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...1 2...1 2.1...1 2.2...2 2.3...2 2.4...3 3...5 3.1...5 3.2...5 3.2.1...5 3.2.2...6 3.2.3...6 3.3...7 4...8 4.1...9 4.2...10 4.3...11 4.4...12 4.5...12 4.6...12 4.7...13 5...13...15 HLP:rda-thm i 2000/12/18 http://www.kekaoxing.com
1 ( ) 2 2.1 (1). (2). (3). (4). (5). ( ) (6). (7). (8). (9). HLP:rda-thm 1 2000/12/18 http://www.kekaoxing.com
(10). / (11). (12). (13). (14). (15). (16). (17). 2.2 (1). (2). (3). (4). ( ) (5). (6). (7). (8). (9). (10). (11). (12). 2.3 (1). (2). (3). (4). (5). (6). HLP:rda-thm 2 2000/12/18 http://www.kekaoxing.com
(7). (8). (9). (10). 2.4 1 HLP:rda-thm 3 2000/12/18 http://www.kekaoxing.com
HLP:rda-thm 4 2000/12/18 2 160 F o (71 C o ) 300 F o (150 C o ) 520 F o (270 C o ) http://www.kekaoxing.com
3 10 1.25 2 (heat transfer analysis) (thermal analysis) (junction temperature) 3.1 3.2 3.2.1 q = q ka dt ka = = = dx (W) ( ) L T T T 1 2 R HLP:rda-thm 5 2000/12/18 http://www.kekaoxing.com
k = A = x = L = T = R = ( W m C, cal sec cm C) (m 2 ) (m) (cm) ( C ) ( C W ) (1). (2). (3). 3.2.2 Φ = α = Φ = αa T (W) 1 C ( W m 2 C ) A = T = (m 2 ) ( C ) (1). (2). (3). 3.2.3 ( - ) E = εc( T 100) 4 2 ( W m ) HLP:rda-thm 6 2000/12/18 http://www.kekaoxing.com
E = ε = c = (W) 2 K 4 ( W m ) T = ( K ) Φ = CA T 2 T 1 100 100 4 4 C = 2 K 4 ( W m ) A = T 1 T 2 = (m 2 ) ( K ) (1). (2). (3). 3.3 (1). (2). (3). (4). (5). (6). (1). (2). HLP:rda-thm 7 2000/12/18 http://www.kekaoxing.com
4 MIL-HDBK-338 80 MIL- HDBK-251 / (1). (2). (3). (1). (2). (3). ( ) (4). 1 HLP:rda-thm 8 2000/12/18 http://www.kekaoxing.com
4.1 2 3 1 ( ) (BTU/hr ft F) (cal/sec cm C) ( ) (BTU/hr ft F) (cal/sec cm C) 0.0153 0.000063 125 0.52 17.0 0.070 5052 83 0.34 0.11 0.00045 6061T6 90 0.37 4.0 0.0016 2024T4 70 0.29 7075T6 70 0.29 0.12 0.00049 356T6 87 0.36 1.25 0.0051 95 0.39 0.15 0.00062 50 0.21 20 0.083 2 0.0082 230 0.95 0.50 0.0021 166 0.68 0.023 0.00009 130 0.54 1.23 0.0051 64 0.26 0.41 0.0017 54 0.22 0.11 0.00045 5%30 0.12 0.14 0.00058 170 0.70 2 (deg C) (deg C) 150~200 225 70~100 75~85 75~85 60~85 15~200 60~130 120 82~85 100 200 95 HLP:rda-thm 9 2000/12/18 http://www.kekaoxing.com
3 (deg C) (deg C) 140 250 180 80 70 ( ) 140 85~90 110 (1). (2). 22%~35% 20%~45% G B U 1 (3). (4). (a) G 12 o C in/watt (b) B 8 o C in/watt (c) U 6 o C in/watt (d) 2 o C in/watt 1 4.2 HLP:rda-thm 10 2000/12/18 http://www.kekaoxing.com
4.3 (1). A. B. (2). A. B. C. (3). (4). A. B. C. (5). A. B. C. D. ( ) (6). A. B. C. D. E. F. HLP:rda-thm 11 2000/12/18 http://www.kekaoxing.com
4.4 (1). 4.5 4.6 (1). A. B. C. D. (2). A. B. C. (3). (4). HLP:rda-thm 12 2000/12/18 http://www.kekaoxing.com
(5). A. B. C. D. (6). 4.7 (1). (2). 2 (3). 5 (thermal design) (thermal management) o o 80 C ~ 90 C HLP:rda-thm 13 2000/12/18 http://www.kekaoxing.com
2: HLP:rda-thm 14 2000/12/18 http://www.kekaoxing.com
1. MIL-HDBK-251, 2. MIL-HDBK-338-1, 3. Steinberg, Dave S., Cooling Techniques for Electronic Equipment, John Wiley & Sons, Inc., 1980. 4. HLP:rda-thm 15 2000/12/18 http://www.kekaoxing.com