MG115 BLE iBeacon

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1 MG127 BLE Transceiver Application Note Revision History: Rev. No. History Issue Date Remark 0.1 Initial issue April 29, 2016 Preliminary 0.2 Update ch10 about PCB July 11, 2016 Preliminary 0.3 Update MISO description Jan 19, 2017 Preliminary 1.0 Add receive characteristic Jan 31, 2018 Release 1.1 Update receive characteristic April 2, 2018 Release 1.2 Update reflow profile May 24, 2018 Release 1.3 Add carrier output July 25, 2018 Release Important Notice: MACROGIGA reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice. MACROGIGA integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use in such applications is done at the sole discretion of the customer. MACROGIGA will not warrant the use of its devices in such applications.

2 目录 1. 概述 MG127 管脚描述 数据和控制接口 寄存器信息 应用电路原理图 电气特性 功耗指标 MG127 封装 Reflow Profile PCB 布线注意事项 载波输出 FAQ...11

3 1. 概述 MG127 是低功耗 低成本的 BLE 收发器, 内部集成了发射机 接收机 GFSK 调制解调器和 BLE 基带处理 MG127 采用 DFN3x3 封装, 只需搭配低成本 MCU 和少数外围被动器件, 即可实现 BLE 遥控 蓝牙电子秤等应用 电源电压 1.9~3.6, 可以采用一个纽扣电池 (3.0v) 供电 3uA 待机电流 持续发射 18mA 持续接收 DFN3x3 封装, 外围 BOM 很少只需低成本 MCU 配合 2. MG127 管脚描述 MG127 采用 DFN10 封装, 芯片大小为 3mm x 3mm Pin No. Symbol I/O Function Description 1 SCK DI SPI Clock 2 DVDD Power Digital VDD 1.2v Output 3 MOSI DI/DO SPI Slave Data Input/Output 4 XTALO AO Crystal Pin 5 XTALI AI Crystal Pin 6 ANT RF Antenna interface 7 VBAT Power Power Supply 8 IRQ DO Interrupt pin 9 CT DI Test use 10 CSN DI SPI Chip Select 11* GND Ground Power ground, back panel Table2.1 Pin Description

4 3. 数据和控制接口 MG127 通过 3 线 SPI 接口和 IRQ 信号与 MCU 进行通信, 接口包括以下信号 : IRQ (this signal is active low and is controlled by maskable interrupt sources) CSN (SPI signal) SCK (SPI signal) MOSI (SPI signal) 其中 MOSI 信号用于输入和输出 MCU 可以用 3 个 GPIO 模拟 SPI, 我们提供 3 线 SPI 的参考 C 源码 Figure3.1 SPI timing diagram Symbol Parameters Min. Max Unit Tcc CSN to SCK setup 2 - ns Tch SCK high time 40 - ns Tcl SCK low time 40 - ns Tcwh CSN inactive time 50 - ns Tcch SCK to CSN hold 2 - ns Tdc Data to SCK setup 2 - ns

5 Tdh SCK to Data hold 2 - ns 4. 寄存器信息 可以通过 SPI 访问这些寄存器 Address (Hex) Mnemonic Bit Reset Value Description 01 CH_NO BLE channel 7:6 0 reserved 5:0 0 BLE advertise channel number(37,38,39) 02 MODE_TYPE ADV/Data Tx/Rx mode 7:4 0 reserved 3 1 Adv event 2 0 Tx enable 1: Rx enable 03 ADV_HDR_TX Advertise Pdu Header for Tx 15:8 0 Pdu length 7:0 0 Pdu type 04 ADV_HDR_RX Advertise Pdu Header for Rx 15:8 0 Pdu length 7:0 0 Pdu type 07 START_TIME Tx/Rx start time 23:0 0 Start time 0E INT_FLAG Interrupt mask and flag 15:8 0 Interrupt mask bit 7 0 Pdu Header OK 6 0 Pdu OK 5 0 Pdu Err 4 0 Tx_Start

6 3 0 Mode Err 2 0 Rx Timeout 1 0 Enter Sleep 0 0 Woken up 0F SLEEP_WAKE Sleep / wakeup configuration 31:8 0 Wake up time 7:2 0 reserved 1 0 Enable sleep 0 0 Enable wakeup 10 CLK_CNT LF clock counter and HF clock counter 47:24 0 LF clock counter 23:0 0 HF clock counter 11 TIMEOUT TX/RX TimeOut (us) 16 1 Disable Timeout 15:8 1 Timeout time byte1 7:0 2c Timeout time byte0 A0 TX_PLD TX Data Payload, MaxLen is 31 Bytes Table 4.1 Register Map 5. 应用电路原理图 下图是 MG127 的典型应用电路原理图

7 Figure5.1 example application schematic 6. 电气特性 Conditions: VDD = +3V, VSS = 0V, TA = - 40ºC to + 85ºC Symbol Parameter Notes Min. Typ. Max. Unit Operating Conditions VDD Supply voltage V TEMP Operating Temperature Transmitter Operation PRF Maximum output power +4 dbm Receiver Operation RXSENS Sensitivity (0.1% BER) -85 dbm Table 6.1 Electrical Specification 7. 功耗指标 下表是在 3.0V 供电情况下,MG127 典型的功耗情况.

