-. APP00 各部功能介紹 : 如下圖所示本實驗板功能區分大致可分為以下幾個區塊, 重要項目將各別提出說明 : Block_A Block_B Block_C Block_D Block_E Block_F Block_G BLOCK_H 說明 : Block_A: 電源輸入及串列通信連接埠 :

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Download "-. APP00 各部功能介紹 : 如下圖所示本實驗板功能區分大致可分為以下幾個區塊, 重要項目將各別提出說明 : Block_A Block_B Block_C Block_D Block_E Block_F Block_G BLOCK_H 說明 : Block_A: 電源輸入及串列通信連接埠 :"

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1 MICROCHIP EVM Board:APP00 Ver. -. PP00 Ver. 多工能實驗板介紹 : PICmicro Microchip APP00 0pin PDIP PICmicro Design Tips Character LCMTemperature Sensor Application I/O Pin 9 I/O Extension Interface MPLAB ICD Debugger, Flash PICmicro, APP00 Ver., 0 Pin MCU

2 -. APP00 各部功能介紹 : 如下圖所示本實驗板功能區分大致可分為以下幾個區塊, 重要項目將各別提出說明 : Block_A Block_B Block_C Block_D Block_E Block_F Block_G BLOCK_H 說明 : Block_A: 電源輸入及串列通信連接埠 :

3 Block_B:ICD 連接埠及 MCU 對其週邊電路連接控制區 : MCU DIP SW. ICD ICD Module MCU Debug Reset Reset Microchip MCP0 Device Block_C:MCU 擴充介面及洞洞板電路實驗區 : MCU Interface SOT- pin pin PAD Block_D: 系統電源電路區 : 0 IC MICROCHIP Analog Device.. TC0 PWM/PFM Step-Down Combination Regulator/Controller Switching Power V Jump DC 9V Block_E: 字元型 LCM 顯示及外部電壓輸入及消耗電流量測區 : LCM VR Block_F: 串列通信介面 Transceiver,EEPROM, 及各裝置 Jump 連接區 :.RS-(MAX) / RS-(SN).CAN BUS(MCP).MICROCHIP (I C ) (SPI )EEPROM. Jump LED Hz Real time clock

4 Block_G: PWM RB0 x Keypad Keypad A/D Convertor A/D X Keypad

5 A B C D E F G H I J K L M N O P Q R S T U V U.

6 JP JP JPA J J J J9 JP JP JP J J J0 JPCCP DIP SW. x

7 RTS C uf uf C 0 9 U TIN TIN ROUT ROUT V- MAX C C- V C C- TOUT TOUT RIN RIN GND C uf R_TXD R_CTS R_RXD R_RTS C uf R 0 /W R 0 /W R 0 /W R 0 /W J X.mm R K /W CON DB9-FRS RS-C TXD RXD CTS J X.mm J X.mm CON HEADER U9 D DE R RE A B SN DIP

8 CTS RTS pin Jump J Hz pin CTS RTS pin Jump RTS MCU RC CTS RC0 J RS- select Jump RS- pin Jump CTS pin J RS- RS- RS- RS- CON RJ- P CANRX CANTX U0 RXD TXD CANH CANL CON9 REF GND RS RJ- P MCP DIP R 0K /W CON0 MOLEX P R 0 /W JP P.mm CAN Terminator

9 Vcc Vcc RP.K 9P C LC_A0 LC_A LC_A U CS VDD SO HOLD WP SCK VSS SI LC0 DIP SPI EEPROM SDO RA/SS SDI/SDA SCK/SCL J0 CON MOLEX P J9 X.mm X.mm SDI/SDA SCK/SCL SDO RA/SS T_SDA T_SCL WP SCL SDA U A0 A A GND LC0 DIP IC EEPROM U IC Temperature Sensor LC_A0 LC_A LC_A TCA-.0VCT SOT-P J X.mm

10 AN0 AN LCD_E Vref ERA RA/SS ERC0 ERC DSW 0 9 RA0 RA RA RA RA RA RC0 RC BUZZER SCL SDA SDO TX RX CANTX CANRX DSW 0 9 RC RC RC RC RC RC RB RB ERD0 ERD ERD ERD ERD ERD ERD ERD DSW 0 9 RD0 RD RD RD RD RD RD RD SW DIP- SW DIP- SW DIP-

