LED 7-1 / PXI

Transcription

1 2010

2 LED 7-1 / PXI

3 : / Irvine / Lake Forest / / / / / 1-1

4 c-si I-V VLSI 3360-D 6-1 VLSI 3360-P 6-2 VLSI LCD IC SoC SoC 3650-CX 6-8 SoC IC xsd Card LED LED LED Wafer/Chip ESD AC LED LED LED M 7-7 LED Light Bar Top-view LED Light Bar Side-view LED Light Bar / LCD Shorting Bar /29132/29133/ () (VPG) 2226/ / / / / A B / A B B B / / A222701/A A / 28102/ ICAM 9-39 ICAM / / LED A A / / /

5 62000P H B K F F (ATS) PC / LCD LED GLASSMAN LCR / LCR 11021/11021-L 12-3 LCR 11022/ LCR 1061A/ 1062A/ / LCR QuadTech 7600 Plus /1320/1320S/ A /11801/ / /11805/ 11890/ (ATS) QuadTech ECG-Kokusai HIOKI SM / HIOKI DSM /19032-P /19055-C / 9056/ kV / 900A/900B (ATS) COMBINOVA 14-8 DAC 14-9 QUALMARK CRYOTECH GDAT // GHI // IET PXI U/6U MINI PXI / / PXI U cpci cpwr U cpci cpwr

6 ➊ 1061A LCR A LCR LCR LCR L LCR LCR LCR / A S P L M ML S Series C ➋ A B A B B RF B ➌ IC xsd Card VLSI D VLSI P VLSI LCD IC SoC SoC CX SoC ➍ ➎ U/6U slot slot slot Mini PXI PXI 8-slot PXI 4-slot PXI 18-slot PXI 14-slot PXI 15-10

7 / I-V I-V I-V TF I-V & CPV I-V LED LED Wafer/Chip ESD A ESD B ESD AC LED LCD Shorting Bar LED M LED Top-view LED Light Bar LED Light Bar Side-view LED Light Bar c-si 5-7 ➏ B B B B B B H H H H H H H H H H H H H-600S K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K

8 62060K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K P P P P P P P P P P P P P F F F F F F F F F F F F F F F F F F F F F F F A A A A 11-7

9 63105A A A A A A A A A A A A A A A A A A / / / / () () () () 8-12 ➐ A / LED 10-6 ➑ PC / LCD LED ➒ 900A B kV A ~ Z A / 9-31 A / 9-31 A COMBINOVA 14-8 cpwr U cpci cpwr U cpci cpwr U cpci cpwr U cpci cpwr U cpci cpwr U cpci cpwr U cpci CRYOTECH DAC 12-9 ECG-DWX GLASSMAN GDAT GHI // HIOKI SM HIOKI DSM / ICAM 9-39 ICAM 9-39 IET // QUADTECH QUALMARK

10 Model % 2D Resistively/Thickness : / : / 4 See Page 5-2 Model 3720 c-si : Chroma UPH : 1,500 : 0.2% : (Small footprint) 5" 6" / 4 See Page 5-3 Model : 0.2% I-V 4 See Page 5-4 c-si Model : Eff Pmpp Impp Vmpp Isc Voc FF Rshunt Rs Irev. / / AAA+, ( Chroma 3720) 4 See Page 5-7 I-V Model I-V : Eff Pmpp Impp Vmpp Isc Voc FF Rshunt Rs Irev ( ) / / 4 See Page

11 VLSI Model 3360-D 50 MHz 16 ~ 64 I/O 8M Pattern : 2 devices Real Parallel Trim/Match Timing / Frequency measurement unit (TFMU) SoC /pattern (V7, V50, SC312, J750) Analog PE (16 bits) SCAN (512M) ALPG STDF () Windows XP CRAFT C/C++ 4 See Page 6-1 Model 3650-CX 50/100MHz 256 I/O (I/O Channel) 16/32 MW vector 16/32 MW pattern instruction Multi-site 32 sites 16 DPS 8 PMU Per-Pin 1024M bit x 4 CH scan depth ALPG 16 high-voltage pins 16 DPS C++ CRISP All-in-One Cable Mount / Direct Mount 4 See Page 6-8 Model Model PXI 3U Date rate 100MHz 8 per-pin, per-cycle I/O 64 pin 32M sequence command 17pattern sequence 32M vector 32 clock waveform Waveforms tri-level driver, 610uV Per-channel PXI 3U 4 +5V/-2V +10V/-2V force ranges 16-bit 18-bit 5uA ~ 250mA 6 clamp Ganged PXI Windows 2000/XP LabView LabWindows CRISP 4See Page 6-11 / 6-12 Model 3260 Pick&Place QFP (ECD) IC , , & See Page 6-14 Model 3813 : 6 inch x 3 sites or 12.1 inch x 1 sites 6 : 15g~1000g : 3g X auto cad dxf () 4 See Page

12 LED Model 8491 LED ( & ) LED - - GPIB/RS-232/RS-485/I²C Bar Code Reader Windows 98/2000/NT/XP 4 See Page Model 8495 / Windows 98/2000/NT/XP See Page : 5KW / 10KW / 15KW : 0 ~ 600V : 0 ~ 375A 3U / 15KW / & 150KW / ( : 10 ms ~ 99 hours) / Model 62000H USB / RS232 / RS485 GPIB / Ethernet ON / OFF (I / P) LabView Labwindows CE 4 See Page Model 62000B : 1 ~ 150V : 0 ~ 2000A () : 1.5kW 120kW N+1 (464 mw/cm³ = 7.13 W/In³ ) & ON/OFF ( ) CAN Bus DC OK 4 See Page

13 Model 61511/61512/61611/61612 : 61511/ KW, 61512/ KW ; : 0~150V/0~300V/Auto : DC,15Hz 1500Hz, 1-phase 3-phase LIST PULSE STEP (Synthesis, Interharmonics) GPIB RS-232 USB Ethernet Model 61511/ See Page Model 61611/ See Page Model 6310A : 200W, 100W 2(Dual), 30W & 250W, 300W, 600W, 1200W : 0 ~ 500V W 20kHz 100 I/O (OCP) RS-232 USB() GPIB() 4 See Page 11-7 Model : 100W x 2 ( ) 300W & 400W : 80V W 400W 10 80A(Typical) 2kW 50kHz (Sweep) (Vpk+/-) 100 (Digitizing)/ / (Pmax) 4 See Page / : 1800W, 3600W, 4500W : 50V ~ 350Vrms : 45Arms : 135A / : 45 to 440Hz, DC : ~ 5.0 : 0 ~ 1 () : : Model : UPS : V, I, PF, CF, P, Q, S, F, R, Ip-/+ and THDv : GPIB RS See Page