8 Mode Description Total Typical Current at 3.0v Standby 待机状态下电流, 通过 spi 唤醒 3 ua Sleep 待机电流, 不发射不接收 50 ua TX active 持续发射 20 0dBm output power RX active 持续接收 18 ma Table 7.1 Current Consumption 8. MG127 封装 DFN10 3mm x 3mm, pitch 0.5mm Symbol Dimensions in Millimeters Dimensions in Inches

9 Min. Max. Min. Max. D/E D E k MIN MIN. b e TYP TYP. L Table 8.1 Package outline 9. Reflow Profile Follow:IPC/JEDEC J-STD-020 C Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

10 Average Ramp-Up Rate(TSmax to Tp) 3 /second max. 3 /second max Preheat -Temperature Min (TSmin) -Temperature Max (TSmax) -Time (ts min to ts max) Time maintained above: - Temperature (T L) -Time (tl) seconds seconds seconds seconds Peak/Classification Temperature (T P) Time within 5 of actual Peak Temperature (tp) seconds seconds Ramp-Down Rate 6 /second max. 6 /second max. Time 25 to Peak Temperature 6 minutes max. 8 minutes max. 10. PCB 布线注意事项 电源电源线 地线的布线直接关系到产品的性能, 把噪声干扰降到最低 布线时要尽量加宽地线 电源线宽度, 地 线 电源线 信号线, 通常信号线宽 0.2~0.3mm, 电源线宽 1.2~2.5mm, 用大面积铜层做地线用, 在 PCB 上把没 有用的空间都铺成地 电源加两个电容, 如果用 LDO 供电, 分别取值 1uF 和 0.1uF 用以滤波 ; 如果用纽扣电池供电, 电容分别取值 10uF 和 10uF 用以稳压 晶振 晶振电路要尽量短和对称, 靠近芯片, 以减少噪声干扰以及分布电容的影响 晶振外壳要良好接地 天线 天线对通信影响很大, 请使用成熟的 2.4GHz 天线结构, 或者严格按照天线要求制板 一般 PCB 天线需要净空, 天线与地 ( 铺铜 ) 之间距离应大于 0.5mm 天线周围不要有元器件或金属结构 芯片 ANT 到天线之间的走线尽量平滑而且不要太长, 线宽要考虑阻抗匹配要求

11 11. 载波输出 通过载波输出可以测量 MG127 的射频输出功率, 也可以用来调节晶体的负载电容, 使晶体工作在正确的频率上 射频发射信号通过产品的天线耦合到频谱分析仪 测试装置连接如下 : 以 2480MHz 载波发射为例, 频谱分析仪设置 : a, 中心频率设置 (Center Frequency) 为 2480MHz b, 扫频宽度 (Span) 为 1~10M c, 最大信号输入幅度 (Amplitude) 应大于被测产品射频输出功率 3~10 db d, 分辨率带宽 (RBW) 为 30K~300KHz( 一般自动调整 ) 在频谱分析仪上可以观察到载波的中心频率和最高幅度 通过调节晶体的负载电容来调节载波中心频率接近 2480MHz(-50KHz,+50KHz) 通过调节天线匹配电路使载波幅度在配置范围内在 16MHz 晶体和 PCB 保持不变的情况下, 以上测试只需做一次, 确定合适的负载电容值和天线匹配参数 12. FAQ 1. 问 :MG127 典型射频发射功率和功耗? 答 : 射频发射功率通过参数 BLE_TX_POWER 进行设置 BLE_TX_POWER(Dec) BLE_TX_POWER(Hex) 射频发射功率 (dbm) 电流 (ma) D A A

12 2. 问 : MG127 发射数据格式和数据内容? 答 : 需要符合 BLE PDU 格式. 3. 问 : MG127 接收数据内容? 答 :BLE MAC 地址 BLE Header BLE ADV data 三部分 4. 问 : 如何设置 BLE_START_TIME? 答 :start_time 和 mcu 模拟的 spi 速度有关, 如果设置太小会导致接收 / 发射不成功, 如果设置太大会导致不必要 的功耗 这个参数需要大于从唤醒中断产生到执行完成 BLE_Set_StartTime() 的时间, 如下图所示从标记 T1 到 T2 的时间为 2.46ms, 所以 BLE_START_TIME 可以设置为 3ms( 留有 0.5ms 左右的裕量 )

13 5. TBD

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