1 specification CSHF573NW2C package outlines Polarity Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.25mm (.1 ) unless otherwised noted. 3. Specifications are subject to change without notice. Part Number Chip Material Color of Emission Lens Type Viewing Angle CSHF573NW2C InGaN White Yellow Diffused 12 177 Castleton Street, #588 City of Industry, CA 91748 T: 626-964-94 F: 626-964-972 www.chromeled.com
2 ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Parameter Symbol Max Rating Unit Forward Current If 18 ma Reverse Voltage Vr 5 V Operating Temperature Range Top -4~+85 c Storage Temperature Range Tstg -4~+1 c Peak Pulsing Current (1/1 duty f = 1KHz) Ifp 35 ma Soldering Temperature Tsol Max 26 C for 5 sec Max OPTICAL-ELECTRICAL CHARACTERISTICS (Ta=25 C) Parameter Symbol Test Condition Value Min Typ Max Unit Luminous Intensity Iv If = 15mA 5 6 - lm Forward Voltage Vf If = 15mA - 3.1 3.4 V Reverse Leakage Current Ir Vr = 5V - - 1 µa Viewing Angle at 5% Iv 2θ1/2 If = 15mA - 12 - Deg Color Rendering Index CRI If = 15mA 8 82 - - Correlated Color Temperature CCT If = 15mA 37-45 K *Tolerance of viewing angle: -1 / +5 deg. 177 Castleton Street, #588 City of Industry, CA 91748 T: 626-964-94 F: 626-964-972 www.chromeled.com
明 2L2141115 3 optical characteristic curves Fig.1-Forward Voltage Vs. Forward Current 伏安特性性曲线 Forward Current (ma) 18 15 12 9 Fig.3-Ambient Temperature Vs. Relative Intensity 环境境温度与相对对光强特性曲曲线 Relative Luminous Flux (%) 6 3 2.7 1.2 1.8.6.4 2.8 2.9 3. 3.1 3.2 3.3 3. 4 Forward Voltage (v) 2 4 6 Ta( ) 8 1 Fig.5-Forward Voltage Vs. Ambient Temperature 电压与环境温温度特性曲线 Fig.2-Forwa rd Current Vs. Relativee Intensity 正向电流与相对对光强特性曲曲线 Relative Intensity(%) 1.6 1.2.8.4 Fig.4-Ambient Temperature Vs. Forward Current 环境温度与正正向电流特性性曲 Forward current (ma) 24 18 12 6 3 6 9 12 15 18 Forward Current (ma) 2 4 6 Ta( ) Fig.6-Radia ation diagram 辐射射特性曲线 8 1 3.3 Forward Voltage (v) 3.2 3.1 3 2.9 2.8 2 4 6 Ta( ) 8 1 Fig.7-Chromaticity Coordinate Vs. Ambient Temperature 色坐标与环境温度特性曲线 Fig.8- Spectrum Distribution 光谱分布布特性曲线 Y.36.35 25.34 85.33.32.31.315 X.32.325 Relative Emission Intensity (%) 1.2 1..8.6.4.2. 4 45 5 55 6 65 7 75 8 Wa avelength [nm PAGE: 6 / 12 65K 4K 3K 177 Castleton Street, #588 City of Industry, CA 91748 T: 626-964-94 F: 626-964-972 www.chromeled.com
4 optical characteristic curves The Chromaticity Diagram Bin Data: BIN X1 CP5.3145 CK5.3131 CP4.3222 CK4.3214 CP3 CK3 NP3.3591 NK3.3616 NP2.367 NK2.373 NP1.381 NK1.3852 WP3.4262 WK3.4347 WP2.4399 WK2.4497 WP1.4483 WK1.4586 Y1.3188.3291.3243.3352.3322.344.3521.3663.3578.3726.3663.386.3854.434.3899.484.3918.415 X2.3131.3117.3214.326.3616.3642.373.3736.3852.393.4347.4431.4497.4594.4586.4689 Y2.3291.3393.3352.3461.344.3558.3663.385.3726.3874.386.3979.434.4213.484.4267.415.429 X3.3213.325.3371.3376.373.3736.3852.393.3944.46.4497.4594.4586.4689.473.4813 Y3.3371.3481.344.3558.3493.3616.3726.3874.386.3979.3856.444.484.4267.415.429.4132.4319 X4.3221.3213.3366.3371.367.373.381.3852.3899.3944.4399.4497.4483.4586.4593.473 Y4.3261.3371.3322.344.3369.3493.3578.3726.3663.386.3716.3856.3899.484.3918.415.3944.4132 177 Castleton Street, #588 City of Industry, CA 91748 T: 626-964-94 F: 626-964-972 www.chromeled.com
