PCB設計規範.doc

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暮暇邓
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2 1. PCB (Definition) 2. PCB 3. COB LAYOUT ( CHIP ON BOARD ) 4. PCB 5. PCBA 6. PCBA 7. LAYOUT PAGE: 2

3 1. PCB (Definition) PAGE: 3 P.C.B., P.C.B.( Poly Choloro Benzene) P.W.B.(Printed Wiring Board)P.C.Board.(Printed Circuits Board). : 1. Artwork : 2. Base material : 3. Substrate : 4. Laminate 5. Blistering : 6. Board thickness : 7. Bow ( War page) 8. Bridge : 9. Flexible printed wiring board : 10. Chamfer : ( ) 11. Etching : 12. Legend : 13. Post flux : 14. Punching : 15. Land : ( Pad ) 16. NEMA Standards : ( ) 17. PTH : Plated-through hole 18. NPTH : Non Plated-through hole ( : ) 19. Hole Plugging : 20. Buried PTH 21. Buried Microvia

4 2. PCB : PAGE: 4

5 PAGE: 5

6 (C). PCB : PAGE: 6

7 3. COB PCBA ( CHIP ON BOARD ) 3.1. IQC PCB IC (Bounding) QA A suggestion about the PCB design requirement of COB product 1. Owing to the restriction of Bonding Equipment and it's tool, but in order to improve the efficiency of the production, 2. Ensure the quality of product, and reduce the capital of the production in the process of COB fabrication, 3. We have a suggestion about the PCB design requirement of COB product as follows: (a). Requirement about PCB size and PCB connection way ( see attached picture A ) Item Size Equipment Influence factor Requirement about PCB size MAX.= 180*135MM US-1800A The Max working width for US-1800A fixture is 135MM The distance between IC position and PCB edge MAX.= 125MM US-1800A The Max. rotation radius is 125MM PCB connection way The IC position is close to PCB as best one can US-1800A In order to reduce centrifugal force when PCB is rotating. PAGE: 7

8 (b). Requirement for the Bonding Golden Finger ( see attached picture B ) Item Size Influence factor PCB Bonding golden finger's Size PCB Bonding golden finger's Size The PCB Bonding golden finger's width : MIN.=0.15MM The PCB Bonding golden finger's length : MIN.=0.5MM The diameter of Bonding aluminum line is equal to 1.25mil (32um) Solderable area of steel mouth ( L) is as blow: length is equal to 0.381MM width is equal to 0.102MM ( see attached picture C) PCB Bonding golden finger's pitch MIN.=0.15MM When the Bonding lines of IC are more than 60 lines PCB Bonding golden finger's position The distance requirement between the PAD of the PCB Bonding golden finger and the correspondingly PAD of the IC The PAD position of the PCB Bonding golden finger is close to the correspondingly PAD position of the IC as best one can and they should be in the same direction. 1.5 MM< the distance < 3MM DIE distance > 0.8MM In order to prevent short circuit phenomenon When the Bonding lines of IC are more than 60 lines PAGE: 8

(c). The requirement for the black glob 1. The black glob's size should follow the IC's size and Bonding lines's area, we do the smallest glob's size as best one can. 2.

9 (c). The requirement for the black glob 1. The black glob's size should follow the IC's size and Bonding lines's area, we do the smallest glob's size as best one can. 2. There is a minimum safety distance between SMT component and the circle edge of the black glob as below. ( PLS see Picture D and Picture E) The height h of SMT component A minimum safety distance Influence factor h<0.9mm 1.5mm In order to prevent the black glue from flowing to SMT component 0.9mm< h < 2.7mm 2.0mm In order to prevent the SMT component from touching the US-1800A fixture PAGE: 9

10 3. In order to prevent the black glue from flowing to form irregular shape add a circle of white paint, thickness is about 0.05~0.1mm. (d). The requirement for testing 1. In order to fix PCB easily when testing, design the diagonal fixed position hole PAGE: 10

11 on the PCB 2. Every golden finger on the PCB should has a correspondingly test point. (e). The requirement for the fixed position of PAD bonding In order to fix position easily when PAD bonding, it is necessary for us to add a mark ( cross or circle ) on the PCB as below : PAGE: 11