14 Model LVDS - 1/2/4 Channel - 6/8/10 bits MHz (1 Link 135MHz/2 Link 270MHz/4 Link 330MHz) Vdd 3.3~13V/3.5A Vbl DC Power OCP EDID// / 4 See Page 8-5 Model 2916 LCM LVDS 4 Channels LVDS : Signal 135MHz, Dual 270MHz, 4 Link 600MHz 1920x1080@240MHz MPEG/AVI/GIF 8 OCP/OVP/UVP/UCP 4 See Page 8-10 Model 2233-B - HDMI port x3 - DisplayPort port x2 - SCART port (x1 / x1) DisplayPort V1.1a 270MHz DisplayPort HDCP V1.3 /DisplayPort - 2 Link rate (1.62/2.7Gbps) - 1,2,4 Video Lane - 0/3.5/6/9.5dB pre-emphasis / 600 / 800 / 1200mV Swing level HDMI V1.3C ( 24, 30, 36bit / xvycc / CEC / Lip Sync ) (DVI)330MHz DVI Dual HDCP DVI HDMI DisplayPort HDCP Y Pb Pr / Y Cb Cr / Y R-Y B-Y S-Video / CVBS / SCART / RGB / / D NTSC / PAL / SECAM EDID / / HDMI/DVI USB 4 See Page 9-23 Model cd/m² (A712300) 0.01 to 6000 cd/m 2 (A712300) 0.3 to 6000 cd/m 2 (A717002) 0.1 to 6000 cd/m 2 (A712200) xyy T uvy u' v' Y RGB XYZ FMA(A712200) FLVL(A712200) Contrast Program Contrast JEITA VESA (A712200) USB 100 LCD-D65 LED-D65 4 See Page

15 LED Model 7930 LED Z LED LED 4 See Page 10-6 Model AC/DC/IR 10/ /(OSC) (Flashover) AC 5kV DC 6kV 1MΩ ~ 50GΩ 4 See Page 13-7 Model P EN50191Floating(19032-P) 500VA (19032-P) / / () (Twin-Port) AC 5kV DC 6kV 50GΩ/1000V DC / (OSC) (Flashover) (A / A / A / A190308) 4 See Page kV/100mA - 6kV/20mA - 5kVmax - 1M ~50G 500VA Floating EN50191 Corona (19055-C) Flashover BDV HFCC OSC GFI RS232 GPIB&HANDLER Model 19055/19055-C CE 4 See Page

16 Model 11800/11801/11810 (= Vdc+Vac_peak) ( ) ( ) 0-500V : 0.3% 0.01~30A 100Hz/120Hz/400Hz/1KHz : (0.5% of reading +0.1% of range) (11800) 0.01~10A 20kHz-100kHz : 2%(11801) 0.1~10A 20KHz~1MHz (11810) A () LCD(320 X 240 ) RS pcs 4 See Page (Leakage Current) (static capacitance) (IR internal resistance) ESR (static capacitance) Model 1850 Excel CSV LCD 4 See Page Model 1810 : 20kHz~200kHz, 20kHz~500kHz : 30A/16V max, 30A/33V/16V max : 250V/2A max (60A) 4 See Page Model GPIB / RS-232 RS / - -Bar Code Reader Windows 2000/XP RJ-45(LAN Modules, Ethernet IC, PoE IC ) () LCD ( touch panel ) PCB EMI Filter ICT 4 See Page

17 Configurative System Model LED - 18 Slot - - / I/O - PXI/PCI LED Wafer/Chip ESD () 4 See Page 7-1 AC LED Model Chroma AC LED AC/DC / /CIE127 AC/DC LIV / 4 See Page 7-5 LED Model Chroma LED LED wafer/chip 6 Wafer/chip PXI LED wafer/chip 18 PXI ESD () 4 See Page 7-6 Top-view LED Light Bar Model RGB LED Top-view Light Bar ESD LED Light bar FPC/PCB Light Bar 4 See Page

18 PV(Photovoltaic) PV (Wafer) (Cell)(Module) I-V c-si 5-7 I-V 5-8 PV (Inverter) ;

19 c-si I-V

20 3700 Model No. Solar Cell Inspection System Model 3700 (Chroma 7211) (Chroma 7212 & 7213) % LCD GUI I-V (Chroma 58301) Chroma CIELAB Chroma 3700 Chroma 3700 I-V (Chroma 58301) 3700 : Loading Backside Inspecting Frontside Inspecting Handling Sorting 5-1

21 / Solar Wafer Inspection System Model % 2D Resistively/Thickness : / : / Wafer Magazine Model No. Chroma D Thickness Lifetime 3710 : Loading Auto-unloading Manual-unloading 3710 LEDPXI 5-2

22 3720 Model No. Solar Cell Test/Sorting System Model 3720 c-si : Chroma UPH : 1,500 : 0.2% : (Small footprint) 5" 6" / Chroma 3720 Chroma c-si ; : Pmpp Efficiency ; c-si : FF 3720 : Wafer Magazine Loading Testing Handling Sorting 5-3

23 / Solar Cell Inspection Test/Sorting System Model : 0.2% I-V Model No. Chroma 3730 Chroma : Wafer Magazine Loading Automatic Optical Inspection Testing Handling Sorting 3730 LEDPXI 5-4

24 3705 Model No. Chroma 3705 Chroma : Solar Wafer Cassette Transfer System Model % LCD LCD Application Device Device carries Wafer Loading Unloading Pick up method Transfer accuracy Tact time Breakage rate 125x125 ~156x156mm Thickness 160µm (min) Magazine type Automatic Cassette type Vacuum pad 2.5mm 2.5 sec 0.2% Wafer Magazine Transfering Cassette 5-5

25 LED/ 7211: Model No Automatic Optical Solar Cell Inspection Modules Model 7200 LED mm x 125mm 156mm x 156mm CIELAB : LED : A Light Blue Dark Blue Purple Mix Color (recipe) 7200 : 7200 IO RS : 7213/7213-A: LED A : Chipping Discolorationt Finger Width Stains Bump BUSBar Defect Stain Alignment Shift Model /7213-A Camera Color CCD 1024 x 768 pixels Mono CCD 2000 x 2000 pixels Mono CCD 2000 x 2000 pixels Light Source LED strobe lighting Multi-Layer LED strobe lighting Multi-Layer LED strobe lighting Lens Low distortion Lens Low distortion Lens Low distortion Lens Monitor 12" Touch Screen 12" Touch Screen /12" Touch Screen Dimension 240 x 280 x 360mm / 360 x 600 x 800mm 360 x 600 x 800mm (WxDxH) 360 x 600 x 800mm Weight 60kg 60kg 30kg/60kg Accessory 88-keys keyboard with touchpad 88-keys keyboard with touchpad /88-keys keyboard with touchpad Resolution 240µm 90µm 90µm Interface RS-232, Ethernet, IO Module RS-232, Ethernet, IO Module RS-232, Ethernet, IO Module Position Tolerance ±3mm ±3mm ±3mm Power 220V, 4A 220V, 4A 220V, 4A 5-6 PXI

