Nihao

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谆斐郦
7 years ago
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1 PCB PCB... 2 PCB PCB (SMT) PCB PCB PCB... 9 DFM DFM

2 PCB 1. Test Coupon: test coupon TDR (Time Domain Reflectometer) PCB test coupon ) (ground TDR (probe) (probe test coupon ti 2. Edge-Conncetion (Gold Finger (Connector) 140 Knoop 30u in (Substrate) COB chip on board " " wire bond 100 Knoop 3., :Hard Gold; soft Gold IC 4. SMT Additive Process() PCB ) Angle of attack() Anisotropic adhesive() Z Application specific integrated circuit (ASIC ) Artwork() PCB 3:1 4:1 Automated test equipment (ATE ) Blind via() PCB Buried via() PCB ( ) Bonding agent() 2

3 Bridge() Circuit tester() PCB Cladding() PCB CTE---Coefficient of the thermal expansion() (ppm) Cold cleaning() Component density() PCB Conductive epoxy() Copper foil( ) PCB Copper mirror test() Defect() Delamination() Desoldering() () DFM() Environmental test() Functional test() Fiducial() Fine-pitch technology (FPT ) 0. Fixture () PCB Lead configuration() Machine vision() Mean time between failure (MTBF ) Photo-plotter() PCB ( Pick-and-place(-) PCB Placement equipment() PCB SMD X/Y Reflow soldering() / Schematic() Solder bump() Soldermask() 3

4 Type I, II, III assembly( ) PCB(I) SMD (II) SMD () (III) Ultra-fine-pitch() (0.25mm) Void() Yield() 5 Keying Slot 6. Mounting Hole Insertion Hole,Lead Hole 7. Laminate : CCL Copper per Claded Laminates 8. Prepreg 9. Silk Screen 10. Screen Printing 11. Screen ability 12. Solder Bump 13. Substractive Process 14. Surface-Mount Device(SMD) SMD 15. Surface Mount Technology SMT 16. Thin Core 17. Through Hole Mounting 18. Twist PCB PCB PWB 1936 ~ 4

5 PWB 1950 ~ PP PWB PWB PP PWB 3 PWB 1960 ~ GE PWB GE PWB GE 1965 GE GE PP 4 PWB 1970~ MLB PWB mm mm PWB PWB TMT SMT PWB 20 SMT PWB 5 MLB 1980 ~ 1982 ~ PWB MLB MLB 1980 PCB 62 MLB MLB ~ MLB 1991 PWB 1994 MLB 1998 MLB IC BGA CSP 50 PWB 1947 IC ISI VLSI MCM BGA CSP IC PCB PCB (Printed Circuit Board) PCB PCB 5

6 6 PCB 100 PCB UV UV / : B / PCB

7 MCM MCM (Multi Chip Module ) MCM MCM MCM MCM MCM-D Mulit Chip Module Deposited Thin Film 500Mhz PCB 3 (SMT) 1) SMT 1/10 SMT 40%~60% 60%~80% 7

8 30%~50% 2) (SMT) (IC) (IC) 3) SMT / Surface Mount Technology SMT SMT SMT SMT SMT CIMS SMT SMT SMT FMS SMT 4 PCB PCB MIL STD

9 PCB (HASL, hot air solder leveling) (OEM, original equipment manufacturer) OEM HASL (PWB, printed wiring board) ( ) OSP 20 ~ 30% HASL ENIG OSP HASL PWB HASL OSP organometallic)( ) (ENIG) OSP OSP PWB 1 OSP 9

10 PWB ENIG ENIG PWB OSP PWB HASL OSP 2,3 OSP / (intrusive reflow) (selective solder fountain)(compliant pin) (through-hole) (paste-in-hole) PWB HASL (com 4 HASL OEM OSP OSP PWB PWB HASL (key contact) (component shielding)(edge connector) PWB (wire bonding) PWB (HDI, high-density interconnect) ENIG 10

11 OSP PWB OSP ( ) (gold wire bonding) / OSP PWB OSP OSP ( ) OSP ENIG OSP (area array package) OSP ENIG 5,6 300, " 10oz 100% #1 #2 #3 OSP BTH 10370KG OSP 10370KKY BTH 10370KGM KHW BTH 10370K9Z K8Y /