12 4. PCB : 4.1 PCB 1. FR-1 P.P.(Paper Phenol Copper Clad Laminates ) (a). Flammability 94HB or 94V-0 (b). Copper Foil 1/2 OZ ( 18m), 1 OZ (35m ), 2 OZ ( 70m ) 1 OZ = mm / mm 2 OZ =0.070 mm / mm KYE 1 OZ ( 1 OZ = 35 um micro-meter ) (c). Material Thickness (mm.) 0.8, 1.0, 1.2, 1.6, 2.0, 2.4 (d). Size (mm.) Width X Length 1020 X 1220 ( +20/-0 mm.) 2. FR X 1020 ( +20/-0 mm.) 3. & Glass Epoxy CEM-3 & FR-4 (a). Flammability94V-0 (b). Copper Foil1/2 OZ ( 18m), 1 OZ (35m ), 2 OZ ( 70m ) (c). Material Thickness (mm.) 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4 (d). Size (mm.) Width X Length 36 X X 1220 ( +12/-0 mm.) 40 X X 1016 ( +12/-0 mm.) 40 X X 1220 ( +12/-0 mm.) 42 X X 1220 ( +12/-0 mm.) 4. FR-4 94V-1 94V-O FR-4 ( ) 94V V-1 FR V-0 FR PCB (mm.) ( KYE 1OZ ) ( ) 0.8 ± 0.10 ± ± 0.13 ± ± 0.14 ± ± 0.16 ± ± 0.18 ± 0.19 PAGE: 12

13 Sn Thickness 100~700 µ in 2. Solder Mask Thickness Min 0.4 mil 3. / Ni/Au Thickness 5µ in /100 ~ 120 µ in 4.4. (a). ( ) ( ) ( ) COB Bounding SMT CFC (b). ( ) PCB ( ) ( /) SMT µ 5µ µ 4.6. RUBBER(CARBON)KEY ( ) 4.7. (CARBON) (a) R (? ) W / L (b) R = 30? /? (Square Unit ) (c). R = 40 m? /? (Square Unit ) (d). 100? / (e). 100m? / ( 30 m? ) 10 mm. L = 10 mm. W = 2 mm.? = L X W = 10 X 2 mm 2. 2 mm. PAGE: 13

14 R = 20 mm 2 X 30? / mm 2 = 600? R = 20 mm 2 X 40 m? / mm 2 = 800 m? mm. 5. PCBA,,,,,,,,,,,,,,,,, (a) 1., ( ),,,,,,, 2,,, ( ),,,,,,,,,,,, ( ),, (2 ),.,,,, PAGE: 14

15 2.,, 2.1. SMT (SOIC, SOT, CHIPS, ),,,,,,,, SMT,,,, SMT 2,, ( ) PAGE: 15

16 2.2. DIP (IC,,CABLE CONNECTOR ), LAYOUT (PCB ) PAGE: 16

17 (a). DIP ( ) 2.0 mm. (b). SMT 2.3. PCBA, SMT IC (QFP,PLCC ), BGA 0.65mm. SOIC,SSOP, (Wave Flow), (Reflow) PAGE: 17

(a).qfp, PLCC (b). BGA (c). SSOP 6. PCBA : 6.

18 (a).qfp, PLCC (b). BGA (c). SSOP 6. PCBA : 6.1. PCB LAYOUT (a). DIP LAYOUT 2.54mm.( 100 mil. ) (b). ( ) (c). SMT 0.5mm. (d). 1.0mm. DIP 5.0mm. V-CUT (e). (f).layout MADE IN X X X UL MARK DATE CODESERIAL NO. 3 4mm. (g). 10mm mm. A/I 5-5 mm. 10mm. 5mm. : PAGE: 18

19 (h). 162 mm.x 121 mm. (i ).PCB Layout 10~12mil 6~8 mil PCB (j). CABLE PAD LAYOUT 6.2. FIDUCIAL MARK SMT PCB ( )( FIDUCIAL MARK ) (a). 2 ( ) FIDUCIAL MARK (b). FIDUCIAL MARK, (c). SOLDER MASK FIDUCIAL MARK PATTERN (d). FIDUCIAL MARK 4, (e). QFPPLCC IC Layout 2 FIDUCIAL MARK (f). FIDUCIAL MARK 1.0mm.,( 3.0mm. ) 6.3. ICT (a). Layout (b). 1.0mm. (c). 2.00mm. (d).pcb LAYOUT, (e).,, PAGE: 19