11 Voltage Reference Vref.09V Vref C 0.uF U VIN VOUT VSS MCP TO9 A C0.uF TC Vref R K % R.K % A L uh /W L uh /W R.K % Vout = 0V (0C) ~ V (00C) AN 0V ~ V UA MCP0 DIP - R0 9.K % Temp. Input = 0.V (0C) ~.V(00C) R9.K % UB MCP0 DIP A - Voffset =0.V C 0.uF Temperature Sensor C.09V 0.uF U Vdd Vss Out TC0A SOT AN0 0V ~ V C 00pF VR 0K VR Vout= [-Voffset (R0/R9)] [Temp. Input (R9R0)/R9] Temperature = 0C, Vout (0C)= -0.V * 0.V * = 0V Temperature = 00C, Vout = -0.V *.V * = V

14 U Vcc R RD0 RD RD RD RD RD RD RD 9 0 K /W OSC HEADER JICD AN0 AN LCD_E Vref ERA RA/SS ERC0 ERC R 0 /W 0 HEADER JICD 9 DSW RC RC Vdd Vss CON RJ- P Vdd RA MCLR/Vpp U JICD DSW RA/AN/VREF- 9 0 RD0/PSP0 RD/PSP RD/PSP RB/PGC RB/PGD 9 0 OSC/CLKOUT RD/PSP RD/PSP RD/PSP RD/PSP RD/PSP RA0 RA VPP RA PVPP RA RA RA RC0 RC PGC PPGC 0 PGC PGD VDD RST VSS VPP MCP0-0DI/TO R 0 /W CPURST 9 OSC JP P.mm X OSC/CLKIN SW DIP- C P RE0 RE RE RE0/RD/AN RE/WR/AN RE/CS/AN CRST P SW Tog. SW RA0/AN0 RA/AN RA/AN/VREF RA0 RA RA R.M /W RC/CCP RC/CCP PGD PPGD RC/SDO RC/SDI/SDA RC/SCK/SCL RA/AN/SS/LVDIN RB/INT RC RC RC RC RC RC RB RB 0 RB/INT RB/CCP RB RB/PGM 9 BUZZER SCL SDA SDO TX RX CANTX CANRX JP P.mm MHz C P JP P.mm RB RB RB RB RC RC RC RA RB HEADER OSC NC CPUCLK RC RC RC0 SW DIP- VSSOUT RA RA/TOCKI RC/RX/DT RC/TX/CK RCO/TCKI CON MHZ RC RB0 RBO/INT0 Vss PICF DIP0 RB RB RB RB RB RB RB RB0 /MCLR RA0 RA RA RA RA RA RE0 RE RE RD RD RD RD RC RC RC RC RD RD OSC OSC RC0 RC RC RC RD0 RD MOLEX P Com.sch J DSW JP0 SDO CTS RTS ERD0 RD0 RB RTS SDO ERD RD PWM RTS SDA ERD RD RC SDI/SDA ERD RD AN0 RXD SCL X.mm ERD RD P.mm PWM RXD SCK/SCL ERD RD AN TXD RA/SS X ERD 0 RD TXD RA/SS ERD 9 RD CON Vref CTS CANTX C.K SW DIP- CTS CANTX CANRX C R CANRX P MOLEX P Com. Module_ P K /W LCD.sch D ERD0 R ERD ERD0 N00 ERD ERD /W ERD ERD D9 ERD ERD JP P.mm ERD ERD RA R 0 /W R K /W ERD ERD Q LED ERD ERD C LCD_E ERD.K /W SW Tog. SW RB LCD_E R D0 RB0 RB N00 LCD Module_ BZ C 0.uF.K /W ADC.SCH AN0 AN Vref ADC Module_ J 0X.mm Vcc C 0.uF R0 K /W R9 0 /W R /W R V SW Tog. SW BUZZER BUZZER K /W D LED ERA J J CON Q C V R.K /W C 0.uF R Out Vss Vdd CON P mm MOLEX P.K /W V LM0 TO9 L uh U X.mm JPA X.mm JP P.mm P.mm R K /W VIN LX EXTW EXT CPC GND SHDN/SS SENSE ~ CON D LED R K /W C 0.uF TC0XX0 - Title CON P mm APP00 PICmicro Evaluation Board C 0uF V D N9 C9 0.uF C 0uF V ~ Power Jack.mm BD Size Document Number Rev Main MCU Circuit.0 BRIDGE Date: Wednesday, February, 00 Sheet of