26 c-si Model No. c-si c-si Solar Cell Tester Model : Eff Pmpp Impp Vmpp Isc Voc FF Rshunt Rs Irev. / / AAA+ ( Chroma 3720) / I-V / I-V I-V AAA : : - : - : - Chroma ( Chroma 3720) Wacom AAA+ Chroma : c-si Model Solar Simulator Section Lamp Type Xenon Short Arc Lamp Life 1,000 hrs Illumination Area 156mm x156mm Light Source Steady State (w/shutter Control) Air Mass AM1.5G (IEC ) Irradiation Intensity 100mW/cm2±15% (1 Sun±15%) Spectral Mismatch ±25% or Better Positional Non-uniformity 2% or Better Temporal Stability 1% or Better Light Collimation <5 Power Section Voltage Voltage Forward Range 20V V FORWARD Program Resolution 16 bits V FORWARD Ripple <3mVrms Voltage Reverse Range -20V V REVERSE ProgramResolution 16 bits V REVERSE Ripple <3mVrms Transient Response Time < 100µs Load regulation 0.002% F.S. Line regulation 0.002% F.S. Slew Rate 1V/µs Current Current Forward Range 20A I FORWARD Program Resolution 16 bits I FORWARD Ripple <0.03% Current Reverse Range -20A I REVERSE Program Resolution 16 bits Transient Response Time < 75µs Load regulation 1mA Line regulation 0.005% F.S. Slew Rate 1.25A/µs Power Power Rating 400W Measurement Section Voltage Voltage Measurement Range - Forward 1V V FORWARD Measurement Resolution 16 bits V FORWARD Measurement Accuracy 0.05% F.S. Measurement Points per I-V - Forward programmable Voltage Measurement Range - Reverse -15V V REVERSE Measurement Resolution 16 bits V REVERSE Measurement Accuracy 0.05% F.S. Measurement Points per I-V - Reverse programmable Current Current Measurement Range - Forward 10A/20A I FORWARD Measurement Resolution 16 bits I FORWARD Measurement Accuracy 0.1% F.S. Measurement Points per I-V - Forward programmable Current Measurement Range - Reverse -0.1A/-1A/-15A I REVERSE Measurement Resolution 16 bits I REVERSE Measurement Accuracy 0.1% F.S. Measurement Points per I-V - Reverse programmable Irradiance (Forward Only) Input Range 200mV Irradiance Measurement Resolution 16 bits Irradiance Measurement Accuracy 500uV Measurement Points per I-V - Forward programmable Temperature Sensing Section Measurement Type IR/Thermopile Temperature Range 0~500 C Reproducibility ± 0.5 C 5-7

27 / I-V Solar Cell/Module I-V Tester Model I-V : Eff Pmpp Impp Vmpp Isc Voc FF Rshunt Rs Irev ( ) / / Model No. I - V P V / Si-base CIGS CdTe TF GaAs-base : I-V / Chroma / I-V I-V Model Application c-si Cell c-si Module TF Module Multi-junction&CPV Cell Power Section Voltage Voltage Forward Range 20V 100V 200V 20V V FORWARD Program Resolution 16 bits 16 bits 16 bits 16 bits V FORWARD Ripple <3mVrms <3mVrms <5mVrms <3mVrms Voltage Reverse Range -20V -100V -200V -20V V REVERSE ProgramResolution 16 bits 16 bits 16 bits 16 bits V REVERSE Ripple <3mVrms <3mVrms <5mVrms <3mVrms Transient Response Time < 100µs < 40µs < 150µs < 100µs Load regulation 0.002% F.S % F.S % F.S % F.S. Line regulation 0.002% F.S % F.S % F.S % F.S. Slew Rate 1V/µs 10V/µs 5V/µs 1V/µs Current Current Forward Range 20A 4A 1A 20A I FORWARD Program Resolution 16 bits 16 bits 16 bits 16 bits I FORWARD Ripple <0.03% <0.03% <0.03% <0.03% Current Reverse Range -20A -4A -1A -20A I REVERSE Program Resolution 16 bits 16 bits 16 bits 16 bits Transient Response Time < 75µs < 30µs <120µs < 75µs Load regulation 1mA 1mA 1mA 1mA Line regulation 0.005% F.S % F.S % F.S % F.S. Slew Rate 1.25A/µs 0.25A/µs 15mA/µs 1.25A/µs Power Power Rating 400W 400W 200W 400W Measurement Section Voltage Voltage Measurement Range-Forward 1V 50V/100V 100V/200V 10V V FORWARD Measurement Resolution 16 bits 16 bits 16 bits 16 bits V FORWARD Measurement Accuracy 0.05% F.S. 0.05% F.S. 0.05% F.S. 0.05% F.S. Measurement Points per I-V-Forward programmable programmable programmable programmable Voltage Measurement Range-Reverse -15V -100V -200V -20V V REVERSE Measurement Resolution 16 bits 16 bits 16 bits 16 bits V REVERSE Measurement Accuracy 0.05% F.S. 0.05% F.S. 0.05% F.S. 0.05% F.S. Measurement Points per I-V-Reverse programmable programmable programmable programmable Current Current Measurement Range-Forward 10A/20A 2A/5A/10A 0.5A/1A 2A/10A/20A I FORWARD Measurement Resolution 16 bits 16 bits 16 bits 16 bits I FORWARD Measurement Accuracy 0.1% F.S. 0.1% F.S. 0.1% F.S. 0.1% F.S. Measurement Points per I-V-Forward programmable programmable programmable programmable Current Measurement Range-Reverse -0.1A/-1A/-15A -0.2A/-2A/-10A -0.1A/-1A -0.2A/-2A/-20A I REVERSE Measurement Resolution 16 bits 16 bits 16 bits 16 bits I REVERSE Measurement Accuracy 0.1% F.S. 0.1% F.S. 0.1% F.S. 0.1% F.S. Measurement Points per I-V-Reverse programmable programmable programmable programmable Irradiance (Forward Only) Irradiance Sensor Optional irradiation sensor or Pyranometer for indoor or outdoor I-V testing Input Range 200mV 200mV 200mV 200mV Irradiance Measurement Resolution 16 bits 16 bits 16 bits 16 bits Irradiance Measurement Accuracy 500uV 500uV 500uV 500uV Measurement Points per I-V-Forward programmable programmable programmable programmable Temperature Sensing Section Measurement Type IR/Thermopile IR/Thermopile IR/Thermopile Temperature Range 0~500 C 0~500 C 0~500 C Reproducibility ± 0.5 C ± 0.5 C ± 0.5 C (Handshaking) Chroma PV III-V : c-si I-V : c-si I-V : TF I-V : & CPV I-V Optional base on application 5-8 I-V LED PXI

