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2 MI/O Extension 嵌入式解决方案游弋嵌入式运算核心事业群

3 常见的嵌入式板级解决方案嵌入式标准主板嵌入式标准主板统一尺寸固定 I/O 可直接使用经济可快速整合客制化解决方案定制完全符合客户使用需求的主板开发时间长, 成本高客制化解决方案 Embedded Board Solution 模块化主板方案 COM 模块化电脑 /COM 只提供 CPU 模块 I/O 端口必须通过设计底板引出, 不可直接使用嵌入式的高端方案, 成本较高, 开发时间较长

4 部分客户会碰到问题电力行业应用 2~6 个网口 4~8 个串口 I/O 需要隔离车载 / 船载设备标准规格主板加固型 I/O 接口 CAN Ports 多串口医疗设备应用与底板通讯接口 I/O 接口 ESD 防护小尺寸, 紧凑设计特殊应用模块化电脑 / 客制化主板特定规格特殊接口

5 带来的不稳定因素很多

6 需要有新的解决方案 1. 可以当做单板使用 2. I/O 接口能够弹性扩展, 满足更多的实用需求 1. 没有复杂的配线, 减少系统内 EMC 的问题 2. 装备简易, 3. 散热方案更优 1. 方案整体经济, 节约项目时间人工成本 2. 平台时效性高弹性灵活稳定可靠经济时效

7 MI/O Extension 解决方案的提出

8 研华 MI/O Extension 嵌入式解决方案 MI/O Extension: Multiple I/O Extension MI/O Extension 嵌入式单板 MIOe 连接器 MIOe 扩展模组 Page 8

9 MI/O Extension 成功案例分享 --- 电力系统 Giga LAN Giga LAN Giga LAN Giga LAN 嵌入式单板电脑 MI/O Extension 单板电脑

10 MI/O Extension 成功案例分享 --- 通讯医疗行业隔离 LAN 隔离 COM 隔离芯片隔离芯片 LAN Chip Super I/O PCIex1 PCIex1 MIOe

11 MI/O Extension 成功案例分享 --- 车载应用 GigaLAN w/db9 GigaLAN w/db9 GigaLAN w/rj45 GigaLAN w/db9 LAN Chip LAN Chip PCIex1 PCIex1 MIOe

12 MI/O Extension 解决方案优势介绍

13 MIOe 连接器的介绍

14 MIOe 的连接器

15 MIOe 连接器稳定性测试 MIOe Connector Vibration Testing: Board product vibration level is 3.5Grms MIOe Connector Shock Testing : :

MIOe 连接器都包含哪些总线 DisplayPort 可以转换为 HDMI, LVDS, DVI, CRT or edp

扩展接口 Interface SMBus 可以转换为 GPIO, 或者 Display 智能电源管理等 port 1

0 1 0 or 1 3 Display Ports LPC PCIex1 USB/Audio LPC 1 SMBUS

并口等低速信号 SMBus 1 USB/Audio line out VCC (Power) 连接 USB 的设备以及音频输出

16 MIOe 连接器都包含哪些总线 DisplayPort 可以转换为 HDMI, LVDS, DVI, CRT or edp 等视频输出接口 4 路 PCIex1 可以转换为 PCI GigaLAN SATA 等, 也可以转出 Mini-PCIe 扩展接口 Interface SMBus 可以转换为 GPIO, 或者 Display 智能电源管理等 port 1 Number PCIe x 1 4 V 2.0 USB 3.0 USB or 1 3 Display Ports LPC PCIex1 USB/Audio LPC 1 SMBUS Power HD Audio (line out) 1 LPC 通过 Super I/O 芯片可以转出 GPIO PS2 并口等低速信号 SMBus 1 USB/Audio line out VCC (Power) 连接 USB 的设备以及音频输出 / 输入 VCC (Power) Power +12VSB 可以提供 +12V +5V Power, 通过主板直接向底板供电 +5VSB Low Pin Count USB 3.0 GND Audio Line Out

17 MI/O Extension 的散热与主板设计的优化

18 MI/O Extension 主板的散热设计散热模组芯片组 CPU 散热模组芯片组 CPU 内存嵌入式标准主板内存 MI/O Extension 嵌入式主板合理的散热设计将发热量较大的器件都置于主板的正面通过大型的散热片进行统一散热, 也适用于客户的小型紧凑型的机构设计主板背面放置的是一些发热量较小的器件

