320240C LED LED LED EL EL CCFL EL CCFL

Transcription

1 320240C LED LED LED EL EL CCFL EL CCFL

2 LCD MOUDLE C Series Version:2.0 May : EXTERNAL DIMENSIONS 18 CON2 1 FLM 8 D3 1 2 M 9 D4 3 CL1 10 VDD 4 CL2 11 VSS DISPOFF 12 6 D1 13 VO VEE CON1 7 D2 14 GND VSS VDD VO /WR /RD /CS AO /RES DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A VOUT 1 of 34

3 BLOCK DIAGRAM OPERATING INSTRUCTIONS Input signal Function J1 (SED1330 Controller) Pin No Symbol Description 1 VSS GND 2 VDD Supply voltage for logic 3 V0 Supply voltage for LCD Contrast adjustment 4 WR\ Write Signal 5 RD\ Read Signal 6 CS\ Chip select Signal 7 A0 Data Type Selection 8 RES\ Reset Signal 9 DB0 Data BUS 10 DB1 Data BUS 11 DB2 Data BUS 12 DB3 Data BUS 13 DB4 Data BUS 14 DB5 Data BUS 15 DB6 Data BUS 16 DB7 Data BUS 17 LED+ 18 VOUT Power out (-23V) LCD Power supply 2 o f 34

4 J2.J3. No Controller Pin No Symbol Description 1 FRAME Frame signal 2 M Alternater for LCD driver 3 LP Data latch signal 4 CP Clock signal for shifting serial data 5 DISPOFF H:Display ON,L:Display Off 6 D0 DataBUS 7 D1 DataBUS 8 D2 DataBUS 9 D3 DataBUS 10 VDD Power.supply.for.logic 11 VSS GND 12 V0 Variable.voltage.for.LCD 13 VEE Power..out..(-23V) LCD..Power..supply 14 FG NO Connect CCFL: Pin No. Symbol Level Description 1 VFL1 --- Supply voltage for CCFL 3 VFL2 --- Supply voltage for CCFL 3 o f 34

5 ABSOLUTE MAXIMUM RATINGS ( Ta = 25 C ) Parameter Symbol Min Max Unit Supply voltage for logic VDD V Supply voltage for LCD VDD - VO V Input voltage VI -0.5 VDD+0.5 V Operating temperature TOP 0 50 C Storage temperature TST C ELECTRICAL CHARACTERISTICS ( VDD = +5V±10%, VSS = 0V, Ta = 25 C ) DC Characteristics Parameter Symbol Condition Min Typ Max Unit Supply voltage for logic VDD V Supply current for logic IDD ma 0 C V Operating voltage for LCD VDD - VO 25 C V 50 C V Supply voltage for EL light VF V Supply current for EL light IF VF=4.2V ma Input voltage ' H ' level VIH VDD V Input voltage ' L ' level VIL V SED1330 Timing Diagrams System bus READ/WRITE timing I (8080) A0 \CS tah8 \WR,\RD taw8 tcc tcyc D0 D7 (WRITE) D0 D7 (READ) tacc8 tds8 toh8 tdh8 Signal Symbol Parameter Rating Unit Condition min max A0,CS tah8 Address hold time ns taw8 Address setup time ns WR,RD tcyc System cycle time (1) --- ns CL = 100 tcc Strobe pulsewidth ns pf tds8 Data setup time ns D0 to D7 tdh8 Data hold time ns tacc8 RD access time ns toh8 Output disable time ns Note: t CYC =2t C + t CC + t CEA + 75 > t ACV + 245: memory control/movement control commands: = 4t C + t CC + 30: all other commands: 4 o f 34

6 LCD MODULE CSeries Version:2.0 May System bus READ/WRITE timing II (6800 ) E tcyc6 R/W taw6 tew A0,CS tah6 D0 D7 (WRITE) D0 D7 (READ) tacc6 tds6 tdh6 toh6 Signal Symbol Parameter Rating Unit Condition min max tah6 Address hold time ns A0, CS taw6 Address setup time ns R/W tcyc6 System cycle time (1) --- ns tcc Strobe pulsewidth ns CL = 100+1TTL tds6 Data setup time ns pf D0 to D7 tdh6 Data hold time ns tacc6 RD access time ns toh6 Output disable time ns E tew Enable pulse width ns Note: (1) t CYC6 = 2t C + t EW + t CEA + 75 > t ACV + 245: memory control/movement control commands: = 4tC + tew + 30: all other commands: 1. tcyc6 means a cycle of (CS.E) not E alone. 5 o f 34

7 LCD MODULE CSeries Version:2.0 May Display memory READ timing tc EXTφO tw tce tw VCE tcyr VA0 VA15 tas tahc trch VR/W trcs tacy tcea tce3 toh2 VD0 VD7 Signal Symbol Parameter Rating Unit Condition min max EXT 0 tc Clock cycle ns VCE tw VCE high level pulse width tc ns tce VCE low level pulse width 2tc ns VA0 tcyr Read cycle time (1) --- ns to VA15 tasc VCE address setup time (fall) tc ns CL = 100pF tahc VCE address hold time (fall) 2tc ns +1TTL VR/W trcs VCE read cycle setup time (fall) tc ns trch VCE read cycle hold time (fall) tc/2-35 tacv Address access time --- (2) ns VD0 tcea VCE access time --- (3) ns to VD7 toh2 Output data hold time ns tce2 VCE data off time 0 Note: 1. tcyr = 3tC 2. t ACV = 3t C t CEA = 2t C 120 Display memory WRITE timing tc EXTφO tw tce VCE tas tahc tca VA0 VA15 tcyw VR/W VD0 VD7 tas twsc tohs twhc tohc Signal Symbol Parameter Rating Unit Condition min max EXT 0 tc Clock cycle ns VCE tw VCE high level pulse width tc ns tce VCE low level pulse width 2tc ns tcyr Read cycle time 3tc --- ns tahc VCE address hold time (fall) 2tc ns CL = 100pF VA0 tasc VCE address setup time (fall) tc ns +1TTL to VA15 tca VCE address hold time (rise) ns tas VR/W address setup time (fall) ns tah2 VR/W address hold time (rise) ns VR/W twsc VCE write setup time (fall) tc ns twhc VCE write hold time (fall) tc/ ns VD0 tdsc VCE data input setup time (fall) twsc ns to VD7 tdhc VCE data input hold time (fall) 2tc ns tdh2 VR/W data hold time (rise) 10* 50 ns * Lines VD0 to VD7 are latched. tah2 toh2 6 o f 34