28 IC (SoC) VLSI IC (Test Head) (massive multisite) (throughput) ; VLSI 6-1 LCD IC 6-5 SoC IC 6-15 SD Card IC IC

29 LCD IC VLSI SoC IC SD Card

30 VLSI 3360-D Model No. The Full Application Functions Logic, ADDA, LCD, LED, Power, ALPG, Match etc VLSI VLSI Test System Model 3360-D 3360-D Bridge Test Development to Mass-Production 50 MHz 16 ~ 64 I/O 8M Pattern : 2 devices Real Parallel Trim/Match Timing / Frequency measurement unit (TFMU) /pattern (V7, V50, SC312, J750) Analog PE card (16 bits) SCAN (512M) ALPG STDF () Windows XP CRAFT C/C++ pattern Fail pin/address : Shmoo plot, Waveform display, Wafer Map, Pin Margin, Scope tool, Histogram tool and etc. Model 3360-D (I/O) Test Rate 50MHz Pin Channels 16~64 Pins Pattern Memory 8M (16M Option) Parallel Testing Capability Single (Dual Option) Edge Placement Accuracy 625ps Resource Per Pin Architecture Yes DPS ( 16V, 400 ma) 8 PMU ( 16V, 100 ma) 8 PPMU (-2V ~ +7V, 25 A) Per Pin Programmable Load (Active Load) Per Pin ( 35 ma) Windows Environment Windows XP Programming Language C\C++ Test Option LCD Channel ( 80V) Max 32 LCD Output Pins AD / DA Converter Test Option 4 AWG / DGT (16 Bits AWI board) STPHI/GPIB TTL (Handler) / GPIB (Prober) SCAN Option 512M per IO board ALPG Memory Test Option 16X, 16Y, 16D System and Dimension Power consumption Max. 1KVA (90~240 Vac - 1phase 3W) Only Test Head W330 x D560 x H390 mm (Max. 35 Kg) 6-1

31 /VLSI VLSI Test System Model 3360-P 50 MHz 256 logic I/O pins 8~16 M Pattern ( I/O, UVI, ADDA, and LCD) 32 devices Real parallel Trim/Match Time & Frequency Measurement Unit (TFMU) /pattern (V7, TRI6020, V50, E320, SC312, D10, J750, ITS9K, TS670, ND1) AD/DA (16 ~24bit) SCAN (512M) ALPG STDF Windows XP CRAFT C/C++ The Full Functions - Logic, LCD, LED, ADDA, Power, ALPG, SCAN, Match... etc. OLED/CSTN Driver IC LED Driver IC Model No. Smart Card Chroma 3360-P MCU(Flash Embedded) IC All Consumer IC Power IC (LDO, Class D... IC) Engineering Board Available for Test Development on-the-spot & Ready for Direct-mount Solution 3360P FT Direct-mount Solution 3360P CP Direct-mount Solution Model 3360P (I/O) Test Rate 50MHz ( HSCLK I/O 100MHz) Logic I/O pins Max. 256 Pins Pattern Memory 8M (16 M option) Parallel Testing Capability Max. 32 DUTs EPA 625ps Resource Per Pin Architecture Yes DPS ( 10V, 2 A) 8 PMU ( 48V, 100mA) 16 PPMU ( 0.5V ~ 6.5V, 35mA) Per Pin TFMU function Per Pin Programmable Load (Active) Per Pin ( 35 ma) Windows Environment Windows XP Programming Language C\C++ Test Option Hi-V (LCD- 80V) Channel Max. 224 LCD pins AD / DA Converter Test Option 4 AWG / 4 DGT (16 Bits) Mixsig (AD/DA) Test Option HA : 24bits / HF : 200 MS/s UVI ( DPS 10V, 500 ma ) 16 HCDPS ( DPS 32V, 6A ) 8 HVREF ( DPS 60V, 1A ) 8 ( Max 24 ) SCAN Option ALPG Memory Test Option System And Dimension Power consumption 512M / board 16X, 16Y, 16D Max. 3KVA Only Test Head W640 x D470 x H639 mm (Max. 90 Kg) Note *1 : The "Cable-Mount" is standard, and the Direct-Mount is option P LEDPXI VLSI 6-2

32 VLSI 3360 Model No. Most Flexible Configuration for Various Devices (Logic, LCD, LED, ADDA, ALPG, SCAN, Power etc) Smart Card OLED/CSTN Driver IC LED Driver IC Chroma 3360 All Consumer IC Power IC (LDO, Class D... IC) MCU(Flash Embedded) IC VLSI VLSI Test System Model 3360 CRAFT (User Friendly and Powerful Test Development Software) 50 MHz (100MHz HSCLK) 608 I/O 8~16 M Pattern ( I/O, UVI, ADDA and LCD) 32 devices Real Parallel Trim/Match SC312, TS670 /pattern (V7, TRI6020, V50, SC312, J750, ITS9K, TS670, ND1) Analog PE card (16 ~24bit) SCAN test (512M) ALPG test STDF Windows XP CRAFT C/C++ pattern Fail pin/address : Shmoo plot, Waveform display, Wafer Map, Pin Margin, Scope tool, Histogram tool and etc. The Craft Software Tool Shmoo Tool Waveform Tool Pattern Editor Tool 32 Sites Parallel Production Card 6-3

33 /The most efficient patterns/test program converter for V7, TRI6020, V50(scud-1a), SC312, J750, ITS9K, TS670, ND1 SC312, TS670 patterns/program, Chroma 3360 Pogo-ring towersc312/t670 Model 3360 Standard Test Rate IO Channel Pattern Memory Parallel Testing Capability Edge Placement Accuracy Resource Per Pin Architecture DPS (±10V, ±2 A) 50MHz (high-speed clock 100MHz) 608 Pins (Max.) 8M ( 16 M Option) Maximum 32 DUTs ±625 ps Yes 24 (8 DPS, 16 PREF ±45V) PMU (±45V, ±100mA) 32 PPMU (±0.5V ~ 6.5V, ±35mA) Programmable Load (Active) Windows Environment Programming Language Test Option LCD Channel AD/DA Test Option High accuracy ADDA Option SCAN Test Option ALPG Memory Test Option Per Pin Per Pin ( ±35 ma) Windows XP C or C++ Max. 544 LCD Pin 4 AWG / 4 DGT (16 bits) 2 AWG/ 2 DGT (24 bits) 512 M (Per I/O Board) 16X, 16Y, 16D UVI (±10V, ±500mA) 16 System Dimension Power Consumption Cooling system Test Head (WxDxH) Mainframe (WxDxH) 8KVA Max. Forced air cooling 700 x 700 x 430 mm 960 x 670 x 1750 mm Model No LEDPXI VLSI 6-4

34 LCD IC 3520 Model No. CRAFT ( ) Windows XP Chroma 3250 T67XX/ND1 Chroma 3520 Pogo-ring tower T67XX/ND1 LCD IC LCD Driver IC Test System Model 3520 I/O 100 MHz 128 I/O (I/O Channel) 1008 LCD (LCD Channel) 4~8 M pattern 16 DUTS High Accuracy Digitizer ( 3mV) High Accuracy Current PPMU ND1, T670 / pattern (ND1, T670 converter) Windows XP CRAFT C/C++ pattern Fail pin/address hmoo plot, Waveform display, Wafer Map, Pin Margin, Scope tool, Histogram tool etc. Chroma 3520 CRAFT (ChRomA Fabricate Test System) CRAFT3 : / : Digital waveform scope waveform pin margin shmoo plot T67XX / ND1 Chroma 3520 T67XX/ND1 C h r o m a 3520 (T T L & G P I B ) A n d o Hitachi TEL TSK OPUS II Chroma 3520 LCD IC Chroma 3520 LCD Chroma I/O (I/O Channel) 1008 LCD (LCD Channel)T67XX/ND1 LCD OLED Driver IC TFT Driver IC Chroma 3520 Monitor Driver IC CSTN Driver IC Model 3520 Logic I/O Pin Test Rate 100MHz IO Channel 128 Pins(Max.) Pattern Memory 4M ( 8 M Option) Interface TTL/RSDS RSDS-Vpp 100mV Resource Per Pin Architecture Yes DPS 40 PPMU Per Pin (Current Accuracy 4nA) Programmable Load Per Pin Windows Environment Windows XP Programming Language C\C++ LCD Channel LCD Channel Max 1008 LCD pin LCD Comparator 40V, Accuracy 3mV Digitizer 16 bits, Accuracy 3mV System and Dimension Power Consumption 8KVA Max Cooling system Forced air Test Head W700 x D700 x H430mm Mainframe W960 x D670 x H1750mm 6-5

