镀锡管脚很易氧化. 储存条件和时间影响模块的镀锡质量和可焊性. 3D PLUS 不保证交货后其镀锡模块的可焊性. Consequently, 3D PLUS modules should be tinned right before assembly (see annex 2 for more information on the tinning process). 因此, 3D PLUS 模块最好在装配之前才镀锡管脚. ( 见附件 2: 更多的镀锡处理信息 ). 14. BOARD COATING RECOMMENDATIONS 电路板涂层建议 Upon customer request, modules may be delivered coated with MAPSIL 213B, SOLITHANE 113 or ARATHANE In that case, customers must check the compatibility of module coating products with their products. 根据客户要求, 模块交货时可能加有 MAPSIL 213B, SOLITHANE 113 或 ARATHANE 5750 的涂层. 此情况下客户须检验此类涂层与其他客户选用的涂层的兼容性. Note that ARATHANE 5750 is not covered by 3D PLUS Process Identification Document. 注意 : 3D PLUS Process Identification Document 不包括 ARATHANE Doc. N : Page 23/28

24 15. ANNEX 1 : CARRIERS DESCRIPTION 附件 1 : 承载物描述 HIGH TEMPERATURE CARRIERS DESCRIPTION 高温承载物描述 Figure 7 : 3D PLUS plastic tray for modules 用于模块放置的塑料拖盘 Figure 8 : Maximum baking temperature indication on trays 可耐最高烘焙温度为 135 C Figure 9 : 3D PLUS plastic mini-tray for modules 3D PLUS 模块 mini 塑料托盘 Doc. N : Page 24/28

25 15.2. LOW TEMPERATURE CARRIERS DESCRIPTION 低温承载物描述 Figure 10 : 3D PLUS plastic box for modules 用于模块放置的塑料盒 Doc. N : Page 25/28

26 16. ANNEX 2 : LEADS TINNING 附件 2 : 管脚镀锡 MATERIAL 材料 In order to tin the leads of 3D PLUS modules, one shall need: 为了镀锡 SOP 封装模块的管脚, 应该用 : An oven at +125 C or a heating plate 烤箱或加热板, 温度 125 C A degolding bath of Sn 62 Pb 36 Ag 2 (or Sn 63 Pb 37 ) heated at 230 C 250 C. A large bath has to be used (at least 20cl or 200cc) in order to maintain a relatively low concentration of gold after the treatment of several hundreds of modules. 去金焊锡槽 62Sn36Pb2Ag( 或 63Sn37Pb), 温度 C A tinning bath of Sn 62 Pb 36 Ag 2 (or Sn 63 Pb 37 ) heated at 230 C 250 C 镀锡焊锡槽 62Sn36Pb2Ag( 或 63Sn37Pb), 温度 C Flux : ROL 0 or ROL 1 flux ROL 0 或 ROL1 助焊剂 Isopropyl alcohol (IPA) 异丙醇 MODULES PREPARATION 模块准备 After sealed bag opening, 3D PLUS modules have to be baked 24 hours at 125 C. If taken out from a dry cabinet within their storage cycle (see 5.2. Storage Recommendations: dry cabinet storage section), one might proceed to degolding step right away. 密封袋口打开后,3D PLUS 模块要在 125 C 温度下烘烤烤 24 小时, 如果在存储循环干燥箱中取出 ( 见 5.2 储存建议 : 干燥箱存储区 ), 可以直接继续去金步骤. In the following steps, the modules must be warm at all times, taking out the parts one by one from oven, or at least by keeping them warm on a heating plate at 125 C. 在接下来的步骤中, 从烤箱中一件一件取出的模块必须随时保暖, 或者至少放在在 125 C 的加热板上保暖 DEGOLDING 去金 Flux the modules leads by dipping them in a flux bath or by using a brush, 管脚在助焊剂槽中浸泡或用刷子上助焊剂 Dip the leads for 2-4 seconds per row inside a solder bath of Sn 62 Pb 36 Ag 2 (or Sn 63 Pb 37 ) heated at 230 C C. 将每排管脚在 62Sn36Pb2Ag ( 或 63Sn37Pb) 焊锡槽中浸泡 2-4 秒, 温度 C. The dipping is made row by row. The epoxy body of the module must not be in contact with the liquid solder bath. 浸泡须一排一排的进行 模块的环氧体不能和液体的上表面接触. 3D PLUS recommends to proceed to tinning (see 16.4) after a 10-second transition time, however a storage for a short time (1 2 minutes at 125 C on a heating plate) before pre-tinning is possible. Doc. N : Page 26/28

27 3D PLUS 要求等待十秒钟后才进行镀锡的步骤 ( 见 16.4), 然而, 在镀锡前将模块短时间存放 ( 在加 热盘上 125 C 1-2 分钟 ) 是可以的 TINNING 镀锡 Flux the leads 用助焊剂处理管脚 Dip the leads for 2-4 seconds per row inside a solder bath of Sn 62 Pb 36 Ag 2 (or Sn 63 Pb 37 ) heated at 230 C C. The dipping is made row by row within a maximum time of 3-4 seconds per row. The epoxy body of the module must not been in contact with the upper surface of the liquid bath, 将每排管脚在 62Sn36Pb2Ag ( 或 63Sn37Pb) 焊锡槽中浸泡 2-4 秒, 温度 C. 浸泡须一排一 排的进行, 每排浸泡时间最多不超过 4 秒. 模块的环氧体不能和液体的上表面接触. Clean the leads with Isopropyl alcohol 用异丙醇清洗管脚 Doc. N : Page 27/28

28 16.5. TINNED LEAD GEOMETRY 镀锡的管脚几何图 The leads will be tinned in accordance with the following drawing : the tin limit must be within 500μm from the bottom of the module : 管脚的镀锡应参照如下图片 : 锡的限度从模块底部 0μm~500μm. Figure 11 : Tinning zone limit drawing 镀锡区域图 VISUAL INSPECTION CRITERIA 外观检测标准 a) No traces (tooling marks, scratches ) on the module sides, 模块表面无痕迹 ( 加工痕迹, 刮痕等 ) b) No «solder splash» on the module sides, 模块表面无焊料飞溅点 c) No tin on the bottom of the module, 模块底部无锡 d) No damaged leads, 无损坏的管脚 e) No contaminants on the module, 模块表面无污物 f) Respect of the tin limit (see 16.5 above), 遵照镀锡的限度规定 ( 参照上图 16.5) g) No flux traces on the leads, 管脚上无焊剂痕迹 h) Tin aspect must be smooth and bright. 锡的表面须光滑明亮 Doc. N : Page 28/28