8 LCD control timing ROW NO LP YD WF YSCL 1 frame period WF YSCL ROW64 line pe1 riod ROW1 ROW2 LP XSCL XD0 XD3 XECL tr tws tf tcx XSCL tds tdh XD0 XD3 twl LP tl1 tl2 XECL WF(B) YD YSCL twxe tl ts2 ts1 tdf twy tdhy Signal Symbol Parameter Rating Unit Condition min max EXT 0 tc Clock cycle ns tr VCE high level pulse width ns tf VCE low level pulse width ns XSCL tcx Shift clock cycle time 4tc --- ns twx XSCL clock pulse width tcx ns XD0 tdh X-data hold time tcx ns to XD3 tds X-data setup time tcx ns VDD=5.0V LP tls Latch data setup time tcx ns ±10% twl LP signal pulse width tcx ns CL=150F tl1 XECL setup time tc ns tl2 XECL data hold time tc ns XSCL ts1 Enable setup time tc ns ts1 Enable delay time tc ns twxe XECL clock pulse width tcx ns WF tdf Time allowance of WF delay ns YSCL tld LP delay time against YSCL tcx ns twy YSCL clock pulse width tcx ns YD tdhy Y-data hold time tcx ns 7 o f 34

9 LCD MODULE 0240C Series Version:2.0 May FL BACKLIGHT CHARACTERISTICS Absolute Maximum Ratings Item Symbol Conditions Standard Unit Min. Typ. Max. Circuit voltage V S Vrms Lamp current I FL Ta= 25 C marms Electrical Characteristics Item Symbol Conditions Standard Unit Min. Typ. Max. Lamp voltage*1 V FL Ta= 25 C Vrms Starting voltage*2 V S Ta= 0 C Vrms Lamp current*1 I FL Ta= 25 C marms Frequency*1 f FL Ta= 25 C khz increases, *1 FL inverter: 13585AQ17 *2 The voltage capable of starting discharge and keeping stable sischarge.when the voltage gradually glow discharge will increase and FL tube terminals will be connected electrecaly. Optical Characteristics Item Symbol Conditions Standard Unit Min. Typ. Max. Surface brightness*1*2*4 Bp Ta= 25 ±3 C cd/m 2 Distribution of brightness*1*3 Bp 30~85%RH % *1 Measurement 30 minutes after turning on of FL tube FL inverter: 13585AQ17 FL inverter output voltage and freguency: 220V, 59kHz LCD driving conditions: Optimum Vopr LCD display pattern: ALL off display (all data= L ) *2 Initial brightness of LCD panel center *3 Definition of Bp (Distribution of brightness) Bp=(Bp(max.) - Bp(min.))/Bp(max.) 100% Bp(max.)=Maximun brightness of 5 measuring points Bp(min.)=Minimem brightness of 5 measuring points 5 measuring points: *4 Ambient temperature affects brightness of FL tube. The reason is that radiation efficiency is depends on steam pressure of mercury enclosed in the tube. Practically the brightness is low in the cool. As the steam pressure of mercury is also low just after turning on of FL tube, the brightness is low. The heat generated by FL tube will raise temperature on the tube surface, then brightness will increase with a rise in mercury steam pressure. Life Item Conditions Standard Unit Min. Max. Life*1 Ta= 25 ±3 C hrs *1 FL driving condition: I FL (Lamp current )=5 marms Time until the decreases to half of the initail brightness, or time until not lit because of increase in FL discharge start voltage. 8 o f 34

10 OPERATING PRINCIPLES & METHODS Command Description The Command Set Table 1. The Command Set Class Command Code Hex Command Description Command Read Parameters RD W R A0 D7 D6 D5 D4 D3 D2 D1 D0 No. of Bytes Section System SYSTEM SET Initialize device and display SLEEP IN Enter standby DISP ON/OFF D 58, Enalbe and disable display and display flashing SCROLL Set display start address and display regions CSRFORM D Set cursor type CGRAM ADR C Set start address of character generator RAM Display CSRDIR CD CD 4Cof Set direction of cursor control 1 0 4F movement HDOT SCR A Set horizontal scroll position OVLAY B Set display overlay format DrawingCSRW Set cursor address control CSRR Read cursor address Memory MWRITE Write to display memory control MREAD Read from display memory Notes: 1. In general, the internal registers of the SED1330F are modified as each command parameter is input. However, the microprocessor does not have to set all the parameters of a command and may send a new command before all parameters have been input. The internal registers for the parameters that have been input will have been changed but the remaining parameter registers are unchanged. 2-byte parameters (where two bytes are treated as one data item) are handled as follows: a. CSRW, CSRR: Each byte is processed individually. The microprocessor may read or write just the low byte of the cursor address. b. SYSTEM SET, SCROLL, CGRAM ADR: Both parameter bytes are processed together. If the command is changed after half of the parameter has been input, the single byte is ignored. 2. APL and APH are 2-byte parameters, but are treated as two 1-byte parameters. System Control Commands 1.SYSTEM SET Initializes the device, sets the window sizes, and selects the LCD interface format. Since the command sets the basic operating parameters of the SED1330F, an incorrect SYSTEM SET command may cause other commands to operate incorrectly. MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 A0 WR RD C P1 DR T/L IV 1 W/S M2 M1 M P2 WF FX P FY P4 C/R P5 TC/R P6 L/F P7 APL P8 APH o f 34

11 1.1 C This control byte performs the following: 1. Resets the internal timing generator 2. Disables the display 3. Cancels sleep mode Parameters following P1 are not needed if only can-celing sleep mode. 1.2 M0 Selects the internal or external character generator ROM. The internal character generator ROM con-tains 160, 5 7 pixel characters. These characters are fixed at fabrication by the metalization mask. The external character generator ROM can contain up to 256 user-defined characters. M0 = 0: Internal CG ROM M0 = 1: External CG ROM Note that if the CG ROM address space overlaps the display memory address space, that portion of the display memory cannot be written to. 1.3 M1 Selects the CG RAM area for user-definable charac-ters. The CG RAM codes are selected from the 64 codes shown in page M1 = 0: CG RAM1; 32 char The CG RAM1 and CG RAM2 address spaces are not contiguous, the CG RAM1 address space is treated as character generator RAM, and the CG RAM2 address space is treated as character generator ROM. M1 = 1: 64 char CG RAM + CG RAM2 The CG RAM1 and CG RAM2 address spaces are contiguous and are both treated as character genera-tor RAM. 1.4 M2 Selects the height of the character defined in external CG ROM and CG RAM. Characters more than 16 pixels high can be displayed by creating a bitmap for each portion of each character and using thesed1330f s graphics mode to reposi-tion them. M2 = 0: 8-pixel character height (2716 or equivalent ROM) M2 = 1: 16-pixel character height (2732 or equivalent ROM) 1.5 W/S Selects the LCD drive method. W/S = 0: Single-panel drive W/S = 1: Dual-panel drive (1) single-panel display EI X driver X driver YD Y driver LCD 10 o f 34

