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1 COGCOH HGLGPHRHSHTHUJSL COGCOH HGLGPHRHSHTH UJSL X7RX5R Y5V Z5U X7R Y5V SUMMARY Types of Dielectric Material and Capacitor HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as Classcapacitor, including high frequency COGCOH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL. The electrical properties of COGCOH capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HGLGPHRHSHTHUJSL capacitor s capacitance changes with temperature.they are suited for applications where low-losses and temperature compensating circuits. X7RX5RX7RX5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class capacitor whose capacitance is higher than that of class. These capacitors are classified as having a semi-stable temperature charac teristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc. FH
2 Y5VThe capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. Z5UThe capacitor made of this kind of material is considered as Classcapacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature. STRUCTURE AND DIMENSIONS DIMENSIONS L L W T WB WB British expression Type Dimensions (mm) Metric expression L W T WB NoteWe can design according to customer special requirements FH
3 STRUCTURE T W L NO Name Ceramic dielectric Inner electrode Substrate electrode Nickel Layer Tin Layer HOW TO ORDER 0805 CG 101 J 500 N T NOTES DIMENSIONS unitinch/ mm Size Code (LW) 0.04 inch (LW) 1.00 mm DIELECTRIC STYLE CG CH HG LG PH RH SH TH UJ SL X B E F (Dielectric Code) COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V (Dielectric) FH
4 NOMINAL CAPACITANCE (unit)pf (Express Method) (Actual Value) 0R R R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point CAPACITANCE TOLERANCE (Code) B C D F G J K M S Z (Tolerance) 0.10pF 0.25pF 0.5pF 1.0% 2.0% 5.0% 10% 20% BCD 10pF. NoteThese capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF. +50% -20% +80% -20% RATED VOLTAGE (unit)v (Express Method) (Actual Value) 6R R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point TERMINAL MATERIAL STYLES Termination Styles (Express Method) Silver Solderable Termination Copper Solderable Termination Nickel Barrier Termination S C N FH
5 PACKAGE STYLES B Bulk Bag T Taping Package / Temperature Coefficient /Characteristics Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range COG 20 C 0±30 ppm/ COH 20 C 0±60 ppm/ HG 20 C -33±30 ppm/ LG 20 C -75±30 ppm/ PH 20 C -150± 60 ppm/ RH 20 C -220± 60 ppm/ SH 20 C -330± 60 ppm/ TH 20 C -470± 60 ppm/ UJ 20 C -750± 120 ppm/ SL 20 C ppm/ X7R 20 C ±15% X5R 20 C ±15% Z5U 20 C -56%+22% 1085 Y5V 20 C -80%+30% C 85 C 20 C NoteNominal temperature coefficient and allowed tolerance of class are decided by the changing of the capacitance between 20 C and 85 C. Nominal temperature coefficient of class are decided by the temperature of 20 C. FH
6 Capacitance Range and Operating Voltage /unit: pf Capacitance Size Code Rated Voltage COGNPO X7R X5R Y5V (Z5U) 6.3V ,000 39,0004,700,000 1,0001,000,000 10V ,000 39,0001,000,000 1,0001,000, V ,000 39,00047,000 1,000220,000 25V ,000 1,000100,000 50V ,000 1,000100, V 0.14, , ,0004,700,000 1,0004,700,000 10V 0.14, , ,0001,000,000 1,0002,200, V 0.14, , ,0001,000,000 1,0001,000,000 25V 0.14, ,000 1,0001,000,000 50V 0.14, ,000 1,000220, V 0.310, ,000,000 1,000,00010,000,000 1,00010,000,000 10V 0.310, ,000,000 1,000,0004,700,000 1,00010,000, V 0.310, ,000,000 1,0002,200,000 25V 0.310, ,000,000 1,0002,200,000 50V 0.310, ,000 1,0001,000, V 0.533, ,200,000 1,200,00010,000,000 1,00047,000,000 10V 0.533, ,200,000 1,200,00010,000,000 1,00022,000, V 0.533, ,200,000 1,200,00010,000,000 1,00010,000,000 25V 0.533, ,700,000 1,0002,200,000 50V 0.512, ,000 1,0001,000,000 FH
