中高压电容器测试方法:

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1 COGCOH HGLGPHRHSHTHUJSL COGCOH HGLGPHRHSHTHUJ SL X7RX5R Y5V Z5U X7R Y5V SUMMARY Types of Dielectric Material and Capacitor HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as Classcapacitor, including high frequency COGCOH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL The electrical properties of COGCOH capacitor are the most stable one and change invariablly with temperature, voltage and time They are suited for applications where low-losses and high-stability are required, HGLGPHRHSHTHUJSL capacitor s capacitance changes with temperaturethey are suited for applications where low-losses and temperature compensating circuits X7RX5RX7RX5R material is a kind of material has high dielectric constant The capacitor made of this kind material is considered as Class capacitor whose capacitance is higher than that of class These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc Y5VThe capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc FH

2 Z5UThe capacitor made of this kind of material is considered as Classcapacitor, whose temperature characteristic is between that of X7R and Y5V The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature STRUCTURE AND DIMENSIONS DIMENSIONS L L W T WB WB British expression Type Dimensions (mm) Metric expression L W T WB NoteWe can design according to customer special requirements FH

3 STRUCTURE T W L NO Name Ceramic dielectric Inner electrode Substrate electrode Nickel Layer Tin Layer HOW TO ORDER 0805 CG 101 J 500 N T NOTES DIMENSIONS Size Code unitinch/ mm (LW) inch (LW) mm DIELECTRIC STYLE CG CH HG LG PH RH SH TH UJ SL X B E F (Dielectric Code) COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V (Dielectric) FH

4 NOMINAL CAPACITANCE (Express Method) (Actual Value) 0R5 05 1R (unit)pf 0 R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point CAPACITANCE TOLERANCE (Code) (Tolerance) B C D F G J K M S Z 010pF 025pF 05pF 10% 20% 50% 10% 20% BCD 10pF NoteThese capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF +50% -20% +80% -20% RATED VOLTAGE (unit)v (Express Method) (Actual Value) 6R R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point TERMINAL MATERIAL STYLES Termination Styles Silver Solderable Termination Copper Solderable Termination Nickel Barrier Termination (Express Method) S C N FH

5 PACKAGE STYLES B Bulk Bag T Taping Package / Temperature Coefficient /Characteristics Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range COG 20 C 0±30 ppm/ COH 20 C 0±60 ppm/ HG 20 C -33±30 ppm/ LG 20 C -75±30 ppm/ PH 20 C -150± 60 ppm/ RH 20 C -220± 60 ppm/ SH 20 C -330± 60 ppm/ TH 20 C -470± 60 ppm/ UJ 20 C -750± 120 ppm/ SL 20 C ppm/ X7R 20 C ±15% X5R 20 C ±15% Z5U 20 C -56%+22% Y5V 20 C -80%+30% C 85 C 20 C NoteNominal temperature coefficient and allowed tolerance of class are decided by the changing of the capacitance between 20 C and 85 C Nominal temperature coefficient of class are decided by the temperature of 20 C FH

6 Capacitance Range and Operating Voltage Size Code Capacitance Rated Voltage COGNPO X7RX5R Y5V (Z5U) /unit: pf 63V ,700,000 1,0001,000,000 10V ,000,000 1,0001,000, V ,000 1,000220,000 25V ,000 1,000100,000 50V ,000 1,000100,000 63V 014, ,700,000 1,0004,700,000 10V 014, ,000,000 1,0002,200, V 014, ,000,000 1,0001,000,000 25V 014, ,000 1,0001,000,000 50V 014, ,000 1,000220,000 63V 0310, ,000,000 1,00010,000,000 10V 0310, ,700,000 1,00010,000, V 0310, ,000,000 1,0002,200,000 25V 0310, ,000,000 1,0002,200,000 50V 0310, ,000 1,0001,000,000 63V 0533, ,000,000 1,00047,000,000 10V 0533, ,000,000 1,00022,000, V 0533, ,000,000 1,00010,000,000 25V 0533, ,700,000 1,0002,200,000 50V 0512, ,000 1,0001,000,000 63V 1010, ,000,000 4,70047,000,000 10V 1010, ,000,000 4,70047,000, V 1010, ,000,000 4,70010,000,000 25V 1010, ,200,000 4,70010,000,000 50V 108, ,000,000 4,7001,500,000 FH