12 (2) Above and below two-panel display EL X driver X driver EL Y driver Upper Panel Lower Panel X driver X driver (3) Left and right two-panel display EI X driver X driver X driver X driver YD Y driver Left Panel Right Panel 1.6 IV Screen origin compensation for inverse display. IV is usually set to 1.The best way of displaying inverted characters is to Exclusive-OR the text layer with the graphics back-ground layer. However, inverted characters at the top or left of the screen are difficult to read as the charac-ter origin is at the top-left of its bitmap and there are no background pixels either above or to the left of these characters.the IV flag causes the SED1330F to offset the text screen against the graphics back layer by one vertical pixel. Use the horizontal pixel scroll function (HDOT SCR) to shift the text screen 1 to 7 pixels to the right. All characters will then have the necessary surrounding background pixels that en-sure easy reading of the inverted characters. IV = 0: Screen top-line correction IV = 1: No screen top-line correction (no offset) Display start point Back layer HDOT SCR Character IV 1 dot Dots 1 to T/L Selects TV or LCD mode. When TV mode is selected,the TV sync generator circuit is ON. T/L = 0: LCD mode T/L = 1: TV mode 1.8 DR Selects output of an additional shift-clock cycle for every 64 pixels. The extra cycles are required for correct operation of the enable chain when using a two-panel display. DR = 0: Normal operation DR = 1: Additional shift-clock cycles 1.9 FX Sets the width, in pixels, of the character field. The character width in pixels is equal to FX + 1, where FX can range from 00 to 07H inclusive. If data bit 3 is set (FX is in the range 08 to 0FH) and an 8-pixel font is used, a space is inserted between characters. Note that the maximum character width in TV mode is eight 11 o f 34

13 Since the SED1330F handles display data in 8-bit units, characters larger than 8 pixels wide must be formed from 8-pixel segments. As Figure shows, the remainder of the second eight bits are not displayed. This also applies to the second screen layer. In graphics mode, the normal character field is also eight pixels. If a wider character field is used, any remainder in the second eight bits is not displayed. FX FX [FX] Character width HEX D3 D2 D1 D0 (pixels) FY FX 8 bits 8 bits FY 8 bits 8 bits Address A Address B Non-display area 1.10 WF Selects the AC frame drive waveform period. WF is usually set to 1. WF = 0: 16-line AC drive WF = 1: two-frame AC drive In two-frame AC drive, the WF period is twice the frame period. In 16-line AC drive, WF inverts every 16 lines. Although 16-line AC drive gives a more readable display, horizontal lines may appear when using high LCD drive voltages or at high viewing angles FY Sets the height, in pixels, of the character. The height in pixels is equal to FY + 1. FY can range from 00 to 0FH inclusive. Set FY to zero (vertical size equals one) when in graphics mode. Table 5. Vertical character size selection FX [FX] Character HEX D3 D2 D1 D0 height (pixels) E OF C/R Sets the address range covered by one display line,that is, the number of characters less one, multiplied by the number of horizontal bytes per character. C/R can range from 0 to 239. For example, if the character width is 10 pixels, then the address range is equal to twice the number of characters, less 2. See Section for the calcula-tion of C/R. [C/R] cannot be set to a value greater than the address range. It can, however, be set smaller than the address range, in which case the excess display area is blank. The number of excess pixels must not exceed 64. Table 6. Display line address range C/R [C/R] bytes per display line HEX D7 D6 D5 D4 D3 D2 D1 D F EE EF o f 34

14 1.13 TC/R Sets the length, including horizontal blanking, of one line. The line length is equal to TC/R + 1, where TC/ R can range from 0 to 255. TC/R must be greater than or equal to C/R + 4. Provided this condition is satisfied, [TC/R] can be set according to the equation given in section in order to hold the frame period constant and minimize jitter for any given main oscillator frequency, f OSC. Table 7. Line length selection TC/R [C/R] bytes per display line HEX D7 D6 D5 D4 D3 D2 D1 D FE FF L/F Sets the height, in lines, of a frame. The height in lines is equal to L/F + 1, where L/F can range from 0 to 255. If W/S is set to 1, selecting two-screen display, the number of lines must be even and L/F must, therefore, be an odd number. Table 8. Frame height selection L/F [C/R] bytes per display line HEX D7 D6 D5 D4 D3 D2 D1 D F FE FF Table 9. Frame heights and compatible LCD units Nombor of linos [LF] Panel Duty Cycle 64 1/ / AP Defines the horizontal address range of the virtual screen. APL is the least significant byte of the ad-dress. APL AP7 AP6 AP5 AP4 AP3 AP2 AP1 AP0 APH AP15 AP14 AP13 AP12 AP11 AP10 AP9 AP8 Table 10. Horizontal address range Hex code [AP] addresses APH APL per line F F F E F F F F C/R Display memory limit Display area AP 13 o f 34