20 (f )., (g). SMT BOARD : PAGE: 20

21 6.4. PCB : mm. W L T Max ( ) Min SMT Max ( ) Min (c). V CUT / FR4 CEM3 PP T mm A V- PITCH B L mm mm D mm mm PAGE: 21

22 (1).PCB +/- 0.3 mm. (2 ). V-CUT 20 & 30, 7. LAYOUT : 7.1. (a). BYPASS (0.1U) IC DIP 300 mil (b). OSCCRYSTALCPUCHIP IC BUFFER (c). SWITCHING DEVICERELAY (d). (e). (f). (g). (h). ( i ). Analog Digital ( j ). (k). PCB Chasis GND through hole ( l )., 7.2 LAYOUT GUIDE PAGE: 22 A ( ) (a).ps1006x,, PS1006X (b). (c)., (d). 3mil, (e)., (f). 30mil (g).usb DP / DM (PS1006X)USB D+/D-( ) 6mil (h).usb DP / DM (PS1006X)USB D+/D-( ), 8mil (i).usb DP / DM (PS1006X)USB D+/D-( ), 6mil USB 6mil, 6mil, 20mil (j).y1 IC,, Y1

23 (k).mmcclk,sclk 8mil, 6mil CLK 6mil, 6mil, 20mil (l).cf_rd/cf_wr/cf_ce1/cf_ce2/cf_sel/cf1cd1/cf1cd2, 6mil 6mil, 6mil, 20mil (m).cfd0 CFD15, 6mil 6mil, 20mil,CF 6mil (n).sm_rd/sm_wr/smfce/sm1cd, 6mil 6mil, 6mil, 20mil,SM 6mil (o).flhd0_smd0 FLHD7_SMD7, 6mil 6mil, 6mil, 20mil (p).mmc_wp/mmc1cd/mmccmd, 6mil 6mil, 6mil, 20mil (q).mmcdata0 MMCDATA3, 6mil 6mil, 6mil, 20mil (r).mscd/dio/bs 6mil, 20mil (s).q1/q2/q3/q4 CONNECTOR (t).d1 D4 USB CONNECTOR (u).usb_v 12 mil (v). VCC 20mil (w). PAGE: 23

24 B. USB : (a). USB2.0 IC. (b). (Clock)USB2.0,, PCB Conncector. (c ).4 USB2.0 Bottom.. : 1. Signal 1 ( top ) 2. VCC 3. GND 4. Signal 2 ( bottom,usb2.0 ) (d). USB2.0 vias ( ). (e). Crystal, Oscillator, Clock synthesizer. (f).crystal, Oscillator, Clock synthesizer, vias GND Plane.,. (g).usb2.0, 150mil. (h).usb2.0 (Stubs), vias., 200mil. (i).usb2.0 VCC GND Plane, 25mil, plane, 1uf plane (stitching cap), USB. PAGE: 24

(j). VCC GND ( ) 20*h ( h VCC GND Plane trace ). (k).vbus Bypass, CM chock, ESD Connecotor. PAGE: 25 2. USB2.0 : (a). USB2.0 (impedance) 90 ohm, 3 7.

25 (j). VCC GND ( ) 20*h ( h VCC GND Plane trace ). (k).vbus Bypass, CM chock, ESD Connecotor. PAGE: USB2.0 : (a). USB2.0 (impedance) 90 ohm, 3 7.5mil, 7.5mil 4 (stack),,. 90 ohm. (b). USB2.0 20mil, (clock) 50mil 3. (c). USB2.0 IC USB2.0 ( termination resistors). IC pin, 200mil. 3.

26 USB2.0 (impedance) 90 ohm, 3 7.5mil, 7.5mil 4 (stack),. 90 ohm. 3. USB2.0 : USB inches(45.75cm), 10. d1+d2+d3 18 inches : d1 layout, 5 inches. d2 cable 12 inches. d3 layout 1 inch,. 4. PCB PAGE: 26

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Powermyworkroom 1. PCB PCB PCB PCB EMC EMI 2. PCB PCB PCB 3. via Blind via Buried via Through via Component hole Stand off 4. / TS S TS SOE0 1. PCB PCB PCB PCB EMC EMI 2. PCB PCB PCB 3. via Blind via Buried via Through via Component hole Stand off 4. / TS S0902010001 TS SOE0199001 TS SOE0199002 IEC60194 > > > > Printed Circuit