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1 RoHS Cooper Dec. 21, 2004

2 Outline WEEE & RoHS directives Impact of Lead-Free Process XRF Options RoHS Request & Schedule 念 2

3 塞 理 量 龍 數 殺 聯 鹿 丹 3

4 EUROPE: WEEE & RoHS directives - Waste from Electrical and Electronic Equipment (WEEE) 令 The WEEE directive requires manufacturers to assume sole financial responsibility for the collection, sorting, treatment and recovery of end-of-life electronic equipment, including historic products sold long before the issuance of the Directive. - Restriction on Hazardous Substances (RoHS) - 令 The ROHS proposal, in its current form, bans the use of certain critical substances[1] in electrical and electronic products by Note : Substances include lead(pb), mercury(hg), cadmium(cd), hexavalent chromium(cr+6), polybrominated biphenyls (PBB) and polybrominated diphenyl ether (PBDE). 4

5 ROHS directives 2002/95/EC Take the background of driving force from Astro (June, 2003) as the reference The European Union recently adopted the Restriction of Hazardous Substances Directive 2002/95/EC (hereafter referred to as ROHS) which bans the use of lead( ), Mercury( ), cadmium( ), hexavalent chromium( 六 ), polybrominated biphenyls (PBB)-( 聯, and polybrominated diphenyl ethers (PBDE)-( in electronic products by July 1, Astro strongly supports efforts to create environmentally friendly and sustainable products. Because of product lifetimes and the high reliability requirements of Astro products, we need to prepare our suppliers and ourselves well in advance to ensure a successful transition to lead-free and ROHS compliant products by July 1,

6 Impact of RoHS Process Component Current Equipment capability Impact Solderability Cost Reliability 6

7 RoHS RoHS 路 SMD PVC 老 料 PVC CRT 度 relays and switches 療 數 理, 料 料 PBDE PBB ( ) 路 連 7

8 XRF Options Apply to RoHS(Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment) 金 Accurate and repeatable for EEEs formed various or small shape, printed point. Easy set with XRF. Screening rapidly Unknowns, research 48 Cd 82 Pb 80Hg 24 Cr6+ 35 Br Mg 20 Ca 17 Cl... 8

9 量 ( 金 ) Cd Pb Hg Cr+6 Packing Ni Reference EU Microsoft H00594F Apple D Sony SS Dell T-198 Panasonic Ver.2.1 Motorola GS2257 BENQ TCO TCOD1023 Foxconn

10 量 類 Microsoft Apple Sony Dell Panasoic Motorola BENQ Foxconn 聯 PBB/PBDE 聯 PCB AZO asbestos dioxines 蠟 CP CFC O-tin 靈 Mirix 奈 PCN Formaldehyde PVC - - TBD

11 理 Testing Item Method Used 1. Cadmium (Cd) & its Compounds 2. Lead (Pb) & its Compounds 3. Mercury ( Hg ) its Compounds 4. 六 Hexavalent- Chromium (Cr 6+ ) Compounds EN , 91/338/EEC US EPA 3050B US EPA 3052 US EPA 3060A & 7196A 聯 聯 / 聯 類 PBBs, PBDEs and PBBEs 83/264/EEC

12 RoHS Q Q Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 All Pb-Free >90% products Pb-Free > 50% products Pb-Free All new projects are Pb-Free design First Pb-Free Product MP All MFG sites are ready for Pb-Free Process Support Pb-Reduced OEM/ODM for system products by customer s request First Pb-Reduced product try-run Pb-Free process ready for pilot-run Today Intel Pb-Free components Ready for MP RoHS Compliance due day 12

13 ROHS Supply Chain Management Milestone 2/13/ /31/ /1/2003 1/E/2004 2/20/2004 WEEE & RoHS Directive announced Meeting with vendors for preliminary discussion First surveying Supply Chain status Wistron ROHS criteria defined ROHS promotion In 2004 vendor conference 3/15/2004 5/31/2004 7/31/ /31/ /31/2004 1/1/2005 Issue ROHS Questionnaire Supplier requested to offer MSDS, SGS report ROHS component Data base ROHS data base finished Supplier offer Disuse Certificate ROHS supplier & component Ready built up 13

14 RoHS Requirements Lead (Pb) Cadmium (Cd) Mercury (Hg) Hexavalent chromium (Cr 6+ ) PBBs PBDEs Less than 1000 ppm. (Pb content of other alloys :2002/95/EC Steel : 3500 ppm ; Al alloy : 4000 ppm ; Cu alloy: ppm) Less than 100 ppm 91/338/EEC Less than 1000 ppm Less than 1000 ppm Less than 1000 ppm Less than 1000 ppm 14

15 Conception of Green Partner G.P. 念 Cooper

16 綠 理念 度來 類 臨 諾 力來 16

17 Green Partner Chain Submitting documents Composition Table or MSDS When searching for component parts 料 Raw material supplier Table or MSDS Applicable parts list When starting mass production Measurement Data Parts supplier 零 Measurement Data Certificate of Non-use (for parts approval / authorization) Certificate of Non-use Manufacturer (for parts production of parts) Measurement Data Composition By Request Certificate of Nonuse (for production) Customer When making a change Change Notice Sheet and All documents described above) Change Notice Sheet and All documents described above) Change Notice Sheet and All documents described above) 17 MSDS : Material Safety Data Sheet

18 料 力 立 金 綠 來 理 18

19 力 立 力 諾 綠 料 綠 理 19

20 力 力 諾 * 不 綠 料 量數 立 内 立 料 料 不 20

21 P 7 力 力 金 菉 類 類 類 類 類 類 參 說 21

22 P 8 例 連 料 料 料 料 红 綠 來 律 22

23 P 9 23

24 料 念 不 不 行 断 料 來 行 量 了 24

25 料 料 Sectro 25

26 P 13 不 不 列 料 * 别 3. 數 4. 料 没 不 没 料 不 26

27 理 理 理 理 行 理 立 列 不 零 料 量 零 料 量 理 () 理 () 料 理 () 27

28 Component Requirement for Lead-Free Process Cooper 28

29 Lead-Free(Pb<1000 ppm) 綠 年 良率 來 力 年 識 零 立 年 不 量 29

30 Component Selection Pb Content and Process Compatibility Pb content* Lead in Solder with 1000ppm lead impurity. 量 Process compatibility BGA balls: Require SnAgCu. Other component termination selections: For non-bga components, use only Pb-free finishes that are compatible with both SnPb and Pb-free processes. SnZn and SnBi finishes are not used. Other finishes are accepted, if they pass solder joint reliability testing. Moisture sensitive parts 30

31 Component Heat-resistance Requirement for Lead-Free Process For SMT type component : Must Survive three 15~20 second of 260 (peak temperature), Time above liquid 60~120 second (body surface temperature). For Wave soldering component : Must survive a single 30 second exposure of 170 C (body surface temperature). 31