15 2 SLEEP IN Places the system in standby mode. This command has no parameter bytes. At least one blank frame after receiving this command, the SED1330F halts all internal operations, including the oscillator, and enters the sleep mode. Blank data is sent to the X-drivers, and the Y-drivers have their bias supplies turned off by the YDIS signal. Using the YDIS signal to disable the Y-drivers guards against any spurious displays. The internal registers of the SED1330F maintain their values during the sleep mode. The display memory control pins maintain their logic levels to ensure that the display memory is not corrupted. The SED1330F can be removed from the sleep state by sending the SYSTEM SET com-mand with only the P1 parameter. The DISP ON command should be sent next to enable the display. MSB LSB C The YDIS signal goes LOW between one and two frames after the SLEEP IN com-mand is received. Since YDIS forces all display driver outputs to go to the dese-lected output voltage, YDIS can be used as a power-down signal for the LCD unit. This can be done by having YDIS turn off the relatively high-power LCD drive supplies at the same time as it blanks the display. 2. Since all internal clocks in the SED1330F are halted while in the sleep state, a DC voltage will be applied to the LCD panel if the LCD drive supplies remain on. If reliability is a prime consideration, turn off the LCD drive supplies before issuing the SLEEP IN command. 3. Note that, although the bus lines become high impedance in the sleep state, pull-up or pull-down resistors on the bus line will force these lines to a known state. 3 Display Control Commands 3.1 DISP ON/OFF Turns the whole display on or off. The single-byte parameter enables and disables the cursor and lay-ered screens, and sets the cursor and screen flash rates. The cursor can be set to flash over one charac-ter or over a whole line. MSB LSB C P1 FP5 FP4 FP3 FP2 FP1 FP0 FC1 FC0 DISP ON/OFF parameters D Turns the display ON or OFF. The D bit takes prece-dence over the FP bits in the parameter. D = 0: Display OFF D = 1: Display ON FC Enables/disables the cursor and sets the flash rate.the cursor flashes with a 70% duty cycle (ON/OFF). Table 11. Cursor flash rate selection FC1 FC0 Cursor display 0 0 OFF (blank) 0 1 No flashing 1 0 ON Flash at ffr/32hz (approx. 2 Hz) 1 1 Flash at ffr/64 Hz (approx. 1 Hz) Note: As the MWRITE command always enables the cursor, the cursor position can be checked even when perform-ing consecutive writes to display memory while the cursor is flashing. 14 o f 34

16 3.1.3 FP Each pair of bits in FP sets the attributes of one screen block, as follows. Table 12. Screen block attribute selection FP1 FP0 First screen block (SAD1) FP3 FP2 Second screen block (SAD2,SAD4). See note. FP5 FP4 Third screen block (SAD3) 0 0 OFF (blank) 0 1 No flashing 1 0 ON Flash at ffr/32hz (approx. 2 Hz) 1 1 Flash at ffr/4 Hz (approx. 16 Hz) Note: If SAD4 is enabled by setting W/S to 1, FP3 and FP2 control both SAD2 and SAD4. The attributes of SAD2 and SAD4 cannot be set independently. 3.2 SCROLL C Sets the scroll start address and the number of lines per scroll block. Parameters P1 to P10 can be omitted if not required. The parameters must be entered sequentially as shown in Figure 17. MSB LSB C P1 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 1L) P2 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 1H) P3 L7 L6 L5 L4 L3 L2 L1 L0 (SL 1) P4 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 2L) P5 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 2H) P6 L7 L6 L5 L4 L3 L2 L1 L0 (SL 2) P7 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 3L) P8 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 3H) P9 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 4L) P10 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 4H) Note : Set parameters P9 and P10 only if both two-screen drive (W/S=1) and two-layer configuration are selected. SAD4 is the fourth screen block display start address. Figure 17. SCROLL instruction parameters Note: Set parameters P9 and P10 only if both two-screen drive (W/S = 1) and two-layer configuration are se-lected. SAD4 is the fourth screen block display start address. Table 13. Screen block start address selection SL1,SL2 [SL] screen lines HEX L7 L6 L5 L4 L3 L2 L1 L F FE FF o f 34

17 3.2.2 SL1, SL2 SL1 and SL2 set the number of lines per scrolling screen. The number of lines is SL1 or SL2 plus one. The relationship between SAD, SL and the display mode is described below. Table 14. Text display mode W/S Screen First Layer Second Layer SAD1 SAD2 First screen block SL1 SL2 SAD3 SAD4 Lower screen (see note 2) (see note 2) Set both SL1 and SL2 to ((L/F)/2+1) Screen configuration example: SAD2 1 SAD1 SL1 Character display page Graphics display page 2 SAD3 Character display page Graphics display page 4 (SAD4) Laver 1 Laver 2 Notes: 1. SAD3 has the same value as either SAD1 or SAD2, whichever has the least number of lines (set by SL1 and SL2). 2. Since the parameters corresponding to SL3 and SL4 are fixed by L/F, they do not have to be set in this mode. Table 15. Graphics display mode W/S Screen First Layer Second Layer Third Layer SAD1 SAD2 Upper screen SL1 SL2 SAD3 (see note 3) Lower screen Set both SL1 and SL2 to L/F +1 if not using a partitioned screen Screen configuration example SAD2 0 SAD1 SL1 Character display page 1 SL2 Graphics display page 2 SAD3 Character display page 3 Laver 1 Laver 2 Three-layer configuration SAD1 SL1 = L/F + 1 Screen configuration example: SAD1 SL2 = L/F + 1 SAD3 0 SAD3 SAD2 SAD1 SL1 Graphics display page 3 SL2 Graphics display page 2 Layer 3 Layer 1 Layer 2 16 o f 34

18 Table 15. Graphics display mode (continued) W/S Screen First Layer Second Layer SAD1 SAD2 Upper screen SL1 SL2 SAD3 SAD4 Lower screen (see note 2) (see note 2) Set both SL1 and SL2 to ((L/F)/2+1) Screen configuration example (see note 3): Third Layer SAD2 1 SAD1 SL1 Character display page Graphics display page 2 SAD3 Graphics display page Character display page Laver 1 Laver 2 Notes : 1. SAD3 has the same value as either SAD1 or SAD2, whichever has the least number of lines (set by SL1 and SL2). 2. Since the parameters corresponding to SL3 and SL4 are fixed by L/F, they do not have to be set. 3. If, and only if, W/S = 1, the differences between SL1 and (L/F + 1) / 2, and between SL2 and (L/F + 1) / 2, are blanked. 3.3 CSRFORM Sets the cursor size and display mode. Although the cursor is normally only used in text displays, it may also be used in graphics displays when displaying special characters. MSB LSB C CRY P X3 X2 X1 X0 P2 CM CRY Y3 Y2 Y1 Y0 Figure 19. CSRFORM parameter bytes CRX Sets the horizontal size of the cursor from the charac-ter origin. CRX is equal to the cursor size less one. CRX must be less than or equal to FX. Table 16. Horizontal cursor size selection CRX [CRX] cursor width HEX X3 X2 X1 X0 pixels E F CRY Sets the location of an underscored cursor in lines, from the character origin. When using a block cursor,cry sets the vertical size of the cursor from the character origin. CRY is equal to the number of lines less one. 17 o f 34