7 Size Code Capacitance /unit: pf Rated Voltage COGNPO X7RX5R Y5V (Z5U) 63V 1010, ,000,000 4,70033,000,000 10V 1010, ,700,000 4,70022,000, V 1010, ,200,000 4,70022,000,000 25V 1010, ,200,000 4,70010,000,000 50V 106, ,000,000 4,7002,200,000 63V 1015, ,000,000 10,00033,000,000 10V 1015, ,000,000 10,00022,000, V 1015, ,000,000 10,00022,000,000 25V 1015, ,000,000 10,00010,000,000 50V 1012, ,200,000 10,00010,00,000 63V 1047, ,000,000 10,00047,000,000 10V 1047, ,000,000 10,00033,000, V 1047, ,000,000 10,00022,000,000 25V 1047, ,700,000 10,00010,000,000 50V 1033, ,300,000 10,00010,000,000 63V 10100, ,000,000 10,00047,000,000 10V 10100, ,000,000 10,00033,000, V 10100, ,000,000 10,00022,000,000 25V 10100, ,000,000 10,00010,000,000 50V 1047, ,000,000 10,00010,000,000 NoteWe can design according to customer special requirements FH

8 Q COG Hi-Q COG MLCC : RF Hi-Q ESR CQCG Q Q 1MHz~24GHz CQ CG, Application: Hi-Q COG capacitors are ideally suited for RF and microwave application requiring high Q, low ESR, and high resonant frequency Note for CQ and CG: The following Q value is just confirmed by general customer If there is a higher requirement for Q value requirements, we can design and produce according to the special requirements For the customer whose requirements for frequency is between 1MHz and 24GHz or higher frequency, we can design it according to their requirements The frequency of CQ is a little higher than that of CG Please choose them according to your requirements CQ Q CQ Capacitance value and Q value Capacitance 300MHz Q Q value at 300MHz Capacitance 300MHz Q Q value at 300MHz Capacitance 300MHz Q Q value at 300MHz pf pf pf FH

9 HIGH VOLTAGE MLCC / Middle & high voltage MLCC is a kind of special design special technology MLCC that bases on the technology of general MLCC This kind of MLCC has stable high voltage reliability and suitable to SMT Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit APPLICATIONS Analog & Digital Modems LAN/WAN Interface Lighting Ballast Circuits Voltage Multipliers DC-DC Converters Back-lighting Inverters FH

10 Size Code Capacitance Rated Voltage NPO X7R Y5V /unit: pf 100V ,000 2,20068, V , V 051, ,000 10,000100, V 011, ,000 10,00056, V 011, ,000 10,00056, V , V V 053, ,000 15,000330, V 012, ,000 10,000150, V 012, ,000 10,000150, V 011, , V 011, , V , V 104, ,000 10,000820, V 103, ,000 10,000390, V 103, ,000 10,000390, V 102, , V , V , V 204, , ,0001,000, V 203, ,000 10,000390, V 203, ,000 10,000390, V 201, , V , V , V , V , V FH

11 /unit: pf Capacitance PF Size Code Rated Voltage NPO X7R Y5V 100V , , ,0001,500, V 305, , ,000470, V 305, , ,000470, V 303, , V 301, , V , V , V , V V 5027, ,000, ,0003,300, V 5012, ,000 22,000680, V 5012, ,000 22,000680, V 506, , V 502, , V 501, , V , V , V NoteWe can design according to customer special requirements FH