35 /SoC SoC Test System Model / 100 MHz 50/ 100 MHz 256 I/O (I/O Channel) 16M Pattern (Pattern Memory) Per-Pin 4 DUTS Pattern (Algorithmic Pattern Generator) ADC/DAC Very Small footprint 76cm x 73cm x 48cm Windows NT C pattern Fail pin/address Credence pattern Shmoo plot, Waveform, display, Wafer Map, Pin Margin, Scope tool, Histogram tool etc. VLSI (SOC) ; Chroma MHz 16V 400mA 100MHz True Test-Per-Pin Chroma3600Pe r-pin / -2V +7V16M (per-pin deep) 100MHz per pin PMU per-pin (PPMU) Ch r oma3600 IC Ch r oma 3600 per-pin IC Chroma 3600AD/DA ALPG PE RAISE () WindowsNT Chroma 3600 RAISE : RAISE : Shmoo plot, Waveform tool, Scope tool, Pin Ma rgin, Pa t t e rn Edi tor Pl an Debugger / Windows NT C Model No. OCI(Operator Control Interface) Chroma 3600 Device Setup OCI 3600 ; / Chroma 3600 Chroma 3600 (Small Footprint) Chroma 3600 VLSI Chroma Chroma 3600 LEDPXI SoC 6-6

36 SoC 3600 Model No. RAISE Software Platform (OCI) Shmoo Plot Histogram Tool Pin Function IC -include 4 channels timing generator within 50 ps accuracy Model 3600 Test Rate 50/100MHz Maximum Number of Pins (increment) 256 pins (64 pins / board) Vector Depth 16M per pin Over All Timing Accuracy 850ps Wave/Strobe Format 4096 timing/waveform combination,change on the fly System Programming Language/ OS C, C++, Window NT 4.0 Parallel test capability 4 DUT / 256 pins Timing Generator Per Pin No. of Edges 6 edges / pin (2 Driver, 2 Driver & I/O, 2 Strobe) No. of Timing Sets 32 sets / pin Edge Setting Resolution 62.5ps Device power supply No. of Channels 8 channels / 256 pins (max.) Voltage Range 8V, 16V (2 range) Maximum Output Current 2A(8V), 0.8A(16V) DC Measurement (PMU) PMU Channel 4 channels / 256 pins PMU Voltage Range 2.5V/ 8V/ 16V PMU Current Range 800nA/ 8uA/ 80 A/ 800 A/ 8mA/ 80mA/ 400mA PPMU Channel 1 channel / 1 pin PPMU Voltage Range -2V ~ +7V PPMU Current Range 400 A Driver Amplitude 0.1 V ~+ 9 V (-1.5V~+1.5V for high voltage pin) VIL/VIH Range -2V~+5V / -1.9V~+7V (-1.5V~+13.5V for high voltage pin) VIL/VIH Reference Level Per Pin Comparator VOL/VOH Assigned Range -2 V ~ +7 V Min. Window Strobe Width 5ns VOL/VOH Reference Level Per Pin Band Width 250MHz Programmable Load IOL/IOH Setting Range 0 ~ -35 ma / 0 ~ +35 ma IOL/IOH/VREF DAC Per Pin Options 16 bits AD/DA Converter Test Options 4 channels ALPG Option 12X, 12Y, 32D High Voltage PE Option 15.5V Multi Function Manipulator Option System and Dimensions Power consumption 5KVA max. Cooling system Forced air cooling Test Head (L x W x H) 940 x 644 x 571 mm Mainframe (L x W x H) 900 x 750 x 1650 mm 16 Channels LPC Board -include 4 high accuracy PINF IC 6-7

37 /SoC SoC Test System Model 3650-CX 50/100MHz 256 I/O (I/O Channel) 16/32 MW vector 16/32 MW pattern instruction Multi-site 32 sites 16 DPS 8 PMU Per-Pin 1024M bit x 4 CH scan depth ALPG 16 high-voltage pins 16 DPS Windows XP C++ CRISP All-in-One Cable Mount / Direct Mount MCU/MCU + NAND Flash Controller PC I/O Switch ICs ICs ADC/DAC/CODEC ICs IC Final Test IC LED IC Power ICs PC I/O TCON/ LCD Controller STB Chroma 3650-CX Consumer IC LED Driver ICs SoC High Performance MCU Chroma 3650-CX IC 3650-CXAll-In-One IC 3650-CX MCU NAND flash controller, PC IC Switch LEDIC Power IC SoC 3650-CX - CRISP Windows XPChroma 3650-CX CRISP(Chroma Integrated Software Platform) : C R I S P :Datalog, Shmoo plot Waveform tool Scope tool Pin Margin Pattern Editor Plan Debugger Histogram, STDF, Wafer Map / Model Test Rate Maximum Number of Pins (increment) Vector Depth System Programming Language / OS Parallel test capability Per Pin Timing Generator No. of Edges No. of Timing Sets Edge Setting Resolution Device power supply DPS Channel Voltage Range Precision Measurement Unit PMU Channels PMU Voltage range PMU Current range Model No CX 50/100MHz 256 pins (64 pins/board) 16M/32M (max.) per pin C, C++, Window XP 32 DUT All-in-One 3650-CX Chroma 3650-CX (TTL & G P I B ) SEIKO-EPSON SHIBASOKU MULTI-TEST ASECO DAYMARC TEL TSK OPUS II 6 edges (2 Driver, 2 Driver & I/O, 2 Strobe) 32 sets 62.5ps 16 channels / 256 pins 8V, 16V 2 Channels / 64 pins ±2.5V / 8V / 16V Per-Pin PMU PPMU Channel 1 channel / 1 Pin PPMU Voltage range -2V~ + 7V PPMU Current force range ±35mA PE VIL/VIH Range -2V~+6V / -1.9V~+7V VOL/VOH Range -2V ~ +7V Comparator Functions Edge and Window Strobe Programmable Load IOL/IOH Range 0 ~ ±35 ma VREF Range -2V ~ +7V Optional ADDA 4 channels / 256 pins ALPG X=16, Y=16, D=16 Scan Max. 1024M depth / Scan Chain VI Analog Test Option ±50V, ±50mA PVI Analog Test Option ±100V, ±2A System and Dimensions Power Consumption 3.5KW Max. Cooling System Forced Air Cooling Frame Size L 643 x W369 x H 760 mm Weight 130 Kg ±800nA/ 8uA/ 80uA/ 800uA/ 8mA/ 80mA/ 250mA CX LEDPXI SoC