19 Table 17. Cursor height selection CRX [CRX] cursor HEX X3 X2 X1 X0 height (lines) iillegal E F Character start point Figure 20. Cursor size and position CM Sets the cursor display mode. Always set CM to 1 when in graphics mode. CM = 0: Underline cursor CM = 1: Block cursor 3.4 CSRDIR Sets the direction of automatic cursor increment. The cursor can move left or right one character, or up or down by the number of bytes specified by the address pitch, AP. When reading from and writing to display memory, this automatic cursor increment controls the display memory address increment on each read or write. in character units. See Section 5.3. MSB LSB C CD1 CD2 CRX = 5dots CRX = 9dots CM = 0 Figure 21. CSRDIR parameters -AP AP Figure 22. Cursor direction Table 18. Cursor shift direction C CD1 CD0 Shift direction 4CH 0 0 Right 4DH 0 1 Left 4EH 1 0 Up 4FH 1 1 Down Note: Since the cursor moves in address units even if FX ³ 9, the cursor address increment must be preset for move-ment in character units. See Section OVLAY Selects layered screen composition and screen text/ graphics mode. MSB LSB C P OV DM 2 Figure 23. OVLAY parameter MD 1 MX 1 MX 2 18 o f 34

20 3.5.1 MX0, MX1 MX0 and MX1 set the layered screen composition method, which can be either OR, AND, Exclusive-OR or Priority-OR. Since the screen composition is orga-nized in layers and not by screen blocks, when using a layer divided into two screen blocks, different com-position methods cannot be specified for the indi-vidual screen blocks. The Priority-OR mode is the same as the OR mode unless flashing of individual screens is used. Table 19. Composition method selection MX1MX0 Function Composition Method Applications 0 0 L1 L2 L3 OR Underlining,rules,mixed text and graphics 0 1 (L1 L2) L3 Exclusive-OR Inerted characters, flashing regions, underlining 1 0 (L1 L2) L3 AND Simple animation, three-dimensional 1 1 L1>L2>L3 Priority-OR appearance Notes: L1: First layer (text or graphics). If text is selected, layer L3 cannot be used. L2: Second layer (graphics only) L3: Third layer (graphics only) Layer 1 Layer 2 Layer 3 Visible display OR Exclusive OR AND Prioritized OR Figure 24. Combined layer display Notes: L1: Not flashing L2: Flashing at 1 Hz L3: Flashing at 2 Hz DM1, DM2 DM1 and DM2 specify the display mode of screen blocks 1 and 3, respectively. DM1/2 = 0: Text mode DM1/2 = 1: Graphics mode Note 1: Screen blocks 2 and 4 can only display graphics. Note 2: DM1 and DM2 must be the same, regardless of the setting of W/S OV Specifies two- or three-layer composition in graphics mode. OV = 0: Two-layer composition OV = 1: Three-layer composition Set OV to 0 for mixed text and graphics mode. 3.6 CGRAM ADR Specifies the CG RAM start address. MSB LSB C P1 A7 A6 A5 A4 A3 A2 A1 A0 (SAGL) P2 A15 A14 A13 A12 A11 A10 A9 A8 (SAGH) Figure 25. CGRAM ADR parameters 19 o f 34

21 3.7 HDOT SCR While the scroll command only allows scrolling by characters, HDOT SCR allows the screen to be scrolled horizontally by pixels. HDOT SCR cannot be used on individual layers. MSB LSB C P D2 D1 D0 Figure 26. HDOT SCR parameters D0 to D2 Specifies the number of pixels to scroll. The C/R parameter has to be set to one more than the number of horizontal characters before using HDOT SCR. Smooth scrolling can be simulated if the controlling microprocessor repeatedly issues the HDOT SCR command to the SED1330F Table 20. Scroll step selection M P1 Number of pixels HEX D2 D1 D0 to scroll Z Z A B X Y A A B B X Display N M/N is the number of bits (dots) that parameter 1 (P1) is incremented/decremented by Figure 27. Horizontal scrolling X Y Y M = 0 N = 0 4 Drawing Control Commands 4.1 CSRW The 16-bit cursor address register contains the dis-play memory of the data at the cursor position as shown in Figure 28. MSB LSB C P1 A7 A6 A5 A4 A3 A2 A1 A0 (CSRL) P2 A15 A14 A13 A12 A11 A10 A9 A8 (CSRH) Figure 28. CSRW parameters Note that the microprocessor cannot directly access the display memory. The MREAD and MWRITE commands use the ad-dress in this register. The cursor address register can only be modified by the CSRW command, and by the automatic incre-ment after an MREAD or MWRITE command. It is not affected by display scrolling. 4.2 CSRR Reads from the cursor address register. After issuing the command, the data read address is read twice, for the low byte and then the high byte of the register. MSB LSB C P1 A7 A6 A5 A4 A3 A2 A1 A0 (CSRL) P2 A15 A14 A13 A12 A11 A10 A9 A8 (CSRH) Figure 29. CSRR parameters 20 o f 34

22 5 Memory Control Commands 5.1 MWRITE The microprocessor may write a sequence of data bytes to display memory by issuing the MREAD command and then writing the bytes to the SED1330F. There is no need for further MWRITE commands or for the microprocessor to update the cursor address register after each byte as the cursor address is automatically incremented by the amount set with CSRDIR, in preparation for the next data write. MSB LSB C P1 P2 Pn n 1 Figure 30. MWRITE parameters 5.2 MREAD Puts the SED1330F/1335F/1336F into the data out-put state. On the MREAD command, the display memory data at the cursor address is read into a buffer in the SED1330F Each time the microprocessor reads the buffer, the cursor address is incremented by the amount set by CSRDIR and the next data byte fetched from memory,so a sequence of data bytes may be read without further MREAD commands or by updating the cursor address register. If the cursor is displayed, the read data will be from two positions ahead of the cursor. MSB LSB C P1 P2 Pn n Figure 31. MREAD parameters 21 o f 34

23 6 Internal Character Generator Font Figure 94. On-chip character set 22 o f 34