15 JP P.mm CON RS-C R 0 /W J DB9-FRS R K /W X.mm U9 CON D DE R RE A B SN DIP RJ- P CON9 U0 CANH CANL RXD TXD RJ- P REF GND RS U MCP DIP CON0 R 0K /W CS VDD SO HOLD WP SCK VSS SI LC0 DIP MOLEX P SPI EEPROM R 0 /W J U LC_A0 LC_A LC_A JP P.mm X.mm A0 A A GND WP SCL SDA LC0 DIP IC EEPROM U T_SDA T_SCL Title TCA-.0VCT SOT-P APP00 PICmicro Evaluation Board Size Document Number Rev Communication Circuit.0 IC Temperature Sensor Date: Wednesday, February, 00 Sheet of C U uf C uf V C C C uf C- C- R_TXD 0 TIN TOUT R_CTS TIN TOUT R_RXD 9 ROUT RIN R_RTS ROUT RIN C V- GND R 0 /W MAX R 0 /W uf R 0 /W R 0 /W J CON HEADER X.mm J X.mm RP.K 9P C LC_A0 LC_A LC_A SDI/SDA SCK/SCL SDO RA/SS CON MOLEX P J9 X.mm J0 X.mm RTS CANRX CANTX Vcc TXD RXD CTS SDO RA/SS SDI/SDA SCK/SCL

16 VR 0K VR R9 0K /W R K /W JP P.mm R0 0 /W LCD Vss Vcc Vee RS R/W E 9 DB0 LCD Display Module DB 0 DB DB x Charactor DB DB DB DB BL Ctrl Vss RB R.K /W R.K /W LCD_E JP9 P.mm R.K /W Q C X.mm RA0 ERD0 ERD ERD ERD ERD ERD ERD ERD JP P.mm R 0K /W R9 0K /W R0 0K /W R 0K /W D LED D LED D LED D LED D 9 RP C 0 9P R K K K LED D 0K /W R Tog. SW K K Tog. SW K Tog. SW LED D.K /W Tog. SW R K K Tog. SW K9 Tog. SW LED D.K /W Tog. SW Tog. SW Tog. SW LED Title APP00 PICmicro Evaluation Board Size Document Number Rev LCD, LED and Keypad Circuit.0 Date: Thursday, February, 00 Sheet of

17 Voltage Reference Vref.09V Vref C 0.uF U VIN VOUT VSS MCP TO9 A C0.uF TC Vref R K % R.K % A L uh /W L uh /W R.K % Vout = 0V (0C) ~ V (00C) AN 0V ~ V UA MCP0 DIP - R0 9.K % Temp. Input = 0.V (0C) ~.V(00C) R9.K % UB MCP0 DIP A - Voffset =0.V C 0.uF Temperature Sensor C.09V 0.uF U Vdd Vss Out TC0A SOT C 00pF Vout= [-Voffset (R0/R9)] [Temp. Input (R9R0)/R9] AN0 0V ~ V VR 0K VR Temperature = 0C, Vout (0C)= -0.V * 0.V * = 0V Temperature = 00C, Vout = -0.V *.V * = V Title APP00 PICmicro Evaluation Board Size Document Number Rev Analog Circuit / Temperature Sensor.0 Date: Thursday, February, 00 Sheet of

18 附錄 B: 相關參考資料 Datasheet Microcontroller:PICFXX

19 RS- Transceiver:MAX

20 RS- Transceiver:SN

21 CAN Transceiver:MCP

22 I C Interface Temperature Sensor:TC

23 Precision Temperature-to-Voltage Converter:TC0A

24 .V and.09v Voltage References:MCP

25 Microcontroller Supervisory Circuit with Open Drain Output:MCP0

Microsoft Word - WAP001 Workshop Board 中文 Manual VER.3.doc

Microsoft Word - WAP001 Workshop Board 中文 Manual VER.3.doc MICROCHIP EVM Board:APP00 Ver..0 補充資料 APP00 Version.0 所做之重要功能修正或提升 A. 增加與 PICkit ICD LE 等 Debugger/Programmer 相容的 -pin.mm 單排排針介面, 增加使用的彈性 B. 增加 PICFXXXX J 系列之 support, 經由 JP0 可以選擇要使用 PICF J Family 或是標準的