5 PACKAGING SPECIFICATION Carrier Tape Dimensions FEED DIRECTION Polarity Mark Top Tape Reel Dimension 177 Castleton Street, #588 City of Industry, CA 91748 T: 626-964-94 F: 626-964-972 www.chromeled.com
6 照明 明 2L21 141115 soldering conditions S SMT Reflow Sold dering Instruction ns SMT T回流焊说 说明 平 平均升温速度 度 Tsmax 至 Tp 最高 最 3 C/ 秒 最高 3 C/ 秒 预 预热 最低温 温度 (Tsmin) 1 C 15 C 预 预热 最高温 温度 (Tsmax)) 15 C 2 C 6-12 秒 6-18 秒 限 限时维持高温 温 温度 (TL)) 183 C 217 C 限 限时维持高温 温 时间 (tl) 6-15 秒 6-15 秒 215 C 26 C 1-3 秒 2-4 秒 最高 最 6 C/ 秒 最高 6 C/ 秒 最多 6 分钟 钟 最多 8 分钟 钟 预 预热 时间 tsmin 至 tsmax t 峰 / 分类温 峰值 温度 (Tp) 与 与实际峰值温 温度 (tp) 相差 差 5 C 以内的 的保持时间 降 降温速度 2 C 升至峰 25 峰值温度所需时 时间 1 1.Reflow solde ering should no ot be done mo ore than two tim mes. In the ca ase of more tha an 24 hours passed solderin ng after first, LEDs will be damaged. 回流 L 流焊次数不可以 以超过两次 两 两次回流焊的时 时间间隔如果超 超过24小时 LE ED可能由于吸 吸湿而损坏 2 2.When solde ering, do not put stress on the t LEDs during heating当焊 焊接时 不要在 在材料受热时用 用力压胶体表面 面 Solderin ng Iron 烙铁焊接 烙 1.When ha and soldering,, keep the tem mperature of iron i below less 3 less than t 3 second ds 当手工焊 焊接时 烙铁的温 温度必须小于3 3 时间不 不可超过3秒 2.The hand solder shou uld be done only one time.手 手工焊接只可焊 焊接一次 Repairin ng 修补 Repair should not be done e after the LED Ds have been soldered. When repairing iss unavoidable,,a double-head d soldering irron should be used (as belo ow figure). It sh hould be confirmed in advan nce whether th he characteristtics of LEDs will w or will not b damaged by be b repairing. LE ED回流焊后不 不应该修复 当 当必须修复时 必须使用双头烙 头烙铁 而且事先 先应确认此种方 方式会不会 损 损坏LED本身的 的特性 Caution ns 注意事项 项 1.The encap psulated material of the LED Ds is silicone. Therefore the e LEDs have a soft surface on the top of package. The e pressure to the p e top surface will be influen nce to the relia ability of the LEDs. L Precauttions should b be taken to av void the strong g p pressure on th he encapsulate ed part. So wh hen usethe piccking up nozzle, the pressure on the siliccone resin sho ould be properr. L LED封装胶为硅 硅胶 表面较软 软 用力按压胶 胶体表面会影响 响LED可靠性 因此应有预防 防措施避免在按 按压器件 当使 使用吸嘴时 胶 胶 体 体表面的压力应 应是恰当的 2. Compon nents should not n be mounted on warped (non ( coplanar) portion of PC CB. After solde ering, do not warp w the c circuit board.led灯珠不要焊 焊接在弯曲的PC CB板上 焊接 接之后 也不要 要弯折线路板 3. Do not app 3 ply mechaniccal force or excess e vibrattion during th he cooling process to norrmal tempera ature after s soldering. Do o not rapidly cool device after a solderin ng. 回流焊之 之后冷却过程中 中 不要对材 材料实加外力 也不要 有 有震动 回流 流焊后 不要采 采用激剧冷却 却的方式 REFOND::WI-E-45 http://www w.refond.com m 177 Castleton Street, #588 REV:E/ R Te el:755-6683 39118 City of Industry, CA 91748 order best product The most current version DATE:214/ D 11/24to supply the PAGE: 1 possible. / 12 Fax:755-668 8393 T: 626-964-94 F: 626-964-972 www.chromeled.com