7 Capacitance Size Code Rated Voltage COGNPO X7R X5R Y5V (Z5U) 6.3V 1010, ,300, uF22uF 4,70047,000,000 10V 1010, ,300, uF22uF 4,70047,000, V 1010, ,300, uF10uF 4,70010,000,000 25V 1010, ,200,000 4,70010,000,000 50V 108, ,000,000 4,7001,500, V 1010, ,700, uF22uF 4,70033,000,000 10V 1010, ,700, uF22uF 4,70022,000, V 1010, ,200,000 4,70022,000,000 25V 1010, ,200,000 4,70010,000,000 50V 106, ,000,000 4,7002,200, V 1015, ,000,000 10uF22uF 10,00033,000,000 10V 1015, ,000,000 10uF22uF 10,00022,000, V 1015, ,000,000 10uF22uF 10,00022,000,000 25V 1015, ,000,000 10,00010,000,000 50V 1012, ,200,000 10,00010,00, V 1047, ,000,000 10uF33uF 10,00047,000, V 1047, ,000,000 10uF22uF 10,00033,000,000 16V 1047, ,000,000 10,00022,000,000 25V 1047, ,700,000 10,00010,000,000 50V 1033, ,300,000 10,00010,000, V 10100, ,000,000 10uF100uF 10,00047,000,000 10V 10100, ,000,000 10uF47uF 10,00033,000, V 10100, ,000,000 10uF33uF 10,00022,000,000 25V 10100, ,000,000 10uF22uF 10,00010,000,000 50V 1047, ,000,000 10,00010,000,000 NoteWe can design according to customer special requirements FH
8 Q COG Hi-Q COG MLCC : RF Hi-QESR CQCG Q Q 1MHz~2.4GHz CQ CG, Application: Hi-Q COG capacitors are ideally suited for RF and microwave application requiring high Q, low ESR, and high resonant frequency Note for CQ and CG: The following Q value is just confirmed by general customer. If there is a higher requirement for Q value requirements, we can design and produce according to the special requirements For the customer whose requirements for frequency is between 1MHz and 2.4GHz or higher frequency, we can design it according to their requirements The frequency of CQ is a little higher than that of CG. Please choose them according to your requirements CQ Q CQ Capacitance value and Q value Capacitance pf 300MHz Q Q value at 300MHz Capacitance pf 300MHz Q Q value at 300MHz Capacitance pf 300MHz Q Q value at 300MHz FH
9 HIGH VOLTAGE MLCC / Middle & high voltage MLCC is a kind of special design special technology MLCC that bases on the technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT. Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit. APPLICATIONS Analog & Digital Modems LAN/WAN Interface Lighting Ballast Circuits Voltage Multipliers DC-DC Converters Back-lighting Inverters FH
10 /unit: pf Capacitance Size Code Rated Voltage NPO X7R Y5V 100V ,000 2,20068, V , V , V 0.51, ,000 10,000100, V 0.11, ,000 10,00056, V 0.11, ,000 10,00056, V , V V 0.53, ,000 15,000330, V 0.12, ,000 10,000150, V 0.12, ,000 10,000150, V 0.11, , V 0.11, , V , V 1.04, ,000 10,000820, V 1.03, ,000 10,000390, V 1.03, ,000 10,000390, V 1.02, , V , V , V 2.04, , ,0001,000, V 2.03, ,000 10,000390, V 2.03, ,000 10,000390, V 2.01, , V , V , V , V , V FH
11 Size Code Capacitance Rated Voltage NPO X7R Y5V 100V , , ,0001,500, V 3.05, , ,000470, V 3.05, , ,000470, V 3.03, , V 3.01, , V , V , V , V V 5.027, ,000, ,0003,300, V 5.012, ,000 22,000680, V 5.012, ,000 22,000680, V 5.06, , V 5.02, , V 5.01, , V , V , V NoteWe can design according to customer special requirements. Measurement method of dielectric withstanding voltage for high voltage MLCC Rated voltage range 100VVr500V 500VVr1000V 1000VVr2000V 2000VVr5000V Measuring Method 200%, 5, 50mA Force 200%Rated voltage for 5 second. Max..current should not exceed 50 ma. 150%, 5, 50mA Force 150%Rated voltage for 5 second. Max..current should not exceed 50 ma. 120%, 5, 50mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 50 ma. 120%, 5, 10mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 10 ma. FH
12 Reliability Test Item Technical Specification Test Method and Remarks Measuring Measuring Capacitance Should be within the Frequency Voltage Class specified tolerance. 1000pF 1MHZ10% Vrms 1000 pf 1KHZ10% 25 3 Test Temprature: 25 3 C10µF : 1KHZ10% : Vrms Capacitance Class Should be within the specified tolerance. Test Frequency: 1KHZ10% Test Voltage: Vrms C10µF X7RY5V : HZ :0.50.1Vrms Test Frequency: HZ Test Voltage: Vrms Z5U :10.1KHZ : Vrms Test Frequency: 10.1KHZ Test Voltage: Vrms (DF, tan) Dissipation Class Factor DF Capacitance Measuring Measuring Frequency Voltage 0.56% Cr5 pf 1MHZ10% 1.5[(150/Cr)+7]10-4 5pFCr50 pf 1MHZ10% Vrms 0.15% 50pFCr1000 pf 1MHZ10% 0.15% 1000 pf 1KHZ10% FH
