穨[唯讀]

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菁通
4 years ago
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1 PDP : /PDP :

2 CRT ( ) HDTV ( ) PC monitorvga XGA UXGA monitor TV Note-PC ( ) I T :

3 Stadium, Theater, etc SNG Satellite Mobil Stock, Exchange Contents Provider Weather : NHK Service Provider Video Server Terrestrial CATV Broadcast Services Multi-channel HDTV Multimedia Home Home server

4 Menu Screen HDTV main channel Weather TV newspaper headlines Favorite channels Programs in home server Audio services Program table

5 : NHK Data Broadcasting ~ from watch TV to using TV~

6 PDP

7 PDP NEC Pioneer

8 Pioneer

9 FHP PDP : 12th FPD manufacturing Technology Expo & Conference 2002 July ( )

10 PDP 1996 ~ ~ ~ TV 30~55 25~ ~ 300 cd/m ~ 500 cd/m ~ 400W(42) 200 ~ 300W(42) 1.5 ~ 3 / 1 ~ 1.5 / 20~ ~ 700 cd/m W(42) 0.5 ~ 1 / Batch/In-line line

11 PDP Pioneer Fujitsu Hitachi Sony NEC Panasonic F H P Philips Photonics Thomson Plasmaco Toray SDI LG Orion UPD

12 Optical Filter Power supply PDP PDP Vedio IC Driver IC Logic IC FPC DSP ACF ( +FHP)~ ( ) 90% 85% 95% Optical filter 100%

13 UV

14 : PDP? Plasma Display Panelalso called Gas Discharge Display : : ( 21~60) ( <10 ) ( >160 o )

15 PDP 特點 PDP PDP CRT 大畫面/平面化畫面均勻不受磁場影響重量輕視角廣體積小厚度薄應用範圍廣

16 PDP DC Hybrid AC Fresh Memory : 1. AC- 2. NHK 42DCHDTVPDP

17 42DCPDP cell cell Priming Rib

18 ACPDP Front glass substrate Black stripe Dielectric layer ITO electrode MgO layer Phos. Red Phos. Green Phos. Blue Address electrode Bus electrode Barrier Rib Rear glass substrate

19 MgO : 90 0 data

20 Hybrid DC/AC Hybrid AC/DC Hybrid

21 AC PDP 1964 ACPDP 1990 ACPDPADS ACPDP ACPDP VGAACPDP(26 ) 1967 AC PDP 1994 PDP 1968 Owens-Illinois ACPDP x PDP General 1972 Owens-Illinois SXGA PDP ACPDP Pioneer x PDP ACPDP : [ALIS] 1972 PDP ACHDTV PDP LG 6016 : 9 XGA type ACPDP 1976 ACPDP 1999 Digital 41 ACVGA PDP 60AC PDP( ) LG LTCC-M PDP ACPDP PDP ACPDP 2002/1 Pioneer T Waffle Rib 3000:142 AC-PDP NEC CCFBS ACPDP 2001 FHP TERES 20 ACPDP Pioneer 1.8lm/W PDP 2002 Fine Plasma Tube Array AC-PDP 20 ACPDP

22 PDP ( ) ( ) PDP

23 PDP address Black strip / /

24 PDP Expansion (x10-7 / 0 C) Strain point ( 0 C) Soda-lime glass 87(50~350 0 C) 85(50~300 0 C) Asahi PD Central CP600 Corning Cs NEG PP Annealing point ( 0 C) Softening point ( 0 C) Density ( gm/cc) Resisitivity (log 10 Ω cm) 6.65 (250 0 C) 8.5 (150 0 C)

25 ITO SnO ITO SnO

26 () : - ITO or SnO 2 (thin film process) - ( ) (>90%) Bus : - Cr/Cu/Cr or Cr/Al/Cr (thin film process) or Ag (thick film process) - : 50~ 100µm Black strip & color filter (optional) - inorganic material (thick film process)

27 () Dielectric Layer : >85% : 5kV :20~30µm, : ±2µm Protective Layer, MgO, refractive index: 1.65~ (111)preferred orientation (~100%), : 0.5~1 µm