24 7 Application Subprogram ORG 0000H AJMP MAIN ; CWADD1 EQU 0101H ; DWADD1 EQU 0000H ; DRADD1 EQU 0101H ; CRADD1 EQU 0000H ; ; ;RS EQU P3.0 ; RS ;RD EQU P3.1 ; /RD ;WR EQU P3.2 ; /WR DATBUS EQU P1 ; ; PARA1 EQU 30H ; *240 ; CA SYSTEM SET SYSTAB: DB 30H,87H,07H,27H,42H,0F0H,30H,00H ; P1-P8 SCRTAB: DB 00H,00H,0F0H,00H,40H,0F0H,00H,80H,00H,00H ; P1-P10 ; COM EQU 30H ; DAT1 EQU 31H ; COUNT1 EQU 32H ; 1 COUNT2 EQU 33H ; 2 O_XL EQU 34H ; X 8 ( ) O_XH EQU 35H ; X 8 ( ) ; D7 (D7=1) (D7=0) O_YL EQU 36H ; Y ( / ) COOE EQU 37H ; CFLUG EQU 10H ; ; CFLUG=1 CFLUG=0 TEMP1 EQU 28H TEMP2 EQU 29H ORG 0040H MAIN: LCALL DELAY MOV SP,#60H LCALL INT LCALL CLEAR ; LJMP DISCHA ; DISCHA: MOV O_XL,#00H ; X MOV O_YL,#00H ; Y MOV COOE,#00H ; LCALL CCW2_PR ; MOV O_XL,#04H ; X MOV O_YL,#00H ; Y MOV COOE,#01H ; LCALL CCW2_PR ; MOV O_XL,#08H ; X MOV O_YL,#00H ; Y MOV COOE,#02H ; LCALL CCW2_PR ; MOV O_XL,#0CH ; X MOV O_YL,#00H ; Y MOV COOE,#03H ; LCALL CCW2_PR ; SJMP $ ; DELAY: MOV R2,#01H ; MOV R3,#01H DEL1: NOP DJNZ R3,DEL1 DJNZ R2,DEL1 RET 23 o f 34

25 RET ; PR1: PUSH DPL PUSH DPH MOV DPTR,#CWADD1 MOV A,COM POP DPH POP DPL RET ; ; PR2: PUSH DPL PUSH DPH MOV DPTR,#DWADD1 MOV A,DAT1 POP DPH POP DPL RET ; ; PR3: PUSH DPL PUSH DPH MOV DPTR,#DRADD1 MOVX A,@DPTR MOV DAT1,A POP DPH POP DPL RET ;===================================== ; INT ; PR1,PR2 ; INT ; :SYSTAB,SCRTAB ; ;===================================== INT: MOV COM,#40H ; SYSTEM SET LCALL PR1 ; MOV COUNT1,#00H ; COUNT=0 INT3: MOV DPTR,#SYSTAB ; MOV A,COUNT1 ; MOVC A,@A+DPTR MOV DAT1,A LCALL PR2 ; INC COUNT1 ; MOV A,COUNT1 CJNE A,#08H,INT3 ; MOV COM,#44H ; SCROLL LCALL PR1 ; MOV COUNT1,#00H ; COUNT=0 INT2: MOV DPTR,#SCRTAB ; MOV A,COUNT1 ; MOVC A,@A+DPTR MOV DAT1,A LCALL PR2 ; INC COUNT1 MOV A,COUNT1 ; CJNE A,#0AH,INT2 ; MOV COM,#5AH ; HDOT SCR LCALL PR1 ; MOV DAT1,#00H ; P1 LCALL PR2 ; MOV COM,#5BH ; OVLAY LCALL PR1 ; 24 o f 34

26 MOV DAT1,#00H ; :, LCALL PR2 ; " " MOV COM,#59H ; DISP ON/OFF LCALL PR1 ; MOV DAT1,#54H ; : LCALL PR2 ; RET ;===================================================== ; ( )CCW2_PR ; O_XL,O_YL,COOE,COUNT1,A,B,DPTR ; PR1 ; CCTAB ; CCW2_PR ; O_XL,O_YL,COOE ;===================================================== CCW2_PR:MOV A,COOE ; MOV B,#128D MUL AB MOV DPTR,#CGTAB ; ADD A,DPL MOV DPL,A MOV A,B ADDC A,DPH MOV DPH,A MOV TEMP1,DPL MOV TEMP2,DPH MOV A,O_YL ; MOV B,#PARA1 ; PARA1 SYSTEM P9 SET MUL AB ; P10=0 ADD A,O_XL MOV O_XL,A ; MOV A,B ADDC A,#40H ; SAD2H MOV O_YL,A ; MOV COM,#4FH ; CSRDIR ( ) LCALL PR1 MOV COUNT1,#4D ; 1=2 CCW2_1: MOV COM,#46H ; CSRW LCALL PR1 MOV DAT1,O_XL ; CSR LCALL PR2 MOV DAT1,O_YL LCALL PR2 MOV COM,#42H ; MWRITE LCALL PR1 MOV COUNT2,#32D ; 2=16 CCW2_2: CLR A MOVC A,@A+DPTR ; MOV DAT1,A INC DPTR ; INC DPTR INC DPTR INC DPTR LCALL PR2 ; DJNZ COUNT2,CCW2_2 ; MOV A,O_XL ; ADD A,#01H ; ( ) MOV O_XL,A MOV A,O_YL ADDC A,#00H MOV O_YL,A MOV DPL,TEMP1 MOV DPH,TEMP2 INC DPTR MOV TEMP1,DPL 25 o f 34

27 MOV TEMP2,DPH DJNZ COUNT1,CCW2_1 ; RET ;==================================== ; RAM ( ) CLEAR ; COM,DAT1,A,R3,R4 ; PR1,PR2 ; ; CLEAR ;==================================== CLEAR: MOV COM,#4CH ; CSRDIR LCALL PR1 ; MOV COM,#46H ; CSRW LCALL PR1 ; MOV DAT1,#00H ; 8 LCALL PR2 ; CSRL LCALL PR2 ; CSRH MOV COM,#42H ; MWRITE LCALL PR1 ; MOV R3,#00H ; 0000H MOV R4,#00H MOV DAT1,#00H ; =0 CLR1: LCALL PR2 ; DJNZ R3,CLR1 ; DJNZ R4,CLR1 END 26 o f 34

28 ELECTRO-OPTICAL CHARACTERISTICS ( VOP = 13.8V, Ta = 25 C ) Item Symbol Condition Min Typ Max Unit Remarks Note Response time Tr ms Tf ms Contrast ratio Cr deg = 90 3 Viewing angle range θ Cr deg = deg = deg = Note1: Definition of response time. Note2: Definition of contrast ratio Cr. Note3: Definition of viewing angle range θ. 27 o f 34