13 Item Technical Specification Test Method and Remarks 50V 25V 16V 10V 6.3V C10µF X7R 2.5% 3.5% 5.0% 5.0% 7.5% C3.3µF : Vrms 10.0% : 1KHZ10% Test Frequency: 1KHZ10% C3.3µF Test Voltage: Vrms (DF, tan) Dissipation Class Factor Y5V Z5U 25V 16V 10V 6.3V 7.0% C1.0µF 12.5% 12.5% 12.5% 9.0% C1.0µF C10µF X7RY5V : HZ :0.50.1Vrms Test Frequency: HZ Test Voltage: Vrms Z5U: :10.1KHZ : Vrms Test Frequency: 10.1KHZ Test Voltage: Vrms C10 nf, Ri50000M Class C10 nf, RiC R 500S : % (IR) X7R Insulation Resistance Class Y5V Z5U C25 nf, Ri10000M C25 nf, RiC R 100S C25 nf, Ri4000M C25 nf, RiC R 100S mA Measuring Voltage: Rated Voltage Duration: 605s Test Humidity: 75% Test Temprature: 25 Test Current: 50mA FH
14 Item Technical Specification Test Method and Remarks :300%:250% (DWV) Dielectric Withstanding Voltage Measuring Voltage: No breakdown or damage. 15 / 50mA ( MLCC) Class:300% Rated voltage Class:250% Rated voltage Duration: 15s Charge/ Discharge Current: 50mA max. (This method excludes high-voltage MLCC) 80~120 10~30. 95%. At least 95% of the terminal electrode is Solderability covered by new solder. Visual Appearance: No visible damage. Preheating conditions:80 to 120; 10~30s. Sn/Pb63/37 : 2355 : 20.5s : 2455 : 20.5s Solder Temperature: 2355 Solder Temperature: 2455 Duration: 20.5s Duration: 20.5s FH
15 Item Technical Specification Test Method and Remarks Item Resistance to Soldering Heat C/C DF IR NPOSL NPO to SL 0.5%0.5PF X7R Y5VZ5U -5~+10% -10~+20% 0.5% or 0.5PF whichever is larger Same to initial value. Same to initial value. 95% AppearanceNo visible damage.at least 95% of the terminal electrode is covered by new solder. 100~ : 2655 : 101s Preheating conditions: 100 to 200 ; 102min. Solder Temperature: 2655 Duration: 101s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 242h Recovery condition: Room temperature Al 2 O 3 PCB 1mm 0.5mm/sec. mm. Resistance to Appearance: No visible damage. Flexure of 20 T=10 Substrate (Bending Strength) 452 Test Board: Al 2 O 3 or PCB Warp: 1mm Speed: 0.5mm/sec. 452 C/C 10% Unit: mm The measurement should be made with the board in the bending position. FH
16 Item Technical Specification Test Method and Remarks 5N Termination No visible damage. Applied Force: 5N Adhesion 101S Duration: 101S h ( NPO/X7R: Y5V: -25 Z5U:+10) C/C: 2 (+20) 23 1%1pF, 3 ( NPO/X7R:+125 Y5V/Z5U: +85) 30 4 (+20) 23 B: 10% 242h E,F: 20% Temperature Preheating conditions: up-category temperature, 1h Cycle Class: 1% or 1pF, Class: E,F: 20% whichever is larger. B: 10% Initial Measurement Recovery time: 241h Cycling Times: 5 times, 1 cycle, 4 steps: Step Temperature Time (min.) NPO/X7R: Low- category temp. ( Y5V: -25 Z5U:+10) 30 2 Normal temp. (+20) 23 NPO/X7R: Up- category temp. ( Y5V/Z5U: +85) 30 4 Normal temp. (+20) 23 Recovery time after test: 242h FH
17 Item C/C DF Moisture Resistance Technical Specification : 2%1pF, : B: 10% E,F: 30% Class: 2% or 1pF, whichever is larger. Class: B: 10% E,F: 30% 2 Not more than twice of initial value. 402 Test Method and Remarks 90~95%RH ()48 () Ri2500MRiC R 25S Temperature402. Humidity90~95%RH Class: Ri2500MRiC R 25S whichever is smaller. Duration500h IR Ri1000MRiC R 25S Recovery conditionsroom temperature. Recovery Time24h (Class1) or 48h (Class2) Class: Ri1000MRiC R 25S whichever is smaller. Appearance: No visible damage. 2%1pF B: 20% E,F: 30% C/C Class: 2% or 1pF, whichever is larger. Class: B: 20% E,F: 30% 2 Not more than twice of initial value. Ri4000MRiC R 40S 100V mA DF Low-Voltage 100V Life Test. Applied Voltage: 1.5 Rated Voltage Class: Ri4000M RiC R Duration: 1000h 40S whichever is smaller. Charge/ Discharge Current: 50mA max. IR Ri2000MRiC R 50S Recovery Conditions: Room Temperature. Recovery Time: 24h (Class 1), or 48h Class: Ri2000M RiC R (Class2) 50S whichever is smaller. Visual Appearance: No visible damage. FH
