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2 A Å or Angstrom m 來 Prefix Symbol Factor yotta Y zetta Z exa E peta P tera T giga G 10 9 mega M 10 6 kilo k 10 3 hecto h 10 2 deka da 10 1 deci d 10-1 centi c 10-2 milli m 10-3 Micro µ 10-6 Nano n 10-9 Pico p Femto f Atto a Zepto z Yocto y Active component 來 ATCaccelerated thermal cycling Alloy 金兩兩金 Ambient Ambient Temperature 度度 Analog circuits 類路連路 ANSIAmerican National Standards Institute

3 ASICapplication specific integrated circuit 路 ASTaccelerated stress testing 力 B Batch Manufacturing 量量 Batch Processing 理行連數量 BEOLback-end of line 路 BGAball grid array 列利列 Burn in 老度利 C C4controlled collapse chip connection 度連料力連度量連 Capacitance 量 CBGAceramic ball grid array 列 Ceramic substrates 金料度料 CSPchip scale package or chip size package 20% Circuit 路來路 Clean room 濾粒 CMOScomplementary metal oxide semiconductor

4 金 N P 金金類流利力利力金料參數 COBchip-on-board 裸路 Coplanarity 行量離度 CPLDcomplex programmable logic device IC 邏 C-SAMc-mode scanning acoustic microscopy CSP-CCSP ceramic CSP-LCSP laminate 狀 CTEcoefficient of thermal expansion 數度料理度料 D Daughter card DCAdirect chip attach 路 Die 行 chip microchip 數 dice Dielectric 料 DIPsdual inline package 立 8~40 兩狀 Distributed processing 邏連 DNPdistance to neutral point

5 離落離 Doping 異 DPAdestructive physical analysis 理 DRAMdynamic random access memory DRAM 力切 DSPdigital signal processors 數理 DSP 類數濾理理雷 E EIAElectronic Industries Alliance 聯 EIAJElectronic Industries Association of Japan Etching 金料 Eutectic 金兩金金金 Expansion board 路 F FablessFabrication Less 參 foundry Fault tolerance 行略力 FBGAfine-pitch BGA 列 FCflip chip 路利路金 FCBflip chip bump FCIPflip chip in package

6 FCOBflip chip on board 路 Flexible printed circuit 路料路路論 Flexible substrate 料料料不度 Flip-Chip-On-Flex 利數不行 Flux 金料若金料 FOCflex-on-cap Delphi Delco Electronics Systems FCT Footprint 路路類 / Foundry G GaAsGallium Arsenide LED 力 Gigabyte 兩數 Glob Top Pad Array CarrierGTPAC 列 H Hard disk drivehdd 料 HDIhigh density interconnect 度連

7 HDIShigh density interconnect structure or system 度連 HTOLhigh temperature operating life 力 HTShigh temperature storage I IEEEInstitute of Electrical and Electronics Engineers I/Oinput/output / I300IInternational 300-mmwafer Initiative Integrated circuit 路路連連 Interconnect 連不率料 IMAPSInternational Microelectronics And Packaging Society IMCintermetallic compound 金 IMCM-Boardintegrated multi-chip-module-board In-line automation 連數流 Inner Layer BondILB Interposer 連連路連 IPCInstitute for Interconnecting and Packaging Electronic Circuits 連路 ITRIIndustrial Technology Research Institute J JEDECJoint Electronic Devices Engineering Council 聯

8 K KGD,KGWknown good die/wafer 良 L Laminate 路料 Lead Frame 連連 LEDlight emitting diode Lithography LSILarge-scale integration IC 路 LTCCLow temperature co-fired ceramic M Mask MCM-Cmultichip module ceramic MCM-Lmultichip module laminate MCM 連裸 MESmanufacturing execution systems 行來流更料量 Metallization 金理 Micron or micrometer 量度類 Mil 度

9 mhz MHz MISmanagement information system 理路立來率 MLBmultilayer board MMImicroelectronics manufacturing infrastructure MMRCMicroelectronics Marketing Research Council of IMAPS Motherboard 連流理 N nanometernm 奈度 10-9 量量 1000 奈 =1 NICnetwork interface card 路路連路 NCMSnational center for manufacturing sciences NEMINational Electronics Manufacturing Initiative NISTNational Institute of Standards and Technology O OEMoriginal equipment manufacturer Open systems 立連 Outer layer bondolb Over mold pad array carrierompac 列 Oxidation

10 金 P Pad 路了 Passivation PBGAplastic ball grid array 列 Personal Computer Memory Card International AssociationPCMCIA PGAPin Grid Array; Pad Gird Array 列連列 Photoresist 料料度 Pitch 離 Plasma 離不路離 ppmparts per million Printed circuit boardpcb 路 PVIpackage visual inspection Printed Wiring BoardPWB 路連金路 Q QFPquad flat package R Reflow process (SMD) 料 RCresistance-capacitance -

11 Reticle RFradio frequency RHrelative humidity 度 Rework 不流 S SBBsolder ball bumping or solder bump bonding, also stud bump bonding SDRAMsynchronous RAM SEMscanning electron microscope SEMATECHSemiconductor Manufacturing TECHnology consortium SEMISemiconductor Equipment and Materials International 料 Semiconductor 例料 SiSilicon SIASemiconductor Industry Association SiPsystem-in-package System-on-PackageSoP SiPssingle in-line packages 狀狀 SIMMssingle in-line memory modules SMDsurface mount device SoPsystem-on-package Solder 料金金金

12 料料度金量料 Solder mask 了路 Solid state Sputter 諸金金 SRCSemiconductor Research Corporation Stepper Substrate 料路路連連不不料料切度 Surface mount technologysmt 諸利不利 Systems integration 料力 T Tape automated bondingtab 粒利 PI TAPtest, assembly and packaging Tape and reel 輪狀 TBGAtape ball grid array 列 TCPtape carrier package Tgglass transition temperature 度 TQFPthin quad flat package TSOPthin small-outline package

13 行 Turnkey 料理 U UBMunder bump metallurgy, also known as pad limiting metallurgyplm 金金 Underfill 料 V VLSIvery large scale integration 路 Y Yield 良率率 Z Zig-zag in-line packagezip 列

國立自然科學博物館館訊第263期

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