12 Sn63/Pb PWB (whisker) (30 ) ~ 50 millionths (ICT, in-circuit test) ICT OSP PWB OSP (chip-scale)(flip chip) / (TAB, tape automated bonding) (wire bondable) ICT OSP HASL HASL DFM DFM(Design For Manufacture) DFM DFM 1 DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM 12

13 ( ) DFM DFM DFM ( DFM DFM 2 DFM DFM DFM : DFM PCB DFM / ) DFM : : DFM ( dpm, defects per million) DFM PCB DFM PCB ( ) PCB X DFM 13

14 DFM PCB 66% DFM DFM 10% DFM PCB * Standards PCB X before DFM PCB X after DFM Process dpm S/U Run Variable S/U Run Quantity S/U Run Quantity Stencil Print(T) (PCB) Chip Place (SMT) IC Place (SMT) Reflow Internal Stencil Print(B) (PCB) Chip Place (SMT) IC Place (SMT) Reflow Internal Clean (PCB) DIP (Comp) Sequence (Comp) VCD (Comp) Radial (Comp) Stake (Comp) Mask (Point) Adhesive Dispense Internal Chip Place (SMT) IC Place (SMT) Cure Internal Clean (PCB) Prep (Comp)

15 Prewave (Comp) Wave Solder/Clean (PCB) Postwave Difficult (Comp) Postwave Easy (Comp) Clean (PCB) Depanel (PCB) Conformal Coat (PCB) Inspection (Solder Joint) Enter Lot Size Enter Realization I.E. Minutes Prorated Setup Total I.E. Min Total I.E. Hours Expected Cycle Time Expected Cost $32.15 $11.02 Expected Yield 89.40% 98.70% * All numbers are fictitious and are intended for instructioal purposes only.. DFM : PCB 18 DFM 1 0 (1 = 0 = ) ( 1 2 ) 1 0 (1 = 0 = ) ( 18) ( ) DFM 15

16 Design for Manufacturability Scoring Project: X Board #: Y Components Specs Proto 1 Proto 2 Manufacturing Model Production <1% sole-sourced components >95% PPSL compliance Process compatible packaging Component count - single pass <2% hardware Correct Strategy selected Design Optimal PCB panel Fabrication DRC resolved Zero defect documentation CAM ready data Within PCB design guidelines Process compatible orientation Manufacturing Process Correct material packaging Automation content >90% <1% post wave process Process steps < No fixtures/tools required sigma yield possible DFM Score 18% 33% 50% 72% 89% % World Class 16

17 % Highly Manufacturable 77-84% Acceptable 69-76% Poor 0-68% Unacceptable : DFM X Y ( ) DFMDFM DFM DFM DFM DFMM DFM 20 DFM CAE DFM DFM DFM IPC Association Connecting Electr onics Industries, (846) Surface Mount Equipment Manufacturers Association (SMEMA), (847) Electronic Industries Alliance (EIA), (703) SMC-WP-004 Design For Excellence 17

18 IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes IPC-D-325 Documentation Requirements for Printed Boards, Assemblies, and Support Drawings IPC-D-330 Design Guide Manual IPC-D-390 Automated Design Guidelines IPC-C-406 Design and Application Guidelines for Surface Mount Connectors IPC-SM-782 Surface Mount Design and Land Pattern Standard IPC-EM-782 Surface Mount Design and Land Pattern Standard Spreadsheet EIA-JEP-95 JEDEC Registered and Standard Outlines for Semiconductor Devices SMEMA 3.1 Fiducial Design Standard PCB 18

19 OICQ

P.1

P.1 P.1 P.2 1. 2. IC 3. 4. IC 5. P.3 (Interconnection).. P.4 (Wafer) (Chip) (MCM) P.5 電子構裝之主要功能電源供應層 1.有效供應電源信號分佈層 2.提供信號傳輸協助散熱保護元件 3.協助排除耗熱 4.保護電子組件 5.建構人機介面 Images 3D Graphics 建構人機介面 P.6 DIP Dual In-Line