18 Item Technical Specification 2%1pF Test Method and Remarks C/C B: 20% E,F: 30% Class: 2% or 1pF, whichever is larger. Class: B: 20% 100V 500V2 500V 1000V V mA E,F: 30% 125NPO X7R85Y5V Middle &high voltage Life Test DF IR 2 Not more than twice of initial value. Ri4000MRiC R 40S. 100VRated Voltage500V2 Multiple Class: Ri4000MRiC R 500VRated Voltage1000V1.5 Multiple 40S whichever is smaller. Ri2000MRiC R 50S. Charge/ Discharge Current: 50mA max. Class: Ri2000MRiC R Temperature125NPO X7R85Y5V 50S whichever is smaller. Visual Appearance: No visible damage Applied Voltage: 1000V Rated Voltage1.2 Multiple Duration: 100h Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 1h 241h NotePretreatment (only for class2 capacitor) Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the capacitor in the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the capacitor at standard pressure conditions for 241hours FH
19 PACKAGE PAPER TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel Bottom tape 0402 Dimensions of paper taping for 0402 type FH
20 *W1 *L1 *D C B P1 P2 P0 d t Code ± ± ± ± ± ± ± ± / Below Dimensions of paper taping for types. Feeding hole J Chip pocket A E D C T Chip cap Tape running direction Code paper size Unitmm A B C D E F G H J T ± / Max ± ± ± ± / Max ± ± ± ± / Max Note: The place with * means where needs exactly dimensions. FH
21 EMBOSSED TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel (0805~1812 ) Dimensions of embossed taping for 0805~1812 type Feeding hole J Chip pocket A B E D C T Chip cap H G F Tape running direction FH
22 Code Tape size A B C D* E F G* H J T ± ± ± ± / Max ± ± ± ± ± / Max ± ± / Max ± ± / Max ± ± / Max * NoteThe place with * means where needs exactly dimensions. Structure of leader part and end part of the carrier paper End (Vacant position) Chip carrier Vacant position Leader part(cover) tape) 200 mm 200 mm over 200mm over 200mm 200 mm /Over 200 mm / Moving Direction FH
23 Reel Dimensions (unit: mm) CODE A B C D E F G 7 REEL or more 12max 13REEL or more 12max FH
24 Taping specification Top tape peeling strength (a)paper Taping Cover tape peeling direction Cover tape 0~15 Carrier tape (b) Embossed Taping Cover tape peeling direction Cover tape 015 Carrier tape 0.1N< <0.7N Standard: 0.1N < peeling strength < 0.7N, No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. Bulk Case Package unit:mm Symbol A B T C D E Dimension / / Symbol F W G H L I Dimension / / FH
25 Packing Quantity * (SIZE) ( PACKAGE STYLE & QUANTITY) unit: pcs * PT * ET BC BP T1.35mm 3000 T1.35mm 2000 T1.80mm 2000 T1.80mm T1.85mm 1000 T1.85mm NoteWe can choose packing style and quantity can be according to the customer s requirement. FH
26 Outer packing The first package Quantity: 5 reels (Max 25000pcs) pcs The second package Quantity: 12 cases (Max pcs) pcs 65mm 185mm 200mm 197mm label 385mm 425mm Label PART No QUANTITY : DATE Production name Quantity Weight Storage Methods 6 ( ) The guaranteed period for solderability is 6 months (Under deliver package condition). /Storage conditions /Temperature 5~40 /Relative Humidity 20~70% FH
27 Precautions For Use (MLCC),,,,,. The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. 1. Soldering Profile,.( ) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). 2. Manual Soldering,,,.,,. Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. FH
28 3. Too much solder Cracks tend to occur due to large stress. Not enough solder, Weak holding force may cause bad connection between the capacitor and PCB. The temperature profile for soldering Re-flow soldering 1210 Temperature Peak Temperature () Preheating S Over 1 minute Over 1 minute Gradual cooling Pb-Sn FH
29 Wave soldering Temperature () Preheating Peak Temperature 230 ~260 Pb-Sn T150 Hand soldering Temperature () Over 1 minute 3s max. Gradual cooling Preheating Peak Temperature Over 1 minute 3s max. Gradual cooling W 1mm 5s 1/2 FH
30 1. ROHS NPO ROHS 2. ROHS (PF) 0402 COG 0.1~ COG 0.1~ COG 0.1~ COG 0.1~ COG 12~ COG FH
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