38 SoC 3650 Model No. CRISP () Windows XPChroma 3650 CRISP(Chroma Integrated Software Platform) : CRISP : Shmoo plot Waveform tool Scope tool Pin Margin Pattern Editor Plan Debugger / ; Histogram tool Chroma Chroma SoC SoC Test System Model /100 MHz 50/100MHz 512 I/O (I/O Channel) 16M (32M Max.) Pattern (Pattern Memory) Per-Pin 32 DUTS ADC/DAC (Algorithmic Pattern Generator) BIST/DFT (Scan Chain) Windows XP MS C/C++ pattern Fail pin/address /pattern(j750, SC312) : Shmoo plot, Waveform display, Wafer Map, Pin Margin, Scope tool, Histogram tool VLSI OCI (Operator Control Interface) Chroma 3650 Production Setup Tool OCI System Control Test Program Debugger Chroma Chroma 3650 LPC 64 Pin Function (PINF) IC PINF IC 4 50ps Chroma 3650AD/DA ALPG PE 64 channel Digital Pin Card IC Chroma 3650 : Chroma 3650 (TTL& GPIB ) S E I K O - E P S O N S H I B A S O K U M U LT I - T E S T A S E C O DAYMARC TEL TSK OPUS II Scope Tool CP Docking Solution for other Tester Platform Channel Debugger 6-9

39 / Model 3650 Data Rate 100MHz / 200MHz (MUX mode) Pattern Memory Size 16 / 32M Overall Timing Accuracy 550ps Parallel Testing Capability 32 DUTs Software /Programming Language / OS CRISP/ C++ / Windows XP Pin Electronics Board LPC IO Channels 64-pin / Board X 8 Boards / System Vector Depth 16 / 32M per pin Drive VIL / VIH -2 ~ +6V / -1.9 ~ +7V Maximum Driver Current 50mA (static) / 100mA (dynamic) Comparator VOL / VOH -2 ~ +7V Compare Modes Edge, Window EPA (Drive / IO / Compare) 300ps / 300ps / 300ps Dynamic Load Current 35mA Timing Generator 32 sets per pin Timing Edges 6 (2 Drive, 2 Drive & IO, 2 Compare) Rate / Edge Resolution 125 / 62.5ps EPA (Drive / IO / Compare) 300ps / 300ps / 300ps Waveform Generator 32 sets per pin Waveform Format 4096 Timing-Waveform Combination Changes on-the-fly Utility Pin Relay Control 64 (8 / Board) PPMU per pin Frequency Measurement Unit (OSC) per pin DUT Power Supply DPS Channels 16-CH / Board X 2 Boards / System Voltage Range 8V, 16V Maximum Output Current 0.8A / 1-CH Current Gang Channels 8 Precision Measurement Unit PMU Channels 2-CH / Board X 8 Boards / System Voltage Range 2.5V, 8V, 16V Current Range 800nA ~ 250mA Options ADDA Channels 8-CH / 512 pins ( 1 ADDA Channel / LPC) AWG / Digitizer per ADDA Channel 1-CH / 1-CH Resolution / Max. Conversion Rate 16-bit / 500KHz Voltage Range 2.5V / 4.5V / 9V Algorithm Pattern Generator (ALPG) X = 16, Y = 16 / D = 16 Scan 1 / 2 / 4 / 8 / 16 / 32 scan chains / LPC maximum 1024 / 2048M scan depth VI-50 Channels 8 ~ 32-CH / Board Voltage / Current Range 50V / 50mA Current Ganged Channels 2 / 4 / 8 TMU per channel PVI Channels 2 ~ 8-CH / Board Voltage / Current Range 100V / 2A Current Ganged Channels 2 TMU System and Dimension Power Consumption Test Head Dimension (L x W x H) Mainframe Dimension (L x W x H) per channel 5.5KW / forced air cooling 800 X 744 X 612 mm 850 X 850 X 1680 mm Model No LEDPXI SoC 6-10

40 36010 Model No. Programmable Pin Electronics Module Model PXI 3U Date rate 100MHz 8 per-pin, per-cycle I/O 64 pin 32M sequence command 17pattern sequence Per-pin 32M vector 32 clock waveform Waveforms tri-level driver, 610uV Per-channel PMU Per-channel scan pattern Windows 2000/XP LabView LabWindows CRISP Model Test Rate 50/100MHz Channels Per Board 8 (Scalable to 64 channels) Vector Depth 32M Sequence Control Memory 32M Number of Sequence Control Command 17 Parallel test capability 8 Timing Generator Per Pin No. of Edges 6 edges / pin (2 Driver, 2 Driver & I/O, 2 Strobe) No. of Timing Sets 32 sets / pin Rate / Edge Setting Resolution 125ps / 62.5ps Rate Setting Range 20nS 1mS Waveform Generator Per Pin No. of Waveform Sets 32 sets / pin Driver VIL/VIH Range -1.5V~+5.9V / -1.4V~+6V VIL/VIH Accuracy 10mV Output Current (Static/Dynamic) 50mV/ 100mA Output Impedance 50 5 Comparator VOL/VOH Range -2V ~ +7V VOL/VOH Accuracy 15mV MHz / IC Sequence Pattern Generator8 I/O per-pin, 32M vector memory 32 clock 32 waveform 1 PMU channe ATE Sequence Pattern Generator sequence jump match loop repeat pattern M sequence command vector sequence command pattern, Sequence Pattern Generator 8 Logic Pin Electronics Cards, 64 I/O channels 8 DUT Chroma PINF ICs timing waveform output Per-pin timing generator 32 clock 6 edges per-pin waveform generatori/o 32 waveform analog tri-level driver comparator610uv active load per-pin PMU scan pattern Programmable Load IOL/IOH Range 12mA VREF Setting Range -1.5V ~ +6V High Voltage Driver HV Channel 1 HV channels / board VIL/VIH Range 0V~+14.78V / 0.22V~+15V VIL/VIH DC Current 60mA Scan Chain Chain number / LPC 1/2/4 Size per chain 256M/128M/64M PPMU Channel Number 1 channel / 1 pin Voltage Force Range -1.5V ~ +6V Current Measured Range 32mA / 2mA / 200µA / 20µA/2µA Current Forced Range 32mA / 2mA / 200µA / 20µA/2µA Voltage Measured Range -1.5V ~ +6V Power and Dimensions Power Consumption 25W per Slot Size PXI 3U Standard Board (Extendable) Cooling System Standard PXI Chassis Fan (Forced Air Cooling) CRISP (Chroma Integrated Software Platform) LabView LabWindows, Chroma C R I S P I C d e b u g g i n gc R I S P CRISPMicrosoft Windows XP C++ Project IDE tool test program debugging CRISP debugging Plan Debugger Datalog Waveform Scope SHMOO Pin Margin Wafer Map Summary Histogram STDF Test Condition Monitor Pattern Editor Logic and mixed signal validation and test Digital pattern generator and vector capture Consumer IC and electronics test Logic test subsystem for DC and RF ATE : A : Sequence Pattern A : A : 250W/48V CRISP 6-11