28 ITO (1) (4) ITO (120 o C) (2) (90 o C) (5) (3) (6) * pattern

29 SnO 2 (1) (4) CVD SnO 2 (2) (5) (3) pattern *

30 PDP ITO Cr/Cu/Cr, Cr,Al PR NaOH(0.5%) 2~3 min NaOH(0.5%) 2~3 min DFR NaCO 3 ( 0.5~1.5%) 2~3 min NaCO 3 ( 0.5~1.5%) 2~3 min FeCl 3 + HCl + H 2 O 3 NaOH (3~5%) or NaCO 3 (3~5%) 2~3 min Cr Cu AlCl 2 6 H 2 O + ZnCl 2 + H 3 PO 4 FeCl 3 HCl 2~3 min NaOH (3~5%) NaCO 3 (3~5%) 1~2 min 10~20S 2~3 min : pp.171

31 3-Layer Etching Process ITO Cr Cu Cr (1)Cr/Cu/Cr (2) (6) Cu (3) (7) Cr (4) (5) Cr (8)

32 Ag( ) Ag

33 Fodel Ag Ag Tape and Fodel Composite Ag Ag Type Base film (25~75µm) Ag layer (12~16µm) Black color layer ( 5µm) cover layer (25µm) Fodel Ag Tape Fodel Composite Ag Tape

34 ULVC Size Tact ECH-135 Max nm ±10 % 200 o C 2(288hrs) 7 hrs ECH-105 Max. 42

35 Chugai Ro SUPLaDUO In-Line Type

36 MgO Sample A (111) (❹) Sample B (220) Sample C (200)

37 PDP Item Barrier Layer Transparent Electrode Bus Electrode Black Strip Transparent Dielectric Color Filter Protection Film Material Substrate SiO 2 ITO SnO 2 Cr/Cu/Cr Ag Low Tm Glass Pigment Low Tm Glass SiO 2 Glass Type Pigment Type MgO Process Annealing Sputtering Sputtering & Photo-etching CVD & Lift-off Screen Printing Sputtering & Photo-etching Screen Printing Photo-sensitive paste Photo-sensitive paste Screen Printing Screen Printing Sputtering Screen Printing Photo-sensitive paste E-beam Evaporation Sputtering, Ion Plating

38 Address : - Bus Reflective dielectric layer - white glass paste (thick film process) Barrier rib - : 50~ 100µm : 120~ 150µm - : : Phosphors - : 20~ 30 µm

39 (1) (5) (G,B,R) (2)

40 ( data electrode) <600 Rib 120 µm (~80 µm)

41 RGB phosphor <500 (glass sealing) <450

42 (Screen printing method) (Additive method) (Lift off method) (Sandblast method) (Press method) (Photo-paste method) (Etching method) B-D(Blade-Deforming method) (Photo Casting method)

43 (Sandblast)

46 Printing : PDP 20008

47 Barrier Ribs Strip-structured Barrier Ribs Waffle-structured Barrier Ribs Meander Barrier Ribs Mass products Waffle Ribs

51 (PDPR) 1. Screen Printing 3. Develop 2. Exposure 4. Sintering

52 PDP Data

53 Tube ( )

54 Tube B-B ( ) Tube

55 Tube Tube Tube

56 PDP ( ) pattern Data data MgO cell : : UV sputter : PDP Technology Roadmap 20003

57 NEC Analog Interface diagram : NEC RGB Analog Interface A/D γ Y/C decoder PDP PLL RGB Logic Vol. 53 No.10/2000 PLE

58 Driver Data Driver NEC 50PDP Frame memory RGB Memory pulse Driver Logic Module (DC/AC) : NEC Vol. 53 No.10/2000 Driver Data Driver x480 pulse

59 60 % 20 % 80 % PDP 4 % 0.4 % ( ) 1.1lm/w : media vol.53, No. 8, pp 1067 (1999) 65 % 98 % 45 % 95% 27 % 76lm/w

60 PDP Cell, ( ) (NEC:CCF ), Blackstripe, filter Subfield ( subfield, 2 subfield ) (NEC:CCF ), cell

61 FHP ALIS Data ( ) :

63 NEC : AC-PDP

64 TV ---PDP ( ) ( ) ( ) ( ) (TV & PC )

ESR OH COOH Tg 1. 2. 3. CF 4 C 2 F 6 H F 1. OH COOH CO NH 2 2. 3. TiO 2 /Ti

98-04-11 87 3 21 25 Plasma 10 Torr ESR OH COOH Tg 1. 2. 3. CF 4 C 2 F 6 H F 1. OH COOH CO NH 2 2. 3. TiO 2 /Ti 16.5% ( : / :(02)2341-7251 2422) 8 ( ) " xxxx " " chamber chamber slit valve ------------------------------------------------------

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穨[唯讀]