29 RELIABILITY Content of Reliability Test Environmental Test No. Test Item Content of Test Test Condition Applicable Standard 1 High temperature Endurance test applying the high storage 70 C storage temperature for a long time. 200 hrs 2 Low temperature Endurance test applying the low storage -20 C storage temperature for a long time. 200 hrs 3 High temperature operation Endurance test applying the electric stress (Voltage & Current) and the thermal stress to 50 C 200 hrs the element for a long time. 4 Low temperature operation Endurance test applying the electric stress under low temperature for a long time. 0 C 200 hrs High temperature / Humidity storage 6 High temperature / Humidity operation Endurance test applying the high temperature and high humidity storage for a long time. Endurance test applying the electric stress (Voltage & Current) and temperature / humidity stress to the element for a long time. 7 Temperature cycle Endurance test applying the low and high temperature cycle. -20 C 25 C 70 C 30min 5min. 30min 1 cycle Mechanical Test 8 Vibration test Endurance test applying the vibration during transportation and using. 9 Shock test Constructional and mechanical endurance test applying the shock during transportation. 10 Atmospheric pressure test Endurance test applying the atmospheric pressure during transportation by air. Others 11 Static electricity test Endurance test applying the electric stress to the terminal. 70 C, 90 %RH 96 hrs 50 C, 90 %RH 96 hrs -20 C / 70 C 10 cycles 10 22Hz 1.5mmp-p Hz 1.5G Total 0.5hrs 50G half sign wave 1l msedc 3 times of each direction 115 mbar 40 hrs VS=800V, RS=1.5 kω CS=100 pf 1 time Supply voltage for logic system = VDD. Supply voltage for LCD system = Operating voltage at 25 C. MIL-202E- 103B JIS-C5023 MIL-202E- 103B JIS-C MIL-202E- 201A JIS-C5025 JIS-C7022- A-10 MIL-202E- 213B MIL-202E- 105C MIL-883B Failure Judgement Criterion Criterion Item Test Item No. Failure Judgment Criterion Basic specification Out of the Basic Specification Electrical characteristic Out of the DC and AC Characterstic Mechanical characterstic Out of the Mechanical Specification Color change : Out of Limit Apperance Specification Optical characterstic Out of the Apperance Standard 28 o f 34

30 QUALITY GUARANTEE Acceptable Quality Level Each lot should satisfy the quality level defined as follows. - Inspection method : MIL-STD-105E LEVEL II Normal one time sampling - AQL Partition AQL Definition A: Major 0.4% Functional defective as product B: Minor 1.5% Satisfy all functions as product but not satisfy cosmetic standard Definition of LOT One lot means the delivery quantity to customer at one time. Conditions of Cosmetic Inspection Environmental condition The inspection should be performed at the 1m of height from the LCD module under 2 pieces of 40W white fluorescent lamps (Normal temperature C and normal humidity 60±15%RH). Inspection method The visual check should be performed vertically at more than 30cm distance from the LCD panel. Driving voltage The VO value which the most optimal contrast can be obtained near the specified VO in the specification. (Within ±0.5V of the typical value at 25 C.). INSPECTION CRITERIA Module Cosmetic Criteria No. Item Judgement Criterion Partition 1 Difference in Spec. None allowed Major 2 Pattern peeling No substrate pattern peeling and floating Major 3 Soldering defects No soldering missing No soldering bridge No cold soldering Major Major Minor 4 Resist flaw on substrate Invisible copper foil ( 0.5mm or more) on substrate pattern Minor 5 Accretion of metallic Foreign matter No soldering dust No accretion of metallic foreign matters (Not exceed 0.2mm) Minor Minor 6 Stain No stain to spoil cosmetic badly Minor 7 Plate discoloring No plate fading, rusting and discoloring Minor 8 Solder amount 1. Lead parts a. Soldering side of PCB Solder to form a Filet all around the lead. Solder should not hide the lead form perfectly. (too much) b. Components side ( In case of Through Hole PCB ) Minor Solder to reach the Components side of PCB. 2. Flat packages Either toe (A) or heal (B) of the lead to be covered by Filet. A B Minor Lead form to be assume over solder. 3. Chips (3/2) H h (1/2) H Minor H h 29 o f 34

31 Screen Cosmetic Criteria (Non-Operating) No. Defect Judgement Criterion Partition 1 Spots In accordance with Screen Cosmetic Criteria (Operating) No.1. Minor 2 Lines In accordance with Screen Cosmetic Criteria (Operating) No.2. Minor 3 Bubbles in polarizer Size : d mm Acceptable Qty in active area Minor d 0.3 Disregard 0.3 < d < d < d 0 4 Scratch In accordance with spots and lines operating cosmetic criteria. When the Minor light reflects on the panel surface, the scratches are not to be remarkable. 5 Allowable density Above defects should be separated more than 30mm each other. Minor 6 Coloration Not to be noticeable coloration in the viewing area of the LCD panels. Minor Back-lit type should be judged with back-lit on state only. 7 Contamination Not to be noticeable. Minor Screen Cosmetic Criteria (Operating) No. Defect Judgement Criterion Partition 1 Spots A) Clear Minor Size : d mm Acceptable Qty in active area d 0.1 Disregard 0.1 < d < d < d 0 Note : Including pin holes and defective dots which must be within one pixel size. B) Unclear Size : d mm Acceptable Qty in active area d 0.2 Disregard 0.2 < d < d < d 0 2 Lines A) Clear Minor L (6) (0) See No W Note : ( ) - Acceptable Qty in active area L - Length (mm) W - Width (mm) - Disregard B) Unclear L 10.0 (6) (0) See No. 1 W Clear = The shade and size are not changed by VO. Unclear = The shade and size are changed by VO. 30 o f 34

32 Screen Cosmetic Criteria (Operating) (Continued) No. Defect Judgement Criterion Partition 3 Rubbing line Not to be noticeable. 4 Allowable density Above defects should be separated more than 10mm each other. Minor 5 Rainbow Not to be noticeable. Minor 6 Dot size To be 95% 105% of the dot size (Typ.) in drawing. Partial defects of each dot (ex. pin-hole) should be treated as spot. Minor 7 Uneven brightness (only back-lit type module) (see Screen Cosmetic Criteria (Operating) No.1) Uneven brightness must be BMAX / BMIN 2 - BMAX : Max. value by measure in 5 points - BMIN : Min. value by measure in 5 points Divide active area into 4 vertically and horizontally. Measure 5 points shown in the following figure. Minor : Measuring points Note : (1) Size : d = (long length + short length) / 2 (2) The limit samples for each item have priority. (3) Complexed defects are defined item by item, but if the number of defects are defined in above table, the total number should not exceed 10. (4) In case of concentration, even the spots or the lines of disregarded size should not allowed. Following three situations should be treated as concentration. - 7 or over defects in circle of 5mm or over defects in circle of 10mm or over defects in circle of 20mm. PRECAUTIONS FOR USING LCD MODULES Handing Precautions (1) The display panel is made of glass. Do not subject it to a mechanical shock by dropping it or impact. (2) If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any in your mouth. If the substance contacts your skin or clothes, wash it off using soap and water. (3) Do not apply excessive force to the display surface or the adjoining areas since this may cause the color tone to vary. (4) The polarizer covering the display surface of the LCD module is soft and easily scratched. Handle this polarizer carefully. (5) If the display surface becomes contaminated, breathe on the surface and gently wipe it with a soft dry cloth. If it is heavily contaminated, moisten cloth with one of the following solvents : - Isopropyl alcohol - Ethyl alcohol (6) Solvents other than those above-mentioned may damage the polarizer. Especially, do not use the following. - Water - Ketone - Aromatic solvents (7) Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is accelerated by water droplets, moisture condensation or a current flow in a high-humidity environment. 31 o f 34