41 LED/ Four-quadrant DUT Power Supply Model PXI 3U 4 +5V/-2V +10V/-2V force ranges 16-bit 18-bit 5uA ~ 250mA 6 clamp Ganged PXI Windows 2000/XP LabView LabWindows CRISP DUT power supply 3U PXI module, channel., +5V/-2V +10V/-2V, 16-bit , 5 A, 25 A, 250 A, 2.5mA, 25mA and 250mA, 18 bit, V supply rails 36020, IC channel +5V/-2V 113 V, +10V/-2V 189 V., channel 47.6pA, 5 A. power supply Model No. Model Input PXI Internal Power Channel Number 4 Voltage Source Range VR1: +10v/-2v VR2: +5v/-2v Resolution 16bits Accuracy 0.1%+4.64mV Noise 3mVrms Current Measurement Range 5µA, 25µA, 250µA, 2.5mA, 25mA, 250mA Resolution 18bits 250mA 0.2%+200µA 25mA 0.15%+20µA Accuracy 2.5mA 0.15%+2µA 250 A 0.15%+200nA+1nA/V 25 A 0.15%+150nA+1nA/V 5 A range 0.15%+50nA+1nA/V Slew Rate 5v/25µs Load Regulation 2mV Load Transient Time Response 100µs Voltage Response 50mv Overshoot/Undershoot <3% Clamp Flag Response 100µs Clamp Resolution 10bits Protection Function / Alarm Flag Short current limit Clamp alarm flag Max Stable Load Capacitance 100µF : CRISP CRISP (Chroma Integrated Software Platform) LabView and LabWindows environments, Chroma front panel tool front panel tool36020, CRISP, CRISPMicrosoft Windows XP, C++ test program language, CRISP,, GUI, CRISP 36020, Datalog, SHMOO, Summary, Histogram, STDF and Test Condition Monitor. Logic and mixed signal validation and test Consumer IC and electronics test DUT Power Supply PXI 6-12

42 3240 Model No. Chroma 3240 PCB level 3240 QFP TQFPBGA PGA CSP JEDEC IC Tray 90IC IC Chroma 3240 (ATC) Automatic System Function Tester Model 3240 Pick&Place QFP (ECD) () IC Model 3240 Dimensions : 1640 mm (W) by 1190mm (D) by 1774 mm (H) "Excluding Signal Tower" Dimensions and Weight Net Weight : 800kg Power Supply : AC 220V, 50/60 Hz Single-phase Maximum Power Consumption : 3.0 KVA Max Power Requirement Controller Circuit : 3.0 KVA Max. Heater Circuit : 1.0 KVAMax. Compressed Air Dry Air of 5.0 kg/cm 2 ( 0.49 Mpa ) or over constant supply Built-Diaphragm Vacuum Pump : Pumping Volume 100 L/min Vacuum Source Ultimate Pressure : 100 Torr Max. Package Type : BGA series, GA, PGA, QFP series, CSP, BCC, QFN, Flip-Chip, TSOP Dimensions : 7 mm x 7 mm to 40 mm x 40 mm Applicable Device Depth : 0.9mm to 5mm Lead / Ball pitch : 0.4mm / 0.5mm and above Weight : 0.2g to 20g Parallel Testing Layout 4 sites (Pitch 400 mm) Index Time 2.1 sec (Excluding test communication time) / One site cycle time : 3.2 Sec. Jam Rate 1/3000 pcs Type : Input / Empty Tray : 130 mm ~ 143 mm (D) by 310 mm ~ 330 mm (W) Output Tray : 135 mm ~ 150 mm (D) by 290 mm ~ 330 mm (W) Applicable Tray Capacity : Input / Empty Tray : Elevator with 210 mm stroke (JEDEC) Output Tray 1, 2, 3 : Elevator with 210 mm stroke (JEDEC) Categories 3 Categories (Max. 128 bin signals with RS-232) Test Site Pitch : 400mm Contact Area Test Module Dimensions : 400 mm x 400 mm Contact Force Max. 50 kgf ( Accuracy 1kgf ) Operating Mode : Room Temperature / High Temperature High Temperature (Optional) Temperature Range : Ambient to 125 C (Heat-up time : Within 30 min) Accuracy : Pre-heater Buffer 5 C, Contact Area 3 C Tester Interface Standard : TTL, Optional : RS-232, GPIB Tray map fit for producion analysis Universal kit design Change over time within 15 min. ECD function (Easy -edit Communication Define) for various equipment Two Tray (Color tray) mode available Special Function Continue Fail Alarm Auto Z function Yield Control (Average yield of socket) Yield Monitor (Per contact head plug) ATC (Auto Temperature Cooling) High Temperature Function Test Site Floating Function Option Ion Fan Function 6-13

43 / Automatic System Function Tester Model 3260 Pick&Place QFP (ECD) IC , , & Chroma 3260 PCB level 3260 QFP TQFPBGA PGA CSP JEDEC IC Tray Chroma 3260 (ATC) Model No. Model 3260 Dimensions : 2570 mm (W) by 1360mm (D) by 1780 mm (H) "Excluding Signal Tower" Dimensions and Weight Net Weight : 1300kg Power Supply : AC 220V, 50/60 Hz Single-phase Maximum Power Consumption : 6.0KVA Max Power Requirement Controller Circuit : 3.0 KVA Max. Heater Circuit : 3.0 KVA (Option) Compressed Air Dry Air of 5.0 kg/cm 2 ( 0.49 Mpa ) or higher, constant supply Build-in diaphragm Vacuum Pump : Pumping Volume : 100 L/min Vacuum Source Ultimate Pressure : 100 Torr (-13.3Kpa) Max. Type : BGA series, BGA, PGA, QFP series, CSP, BCC, QFN, Flip-Chip, TSOP Outer dimensions : 7 mm x 7 mm to 45 mm x 45 mm Applicable Device Depth : 0.9 mm to 5 mm Lead / Ball pitch : 0.4 mm / 0.5 mm and above Weight : 0.2g to 20g Multiple testing Layout 6 sites (Pitch 400 mm) Index Time 3.0 sec (excluding test communication time )/ One site cycle time: 3.5 Sec Jam Rate 1/3000 pcs Type : Input / Empty tray : 130 mm ~ 143 mm (D) by 310 mm ~ 330 mm (W) Output tray : 135 mm ~ 150 mm (D) by 290 mm ~ 330 mm (W) Applicable Tray Capacity : Input / Empty tray : Elevator with 210 mm stroke (JEDEC) Output tray 1, 2, 3, 4 : Elevator with 210 mm stroke (JEDEC) Categories 4 Categories (128 bin signals for RS-232) Contact Force Max. 50 kgf ( Accuracy 1kgf ) Operating Mode : Room Temperature / High Temperature High Temperature (Optional) Temperature Range : Ambient to 125 C (Heat-up time : Within 30 min) Accuracy : Pre-heater Buffer 5 C, Contact Area 3 C Operating Mode : Room Temperature / Cold Temperature Cold Temperature (Optional) Temperature Range : Room Temperature ~ -40 C Accuracy : Contact Area 3 C Tester Interface Standard RS-232, Optional GPIB,USB and TTL Universal kit design ECD function (Easy-edit communication define) Two tray (Color tray) mode available Continuous fail retest function Advantage Real pick and place system Yield control (Average yield of socket) Yield monitor (Per contact head plug) System Invention Patent No. : Process Invention Patent No. : CCD camera for device orientation detection ATC high temperature system function Option Socket sensor RF Shielding Box: 65db for PCIe, 80db for PCI/USB/RS-232 Rotation (90 degree) 3260 LEDPXI 6-14

