顯像型防焊油墨 Photoimageable Solder Resist Ink R-500 GA 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 GA Series ( 2 component / liquid photoimageable solder mask ) (1) 適用於網版

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划诗刁
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1 R-500 GA 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 GA Series ( 2 component / liquid photoimageable solder mask ) (2) 具有優良之密著性 (2) Excellent in adhesion. (3) 適合一般印刷電路板用而其塗膜之 (3) Suitable to general printed circuit boards and 耐熱性極優 coating film has an outstanding heat resistance. R-500 GA 系列 R-500 GN 系列黏度 ( 主劑 ) / (25 R 型黏度計 5r.p.m 值 ) 各式深淺之綠色黃色其它特殊及消光色系 green yellow and other special and mat colors 主劑 0.86 : 硬化劑 0.14 main agent 0.86 : hardener 0.14 (by weight) 72 * 90 mins. Max. 75 * 70 mins. Max. 300~600 mj / cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 1 -

2 R-500 G 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 G Series ( 2 component / liquid photoimageable solder mask ) (2) 高感度及解像性佳 (2) Have high sensitivity and resolution. (3) 具有優良之密著性及耐熱性 (3) Excellent in adhesion and heat resistance. (4) 可耐化學金 (4) Use for immersion gold. R-500 G 系列 R-500 G_B 系列主劑 0.85 : 硬化劑 0.15 main agent 0.85 : hardener 0.15 (by weight) 72 * 90 mins. Max. 75 * 70 mins. Max. 300~600 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 2 -

3 R-500 GAH 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 GAH Series ( 2 component / liquid photoimageable solder mask ) (2) 高感度及解像性佳 (2) Have high sensitivity and resolution. (3) 具有優良之密著性及耐熱性 (3) Excellent in adhesion and heat resistance. (4) 可耐化學金電鍍加工 (4) Resistance to electro gold plating. R-500 GAH 系列主劑 0.85 : 硬化劑 0.15 main agent 0.85 : hardener 0.15 (by weight) 72 * 90 mins. Max. 75 * 70 mins. Max. 300~600 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 3 -

4 R-500 GHB 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 GHB Series ( 2 component / liquid photoimageable solder mask ) (2) 具有高解像度及作業性佳 (2) High resolution and easy to operation. (3) 可耐化學金電鍍加工 (3) Resistance to electro gold plating. (4) 具有優良之耐熱性及塞孔性 (4) Excellent in heat resistance and hole-plugging ability. R-500 GHB 系列主劑 0.75 : 硬化劑 0.25 main agent 0.75 : hardener 0.25 (by weight) 72 * 90 mins. Max. 75 * 70 mins. Max. 300~600 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω * 最大預烤範圍 : 以 1% Na2CO 秒 2.0Kg/cm 2-4 -

5 R-500 GH 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 GH Series ( 2 component / liquid photoimageable solder mask ) (2) 具有高解像度及作業性佳 (2) High resolution and easy to operation. (3) 耐化學品性極優 (3) Excellent chemical resistance. (4) 可適用於 HDI 製程 (4) Suitable for HDI process. R-500 GH 系列主劑 0.75 : 硬化劑 0.25 main agent 0.75 : hardener 0.25 (by weight) 72 * 90 mins. Max. 75 * 70 mins. Max. 300~600 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 5 -

6 R-500 T3D 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 T3D Series ( 2 component / liquid photoimageable solder mask ) (2) 具有高解像度及作業性佳 (2) High resolution and easy to operation. (3) 可用於導通孔塞孔並具有優良之耐熱性 (3) Suitable for via-hole plugging due to good heat, 可抑制無鉛噴錫空泡之產生 resistance. Good in preventing pop corn around via hole after HAL(lead-free). (4) 可耐一般化學金 (4) Suitable for normal immersion gold. R-500 T3D 系列 72 * 80 mins. Max. 75 * 60 mins. Max.. 400~600 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 6 -

