PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: para@para.com.tw http://www.para.com.tw DATA SHEET PART NO.: L-T3014WDT-CW2 REV: A / 0 CUSTOMER S APPROVAL : DCC : DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 1 of 15 PARA-FOR-065
Features Top view, Wide view angle, White color PLCC 2 package SMD LED. EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001). Compatible with automatic Pick & Place equipment. Compatible with IR Reflow soldering and TTW soldering. Pb free product and acceptable lead-free process. Meet RoHS Green Product Application Backlighting (LCD, Switches, keys, displays, illuminated advertising) lighting / Signal and symbol luminaries. Package Outline Dimensions Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.10mm (.004") unless otherwise noted. DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 2 of 15
Chip Materials Dice Material : InGaN Light Color : Cool White Lens Color : Light Yellow Diffused Absolute Maximum Ratings(Ta=25 ) Symbol Parameter Rating Unit PD Power Dissipation 100 mw IPF Peak Forward Current 100 ma (1/10 Duty Cycle, 0.1ms Pulse Width) IF Continuous Forward Current 35 ma VR Reverse Voltage 5 V ESD Electrostatic Discharge Threshold (HBM) Note A 1000 V Topr Operating Temperature Range -40 ~ + 85 Tstg Storage Temperature Range -40 ~ + 85 *Duty1/10 @1KHZ Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Min. Typ. Max. Unit Test Condition Luminous Intensity IV 2600 3000 mcd IF=30mA Viewing Angle 2 1/2 / 120 / Deg / Forward Voltage VF 3.3 3.6 V IF = 30mA Reverse Current IR / / 10 A VR = 5V Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. *Forward voltage measurement allowance i *Luminous Intensity Measurement Allowance is 10%. *Dominant Wavelength measurement allowance is 1nm. *2 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. *Please see attachments for BIN classifications.. DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 3 of 15
Typical Electro-Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) 50 Ta=25 Forward Current IF(mA) 40 30 20 10 Relative Luminous lntensity Normalized of 30mA Ta=25 Fig.1 Forward Current vs.forward Voltage 0 0 20 40 60 80 100 Ambient Temperature Ta( ) Fig.2 Forward Current Derating Curve Fig. Relative Luminous Intensity vs.forward Current Relative luminous intensity 2 1 0.5 0.2 0.1-40 -20 0 20 40 IFP=30mA 80 100 Ambient Temperature Ta( ) Fig.4 Luminous Intensity vs.ambient Temperature 1.0 0.9 0.8 0.7 0 10 20 Fig.5 Spatial Distribution 30 40 50 60 70 80 0.5 0.3 0.1 0.2 0.4 90 0.6 Allowable Forward Current IFP(mA) 200 100 50 30 20 10 1 Ta=25 5 10 20 50 100 Ambient Temperature Ta( ) Fig.6 Forward Current Derating Curve IFP=60mA IFP=30mA IFP=5mA IFP=30mA 0 25 50-30 Ta=25 30mA 5mA 10mA 85 50mA 70mA Ambient Temperature Ta( ) Fig.7 Ambient Temperature vs.forward Voltage x Fig.8 Ambient Temperature vs.chromaticity Coordinate x Fig.9 Forward Current vs.chromaticity Coordinate DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 4 of 15
Fig.1 Relative Intensity vs. Wavelength IV Bin Code List Luminous Intensity(IV), Unit:mcd@30mA (lm) Typ. H18 2600 2900 8.5 H19 2900 3250 9.4 H20 3250 3600 10.5 VF Bin Code List Forward Voltage(VF),, Unit:V@30mA BINCODE MIN MAX 16 3.10 3.20 17 3.20 3.30 18 3.30 3.40 19 3.40 3.50 20 3.50 3.60 21 3.60 3.70 *Tolerance of each bin are±0.1volt DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 5 of 15
Bin Range of Chromaticity Coordinates @ 30mA Rank L1 Rank L2 x 0.314 0.302 0.3042 0.3153 x 0.3153 0.3042 0.3067 0.3167 y 0.352 0.3385 0.3271 0.339 y 0.339 0.3271 0.315 0.3259 Rank L3 Rank L4 x 0.3167 0.3067 0.309 0.3181 x 0.3181 0.309 0.3106 0.3192 y 0.3259 0.315 0.3041 0.3138 y 0.3138 0.3041 0.2955 0.3049 Rank M1 Rank M2 x 0.3287 0.3141 0.3153 0.3288 x 0.3288 0.3153 0.3167 0.3290 y 0.3658 0.352 0.339 0.3525 y 0.3525 0.3390 0.3259 0.3387 Rank M3 Rank M4 x 0.3290 0.3167 0.3181 0.3293 x 0.3293 0.3181 0.3192 0.3294 y 0.3387 0.3259 0.3138 0.3247 y 0.3247 0.3138 0.3049 0.3143 Rank N1 Rank N2 x 0.3477 0.3287 0.3288 0.3465 x 0.3465 0.3288 0.329 0.3452 y 0.3806 0.3658 0.3525 0.368 y 0.368 0.3525 0.3387 0.3528 Rank N3 Rank N4 x 0.3452 0.329 0.3293 0.3438 x 0.3438 0.3293 0.3294 0.3428 y 0.3528 0.3387 0.3247 0.3378 y 0.3378 0.3247 0.3143 0.3254 CIE Chromaticity Diagram * Measurement of Color coordinates : +/- 0.01 DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 6 of 15 PARA-FOR-06
Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P17 IV--- Luminous Intensity Code VF--- Forward Voltage Code CIE--- Color Rank Code LOT NO: E L P 7 8 0001 A B C D E F A---E: For series number B---L: Local F: Foreign C---P: PLCC SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 2000pcs max for T670 series 2000pcs max for T650 series 2000pcs max for S020 series 3000pcs max for T3014 series DATE CODE 2007 08 02 G H I G--- Year H--- Month I --- Day DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 7 of 15
Reel Dimensions Notes: 1. Taping Quantity : 2000pcs/reel 1500pcs/reel 2. The tolerances unless noted is 0.1mm, Angle 0.5, Unit: mm. Suggest Soldering Pad Dimensions(unit=mm) DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 8 of 15
Package Dimensions Of Tape And Reel Notes: All dimensions are in millimeters. Packaging Of Electronic Components On Continuous Tapes DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 9of 15
\ Moisture Resistant Packaging??.jpg \??.jpg H:\SMD\SMD\SMD \??.jpg H:\SMD\SMD\SMD \ H:\SMD\SMD\SMD Label Reel Label Aluminum moistue-proof bag Desiccant 240 210 H:\SMD\SMD\SMD??.jpg 435 145 255 Label Box Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. Cleaning If cleaning is required, use the following solutions for less than 1 minute and less than 40. Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.) Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be confirm whether any damage to the LEDS will occur. DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 10 of 15
Suggest reflow Soldering temperature profile: DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 11 of 15
CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30 C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30 C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65 5. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150 C, 120sec. MAX., Peak temperature : 240 C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350 C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don t to touch LED lens when soldering. DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 12 of 15
4. Lead-Free Soldering For Reflow Soldering : 1 Pre-Heat Temp: 150-180,120sec.Max. 2 Soldering Temp: Temperature Of Soldering Pot Over 240,40sec.Max. 3 Peak Temperature: 2 0 10sec. 4 Reflow Repetition: 2 Times Max. 5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1 Iron Tip Temp: 350 Max. 2 Soldering Iron: 30w Max. 3 Soldering Time: 3 Sec. Max. One Time. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6. Reliability 1 Criteria For Judging The Damage Item Symbol Test Conditions Criteria for Judgement MIN. Max. Forward Voltage VF IF=30mA - U.S.L.*) 1.1 Reverse Current IR VR=5V - U.S.L.*) 2.0 Luminous Intensity IV IF=30mA L.S.L**) 0.7 - U.S.L.: Upper Standard Level **) L.S.L: Lower Standard Level DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 13 of 15
2 Test Items And Results Test Item Resistance to Soldering Heat (Reflow Soldering) Solder ability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Condition Steady State Operating Life of High Humidity Heat 7.Others: Reference Standard JEITA ED-4701300 301 JEITA ED-4701300 303 JEITA ED-4701300 307 JEITA ED-4701100 105 JEITA ED-4701200-201 JEITA ED-4701100 103 JEITA ED-4701200 202 Test Condition Tsld=260,10sec. (Pre treatment 30,70%,168hrs) Tsld=215,3sec. (Lead Solder) -40 ~ 100 30min. 30min. -40 ~ 25 ~100 ~25 30min. 5min. 30min. 5min Note Number of Damaged 2times 0/50 1time over 95% 0/50 100cycles 0/50 100cycles 0/50 Ta=100 1000hrs. 0/50 Ta=60,RH=90% 1000hrs. 0/50 Ta=-40 1000hrs. 0/50 Ta=25,IF=30mA 1000hrs. 0/50 Ta=85,RH=85%,IF=30mA 500hrs. 0/50 The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 14 of 15
Part No. : L-T3014WDT-CW2 REV: A /0 PART NO. SYSTEM : L T 67 0 W D T (Z) - X X X X XXXX : Special Code (Such as CCT Luminous or others) Z: With zener (It not be showed if with no zener ) T : Taping for 7 inch reel Lens color C : Water Clear W : White Diffused D : Color Diffused KY : 9mil AlInGap 590nm Super Yellow KR : 9mil AlInGap 630 nm Super Red TE(HE) : 14mil AlInGap 624 nm Super Red TY(HY): 14mil AlInGap590 nm Super Yellow LB : InGaN ITO rough 470nm Blue LG(SG) : InGaN ITO rough520nm Green W : InGaN + YAG White color 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(full color) T :PLCC Top View Type S : Side View Type 650 : 3020 1.3T TYPE 670 : 3528 1.9T TYPE 020 : 3812 0.6T TYPE 680: 5630 0.9T TYPE 690: 5050 1.5T TYPE 3014: 3014 0.8T TYPE DRAWING NO. : DS-7D-11-0002 DATE : 2011-5-5 PAGE 15 of 15