44 IC 3270 Model No. Chroma 3270 IC CMOS (CIS : CMOS Image Sensor) Chroma 3270 QFP TQFPBGA PGA CSP Chroma 3270 Pick & Place JEDEC IC Tray Chroma C~125 C IC Miniature IC Handler Model 3270 CMOS Pick&Place 3x3 mm IC IC Model 3270 Dimensions and Weight Dimensions : 2100 mm(w) x 1540 mm(d) x 1720 mm(h) Net Weight : 1300 kg Power supply : AC220V 10%, 50/60 Hz 3-Phase Facility Requirement Maximum power consumption : 12KVA, 20A Compressed Air : Dry air of 5.0 kg/cm 2 (0.49 Mpa) or higher, constant supply Type : BGA series, µbga, PGA, QFP series, CSP, WCSP, PLCC, QFN, TSOP Applicable Device Outer dimensions : 3 mm x 3 mm to 14 mm x 14 mm Lead / Ball pitch : 0.4 mm / 0.5 mm above Multiple Test Sites 16 or 32 sites Index Time 5 sec (Exclude power and communication time) Cycle Time One site cycle time 6 sec (4 site simultaneously, tray pitch fixed) Jam Rate 1/2000 pcs Applicable Tray Standard tray size : JEDEC mm(w) x 315 mm(l) Tray thickness : 7.62 mm Categories 5 Categories, 1 Auto, 4 Fixed (accepts 128 bin signals for RS-232) Contact Force Max. 20 kgf (Accuracy force 1kgf) Operating mode : room temperature / high temperature High Temperature (Optional) Temperature setting range : Ambient to 125 C (Heating time : within 30 min.) Accuracy : Pre-heater buffer 5 C, contact area 3 C Tester Interface Standard : RS

45 /SD Card xsd Card Tester and Handler Model 3280 SD 120 micro SD Test-In-Tray UPH = 5400 ( 70) SD DC Microsoft Windows XP OS Tray Map : 164cm x 79cm x 180cm 3rd Party Mini SD, SD MMC SD Chroma 3280 SD Test-In-Tray SD (SD Protocol Aware) DC 3280SD, SD SDSD Known Good Die(KGD) KGD SD Chroma 3280 KGD SD Chroma 3280SD Test-In-Tray : IC Chroma 3280,120 SD 10 : Chroma 3280SD (Test Hive) 120 micro SD Test-in-Tray SD : 3280 (Test-In-Tray)SD3280 SD 98% 2 3 SD : Firecracker II Firecracker II 3280(Test Hive) 3280 Firecracker II 3280 Firecracker IImicro SD, mini SD, SD MMCUSB USB Firecracker II SD Protocol Aware Tests Check CID Reg Check CSD Reg Check OCR Reg Check SCR Reg Check SD Status Functional Test DC Measurements Open/Shorts ESD Diodes Power Up Idd Leakage UPH Model No. Model 3280 System Basic Specification Tester Change Kit Facility Requirement Applicable Package Applicable Tray Dimensions and Weight Limit Index Time and Throughput Pick & Place Arm Device Contact method Test Interface Loader and Un-loader Capacity System Jam Rate Kit conversion time SD Cards Handler & Tester Temperature Control Range: Ambient Tray Input: 1 Auto Stack. Output Tray: 1 Auto Stack Test hive interfaced with Tester Tester integrated into Handler One Pick & Place arm, one buffer tray and one reject tray Chroma TnT Production Test Tool Skymedi Production Test Tool By Customer Request: Phison, Silicon Motion & InCOMM One micro SD change kit per handler SD, Mini SD and MMC (optional) Power Source: 220VAC 10%, 50/60 Hz, single phase, less than 4KW Compressed Air: 0.5MPa micro SD mini SD, SD and MMC (Optional) Standard tray size: JEDEC 135.9mm(W)x 315mm(L) Applicable tray thickness: 7.62mm 1640 mm (W) x 790 mm(d) x 1800 mm(h); WEIGHT: 650KG Max. UPH = 42,000, when test time is 0 UPH = 5400, when test time is 70 sec with DUTs better than 97% yield X Arm Max. Speed: 2.9 M.P.S. Y Arm Max. Speed: 3.75 M.P.S. Regular Sorting Speed: 6 sec per failed DUT Sorting concurrently occurs with testing 960 Pogo Pins each insertion 7.1 Newton per DUT 8 Pogo pins per DUT Current Motor Max. Force: 320KG F RS-232 USB Ethernet optional Input Tray Stacker: 1 Automatic with 30 JEDEC Trays Output Tray Stacker: 1 Automatic with 30 JEDEC Trays Less than 1/5000 devices Less than 5 min. for SD products Change Kit Setting File is saved in handler. Any necessary software and hardware adjust within 1 minute Card 3280 LEDPXI SD 6-16

46 3813 Model No. Chroma (/) (GUI). X-Y Z CAD 6 Touch Panel Multi-sites Test Handler Model 3813 : 6 inch x 3 sites or 12.1 inch x 1 sites 6 : 15g~1000g : 3g X auto cad dxf () Model 3813 Dimensions: Dimensions & Weight (W x L x H) 1200 x1600 x1400 mm(h) (total height include warning light 1800mm) Weight : 600Kg Power : AC single phase 220V1Ø/60HZ, 16A ; Max 3.6KW Facility Compressed Air : 0.3MPa Vacuum Source : -70KPa Panel Thickness : 0.1 mm ~ 2.0 mm Multiple Site Test Panel : 6 inch x 3 sites or 12.1 inch x 1 sites Max. Working Stage Dim. For 1 set : X:480mm Y:360mm Panel Loading Manual Contact force 15g~1000g : 3g Transfer accuracy 0.2 % (Within 50mm) Temperature Operating Mode : AMB Isolation impedance(dc 25V; 1~20M ) Accuracy : 1% End point impedance (100~5k ) Accuracy : 1% 1 Loop impedance (0~100) Accuracy : 2% Testing speed 250mm/sec Panel fix type and accuracy Type : Vacuum Accuracy : +/-0.5mm 6-17