7 R-500 G28K 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 G28K Series ( 2 component / liquid photoimageable solder mask ) (2) 具高感光度 (2) High sensitivity. (3) 具有優良之密著性 (3) Excellent in adhesion. (4) 可耐化學金 (4) Suitable for immersion gold. R-500 G28K 系列黏度 ( 主劑 ) / (25 R 型黏度計 5r.p.m 值 ) 主劑 0.85 : 硬化劑 0.15 main agent 0.85 : hardener 0.15 (by weight) 75~80 wt% 72 * 100 mins. Max. 75 * 80 mins. Max. 200~400 mj /cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 7 -

8 R-500 Z 系列 ( 2 液型 / 液態感光防焊油墨 ) R-500 Z Series ( 2 component / liquid photoimageable solder mask ) (1) 適用於網印及噴塗 (1) For screen printing and spray coating. (2) 低鹵素之環保產品 (2) Halogen-free type of environmental product. (3) 符合 JPCA-E S 標準, (3) Comply with JPCA-E S standard. 氯 (Cl) 0.09 wt% ( 900ppm ) 溴 (Br) 0.09 wt% ( 900ppm ) 氯 (Cl)and 溴 (Br) 總含量 (Total) 0.15 wt% ( 1500ppm ) R-500 Z 系列 R-500 Z 系列 (Spray) 400~700 mj /cm 2 200~400 mj /cm 2 7H 初始值 (Initial): Ω 處理後 (Conditioned): Ω 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 8 -

9 R-500 WH 系列 (2 液型 / 液態感光防焊油墨 ) R-500 WH Series (2 component / liquid photoimageable solder mask ) (1) 油墨高解析 (1) Excellent high solution. (2) 電路板加工油墨不易龜裂 (2) Void free & Crackless. (3) 可耐 UV 及高溫製程不黃變 (3) Excellent high resistance and heat discoloration resistance. (4) 油墨具高反射率 (WHR 系列 ) (4) Excellent light-reflectance.(whr Series) R-500 WH 系列 R-500 WHR 系列白色 white WHD- 黏度 ( 主劑 ) / (25 R 型黏度計 5r.p.m 值 ) 主劑 0.85 : 硬化劑 0.15 main agent 0.85 : hardener 0.15 (by weight) 160~270 PS 75 * 60 mins. Max. 500~700 mj /cm 2 5H * 最大預烤範圍 : 以 1% Na2CO 秒 2.0Kg/cm 2 顯影 *Tack dry window : Developed by 1% Na2CO3(aq) 秒 2.0Kg/cm 2 初始值 (Initial): Ω 處理後 (Conditioned): Ω - 9 -

10 R-500 ICG 系列 (2 液型 / 液態感光防焊油墨 ) R-500 ICG Series (2 component / liquid photoimageable solder mask ) (1) 油墨不易龜裂 (1) Excellent in crack resistance. (2) 具有優良耐鍍 ( 化 ) 金性 (2) Electrolytic / Electroless gold plating resistance. (3) 具有優良的 PCT 特性 (3) Excellent in PCT. (4) 與封裝樹脂密著性佳 (4) Adhesion to molding compound. R-500 ICG 系列黏度 ( 主劑 ) / (25 R 型黏度計 5r.p.m 值 ) 綠色 green ICHD 主劑 0.75 : 硬化劑 0.25 main agent 0.75 : hardener 0.25 (by weight) 65~75 wt% 80 * 50 mins. Max. 500~700 mj /cm 2 4~5H 初始值 (Initial): Ω 處理後 (Conditioned): Ω ( R-500AA / AA ) * 最大預烤範圍 : 以 1% Na2CO 秒 2.0Kg/cm 2 顯影 *Tack dry window : Developed by 1% Na2CO3(aq) 秒 2.0Kg/cm

Wire Wound Ceramic Chip Inductor 繞線式陶瓷晶片大电流電感 HPWS Series for High Frequency HPWS 系列適用於高頻 INTRODUCTION 產品介紹 The HPWS is the chip inductors of a wire w

Wire Wound Ceramic Chip Inductor 繞線式陶瓷晶片大电流電感 HPWS Series for High Frequency HPWS 系列適用於高頻 INTRODUCTION 產品介紹 The HPWS is the chip inductors of a wire w INTRODUCTION 產品介紹 The HPWS is the chip inductors of a wire wound type widely used in the communication applications, such as cellular phones, television tuners, radios, and other electronic devices. The