19 MI/O Extension 主板的散热方案选择客制化散热片

20 MI/O Extension 主板设计的优化内部 I/O 区域

21 MI/O Extension 灵活扩展

22 Page 22 MI/O Ultra & MI/O Compact 定位

23 MI/O Extension 弹性灵活的扩展 MI/O Extension 主板 + MIOe 扩展模块 = 不同客户应用

25 MIOe 客制化扩展板的方案研华开发原理图 Layout 打板贴片组装测试客户开发客制化底板研华设计协助服务提供 MIOe 设计指导书原理图 Review 测试阶段 FAE 协助技术咨询

26 MI/O Extension 的增值服务

27 Power Consumption

28 MI/O Extension 产品介绍

29 Entry Under 5W Value Performance 8W~ MI/O Extension Roadmap MI/O-Ultra Available Developing Planning Fanless MIO-2260 MIOe Intel Atom N455 DDR3 MIO 3.0 SO-DIMM bit LVDS, CRT Intel GbE, HD Audio 2 USB / 2 COM /SATA/ CF Mini-PCIe Dec 11 MIO-2261 Intel Cedar Trail Dual Core CPU DDR3 SO-DIMM 18/24-bit LVDS, CRT Intel GbE, HD Audio 1 COM/ msata/ SATA/ msata Mini-PCIe Q2 12 MIO-2270 AMD G-Series SO-DIMM DDR3 1COM/ Cfast/ SATA 24-bit LVDS, CRT, Mini-PCIe Q3 12 MIO-2220 DM&P Vortex86DX2 1.0GHz On board DDR2 1GB 4x USB 2.0, 2x10/100 LAN Mini-PCIe interface 24bit LVDS/ CRT Q3 12 Page 29

Value imanager Available Fanless MI/O Extension Roadmap MI/O-Compact Developing Planning -20 ~ 80 C -40 ~ 85 C Low Power Performance MIOe MIO-5270 AMD G-Series (eontario) 5W(SC)~18W(DC), DDR3 up to

30 Value imanager Available Fanless MI/O Extension Roadmap MI/O-Compact Developing Planning -20 ~ 80 C -40 ~ 85 C Low Power Performance MIOe MIO-5270 AMD G-Series (eontario) 5W(SC)~18W(DC), DDR3 up to 4GB DirectX 11, 2D/3D H/W accelerate 48-bit LVDS/ HDMI/ CRT Dual GbE, imanager design minipcie, CFast MIO-5250 MIOe Intel Atom Cedar Trail, 5.0~12W Dual core processor, DDR3/ bit LVDS1/48-bit LVDS2/HDMI Dual GbE/ HD audio/ 4 COM 6 USB/ CFast/ minipcie + SIM imanager design Q1 12 MIO-5290 MIO 3.0 MIOe Intel Ivy Bridge, Core i3/ i5/ i7 DDR3 1600, Direct X11 3 display,48-bit LVDS/HDMI/VGA 2 GbE/HD audio/2 USB 3.0/4 USB 2.0/2 SATAIII/mSATA/miniPCIe iamt Support, imanager design Q2 12 Page 30

Evaluation CRB Power Display Communication Multiple I/O MIOe Module Roadmap Compact /Ultra Compact Ultra Available Developing Planning -20 ~ 80 C -40 ~ 85 C Compact MIOe-210 Ultra MIOe-211 Compact

Jan 12 Compact /Ultra MIOe-230 48-bit LVDS DisplayPort USB 2.

31 Evaluation CRB Power Display Communication Multiple I/O MIOe Module Roadmap Compact /Ultra Compact Ultra Available Developing Planning -20 ~ 80 C -40 ~ 85 C Compact MIOe-210 Ultra MIOe-211 Compact /Ultra MIOe COM port (4 RS232/422/ RS422/485) 8-bit GPIO Jan 12 1 x LAN 4 x COM (power COM port) 2 x USB Q x mipcie 2 x SIM holder 2 x USB Q2 12 Compact MIOe Intel GbE LAN Jan 12 Compact /Ultra MIOe bit LVDS DisplayPort USB 2.0 x 2 Jan 12 Ultra MIOe-240 Compact MIOe-241 9~24V wide range power module For MIO-2xxx MI/O Ultra series Q ~36V wide range power module For MIO-5xxx MI/O Compact series Q2 12 Compact /Ultra MIOe-5000 Evaluation Boar in Micro ATX Digital Display Interface/ 3 PCIe x 1/ USB 2.0/ USB 3.0 /HD audio line out/ LPC/ SMBUS /GPIO/ minipcie + SIM holder / SATA/ SATA Power Q1 12 Page 31

MIO-2260 主板规格一览 Intel Atom N455 PICO-ITX SBC with 18-bit LVDS/ VGA 1 LAN/Half-size Mini-PCIe/ 2COM/ 1 SATA/ 2 USB2.0/ 1 CF /MIOe Intel Atom N455 1.