33 (8) Install the LCD Module by using the mounting holes. When mounting the LCD module make sure it is free of twisting, warping and distortion. In particular, do not forcibly pull or bend the I/O cable or the backlight cable. (9) Do not attempt to disassemble or process the LCD module. (10) NC terminal should be open. Do not connect anything. (11) If the logic circuit power is off, do not apply the input signals. (12) To prevent destruction of the elements by static electricity, be careful to maintain an optimum work environment. - Be sure to ground the body when handling the LCD modules. - Tools required for assembling, such as soldering irons, must be properly grounded. - To reduce the amount of static electricity generated, do not conduct assembling and other work under dry conditions. - The LCD module is coated with a film to protect the display surface. Exercise care when peeling off this protective film since static electricity may be generated. Storage Precautions When storing the LCD modules, avoid exposure to direct sunlight or to the light of fluorescent lamps. Keep the modules in bags (avoid high temperature / high humidity and low temperatures below 0 C). Whenever possible, the LCD modules should be stored in the same conditions in which they were shipped from our company. Others Liquid crystals solidify under low temperature (below the storage temperature range) leading to defective orientation or the generation of air bubbles (black or white). Air bubbles may also be generated if the module is subject to a low temperature. If the LCD modules have been operating for a long time showing the same display patterns, the display patterns may remain on the screen as ghost images and a slight contrast irregularity may also appear. A normal operating status can be regained by suspending use for some time. It should be noted that this phenomenon does not adversely affect performance reliability. To minimize the performance degradation of the LCD modules resulting from destruction caused by static electricity etc., exercise care to avoid holding the following sections when handling the modules. - Exposed area of the printed circuit board. - Terminal electrode sections. USING LCD MODULES Liquid Crystal Display Modules LCD is composed of glass and polarizer. Pay attention to the following items when handling. (1) Please keep the temperature within specified range for use and storage. Polarization degradation, bubble generation or polarizer peel-off may occur with high temperature and high humidity. (2) Do not touch, push or rub the exposed polarizers with anything harder than an HB pencil lead (glass, tweezers, etc.). (3) N-hexane is recommended for cleaning the adhesives used to attach front/rear polarizers and reflectors made of organic substances which will be damaged by chemicals such as acetone, toluene, ethanol and isopropylalcohol. (4) When the display surface becomes dusty, wipe gently with absorbent cotton or other soft material like chamois soaked in petroleum benzin. Do not scrub hard to avoid damaging the display surface. (5) Wipe off saliva or water drops immediately, contact with water over a long period of time may cause deformation or color fading. (6) Avoid contacting oil and fats. (7) Condensation on the surface and contact with terminals due to cold will damage, stain or dirty the polarizers. After products are tested at low temperature they must be warmed up in a container before coming is contacting with room temperature air. (8) Do not put or attach anything on the display area to avoid leaving marks on. (9) Do not touch the display with bare hands. This will stain the display area and degradate insulation between terminals (some cosmetics are determinated to the polarizers). (10) As glass is fragile. It tends to become or chipped during handling especially on the edges. Please avoid dropping or jarring. 32 o f 34

34 Installing LCD Modules The hole in the printed circuit board is used to fix LCM as shown in the picture below. Attend to the following items when installing the LCM. (1) Cover the surface with a transparent protective plate to protect the polarizer and LC cell. (2) When assembling the LCM into other equipment, the spacer to the bit between the LCM and the fitting plate should have enough height to avoid causing stress to the module surface, refer to the individual specifications for measurements. The measurement tolerance should be ±0.1mm. Precaution for Handing LCD Modules Since LCM has been assembled and adjusted with a high degree of precision, avoid applying excessive shocks to the module or making any alterations or modifications to it. (1) Do not alter, modify or change the the shape of the tab on the metal frame. (2) Do not make extra holes on the printed circuit board, modify its shape or change the positions of components to be attached. (3) Do not damage or modify the pattern writing on the printed circuit board. (4) Absolutely do not modify the zebra rubber strip (conductive rubber) or heat seal connector. (5) Except for soldering the interface, do not make any alterations or modifications with a soldering iron. (6) Do not drop, bend or twist LCM. Electro-Static Discharge Control Since this module uses a CMOS LSI, the same careful attention should be paid to electrostatic discharge as for an ordinary CMOS IC. (1) Make certain that you are grounded when handing LCM. (2) Before remove LCM from its packing case or incorporating it into a set, be sure the module and your body have the same electric potential. (3) When soldering the terminal of LCM, make certain the AC power source for the soldering iron does not leak. (4) When using an electric screwdriver to attach LCM, the screwdriver should be of ground potentiality to minimize as much as possible any transmission of electromagnetic waves produced sparks coming from the commutator of the motor. (5) As far as possible make the electric potential of your work clothes and that of the work bench the ground potential. (6) To reduce the generation of static electricity be careful that the air in the work is not too dried. A relative humidity of 50%-60% is recommended. Precaution for soldering to the LCM (1) Observe the following when soldering lead wire, connector cable and etc. to the LCM. - Soldering iron temperature : 280 C ± 10 C. - Soldering time : 3-4 sec. - Solder : eutectic solder. If soldering flux is used, be sure to remove any remaining flux after finishing to soldering operation. (This does not apply in the case of a non-halogen type of flux.) It is recommended that you protect the LCD surface with a cover during soldering to prevent any damage dur to flux spatters. (2) When soldering the electroluminescent panel and PC board, the panel and board should not be detached more than three times. This maximum number is determined by the temperature and time conditions mentioned above, though there may be some variance depending on the temperature of the soldering iron. (3) When remove the electoluminescent panel from the PC board, be sure the solder has completely melted, the soldered pad on the PC board could be damaged. 33 o f 34