5 DX9, MPEG2 HW Decode Dual Independent display: 18-bit LVDS, VGA 12V DC Power input,support DC power hot plug 15KV Air ESD protection COM port design 1GbE-Intel LAN/ HD

32 MIO-2260 主板规格一览 Intel Atom N455 PICO-ITX SBC with 18-bit LVDS/ VGA 1 LAN/Half-size Mini-PCIe/ 2COM/ 1 SATA/ 2 USB2.0/ 1 CF /MIOe Intel Atom N G Single Core (Fanless) Low Power Consumption (TDP 9W) Ultra small form factor w/ 100x72mm dimension Intel Gen 3.5 DX9, MPEG2 HW Decode Dual Independent display: 18-bit LVDS, VGA 12V DC Power input,support DC power hot plug 15KV Air ESD protection COM port design 1GbE-Intel LAN/ HD Audio 2 COM/ 2 USB2.0/ 1 SATA/ 8-bit GPIO/ SMBUS/I2C/ CF MIOe Extension / Half-size mini-pcie DC Jack 2x2 power connector Support SUSI Access Supports Embedded Software API and Utility WinCE, XP, XPE, Win7,WES7,QNX,Vxwork Support 2017/Q3 Longevity

MIO-2261 主板规格一览 Intel Atom N2600/D2700 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 msata/ 4 USB2.0/MIOe Intel N2600/D2700+ NM10, DDR3 1066 SO-DIMM N2600 1.6G / N2800 1.

33 MIO-2261 主板规格一览 Intel Atom N2600/D2700 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 msata/ 4 USB2.0/MIOe Intel N2600/D2700+ NM10, DDR SO-DIMM N G / N G DC/D G DC Dual Core Processor with All Fan-less Design Smallest SBC w/ 100x72mm size (same as 2.5 HDD) with MIOe extension flexibility Low Power Consumption (Kit TDP: 5~12W) DirectX 9, MPEG2 (H/W acceleration) H.264/ VC1/ WMV9 (H/W Decode/Acceleration) 12V DC Power input,support DC power hot plug 15KV Air ESD protection COM port design TVS design for power ESD/EFT protection Power connector 1GbE-Intel LAN/ HD Audio 2 COM/ 4 USB2.0/ 1 msata/ 8-bit GPIO/ SMBus/I2C/ MIOe Extension / Half-size Mini PCIe Lockable DC Jack 2018/Q4 Longevity

34 MIO-5250 主板规格一览 Intel Cedar Trail MI/O Extension SBC with 24-bit LVDS1/ 48-bit LVDS2/ HDMI/ VGA/ 2 GbE/ 4COM/ 1 SATA/ 5 USB2.0/ Mini-PCIe/ 1 Cfast/ MIOe/ imanager Intel Cedarview+ NM10, DDR3 1066MHz N G DC / N G DC/D G DC 全部规格采用无风扇设计独立双显 : 18/24-bit LVDS1, 48-bit LVDS2, HDMI, VGA DirectX 9, MPEG2 (H/W acceleration) H.264/ VC1/ WMV9 (H/W Decode/Acceleration) 低功耗 (Kit TDP: 5~12W) 12V DC 电源输入, 支持 DC 电源热拔插宽温设计 (-40~85C) 2 Intel GbE/ HD Audio/SIM 卡插槽 4 COM/ 6 USB2.0/ 1 SATAII/ GPIO/ SMBUS/ CFast MIOe/ Mini-PCIe Expansion DC Jack 2 x 2 Power Advantech imanager & SUSIaccess Supports Embedded Software API and Utility Win7, WES7, Win8, WinXP, WinXPe, WinCE, Linux Support 2018/Q3 Longevity

MIO-5270 主板规格一览 AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOe AMD G-Series + AMD A50M, DDR3 1066MHz T40R1.

35 MIO-5270 主板规格一览 AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOe AMD G-Series + AMD A50M, DDR3 1066MHz T40R1.0G SC (5.5W) / T40E 1.0G DC (6.4W) ( 无风扇 ) T56N 1.65G DC (18W) +A50M(4.7W) DirectX 11, 2D/ 3D/ 支持硬件加速支持独立双显 : 48-bit LVDS, HDMI, VGA Hardware decode (UVD 3):H.264, VC-1 & MPEG2 低功耗 (kit TDP: 10.5~23W) 12V DC 电源输入, 支持 DC 电源热拔插宽温设计 (-20~80C) 2 GbE/ HD Audio 4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast MIOe/ Mini-PCIe Expansion or msata DC Jack 2 x 2 Power Advantech imanager & SUSIaccess Supports Embedded Software API and Utility Win CE, Win7, WinXP, WinXPe, Linux Support 2018/Q3 Longevity

CEO Clement Lin Chairman & CEO NEXCOM International Co., Ltd % IT (Building the Digital Infrastructure) NISE NISE 2200/2300 Intel Atom D2550

CEO Clement Lin Chairman & CEO NEXCOM International Co., Ltd. 7 2011 10% IT (Building the Digital Infrastructure) NISE NISE 2200/2300 Intel Atom D2550 CPU NISE 3600 MPPC/ APPC/ IPPC/ OPPC 8 19 Wi-Fi 6