12 measurement method for high voltage MLCC Rated voltage range 100VVr500V 500VVr1000V 1000VVr2000V 2000VVr5000V Measuring Method 200%, 5, 50mA Force 200%Rated voltage for 5 second Maxcurrent should not exceed 50 ma 150%, 5, 50mA Force 150%Rated voltage for 5 second Maxcurrent should not exceed 50 ma 120%, 5, 50mA Force 120%Rated voltage for 5 seconds Maxcurrent should not exceed 50 ma 120%, 5, 10mA Force 120%Rated voltage for 5 seconds Maxcurrent should not exceed 10 ma Reliability Test Item Capacitance Technical Specification Test Method and Remarks Capacitance Measuring Frequency Measuring Voltage Should be within the Class 1000pF 1MHZ10% specified tolerance 1002Vrms 1000 pf 1KHZ10% 25 3 Test Temprature: 25 3 C10µF : 1KHZ10% : 1002Vrms Test Frequency: 1KHZ10% Test Voltage: 1002Vrms C10µF Should be within the X7RY5V : HZ Class specified tolerance :0501Vrms Test Frequency: HZ Z5U Test Voltage: 0501Vrms :101KHZ :05005Vrms Test Frequency: 101KHZ Test Voltage: 05005Vrms FH

13 Item X7R (DF, tan) Dissipation Factor Technical Specification Test Method and Remarks DF Measuring Capacitance Measuring Voltage Frequency 056% Cr5 pf 1MHZ10% Class 15[(150/Cr)+7]10-4 5pFCr50 pf 1MHZ10% 1002Vrms 015% 50pFCr1000 pf 1MHZ10% Class Y5V Z5U 015% 1000 pf 1KHZ10% 50V 25V 16V 10V 63V 25% 35% 35% 50% 25V 16V 10V 63V 70% C10µF 125% 125% 125% 90% C10µF C10 nf, Ri50000M Class (IR) Insulation Resistance C10 nf, Ri C R 500S X7R Class Y5V Z5U C25 nf, Ri10000M C25 nf, Ri C R 100S C25 nf, Ri4000M C25 nf, Ri C R 100S C10µF : 1KHZ10% 50% : 1002Vrms C33µF Test Frequency: 1KHZ10% 100% Test Voltage: 1002Vrms C33µF C10µF X7RY5V : HZ :0501Vrms Test Frequency: HZ Test Voltage: 0501Vrms Z5U: :101KHZ :05005Vrms Test Frequency: 101KHZ Test Voltage: 05005Vrms : % 25 50mA Measuring Voltage: Rated Voltage Duration: 605s Test Humidity: 75% Test Temprature: 25 Test Current: 50mA FH

14 Item (DWV) Dielectric Withstanding Voltage Technical Specification Measuring Voltage: No breakdown or damage 95% At least 95% of the terminal electrode is covered by new solder Solderability Visual Appearance: No visible damage Item C/C Resistance to Soldering Heat DF IR NPO SL NPO to SL X7R 05% 05PF Y5V Z5U 05% or -5~+10% -10~+20% 05PFwhichever is larger Same to initial value Same to initial value 95% AppearanceNo visible damageat least 95% of the terminal electrode is covered by new solder Test Method and Remarks :300% :250% 15 / 50mA ( MLCC) Class:300% Rated voltage Class:250% Rated voltage Duration: 15s Charge/ Discharge Current: 50mA max (This method excludes high-voltage MLCC) 80~120 10~30 Preheating conditions:80 to 120; 10~30s Sn/Pb63/37 : 2355 : 205s Solder Temperature: 2355Solder Temperature: 2455 Duration: 205s : 2455 : 205s Duration: 205s 100~ : 2655 : 51s Preheating conditions: 100 to 200; 102min Solder Temperature: 2655 Duration: 51s Clean the capacitor with solvent and examine it with a 10X(min) microscope Recovery Time: 242h Recovery condition: Room temperature FH

15 Item Technical Specification mm Appearance: No visible damage Resistance to Flexure of Substrate (Bending Strength) C/C 10% Al 2 O 3 PCB 1mm 05mm/sec Test Method and Remarks 20 T= Test Board: Al 2 O 3 or PCB Warp: 1mm Speed: 05mm/sec Unit: mm The measurement should be made with the board in the bending position 5N 101S Termination No visible damage Applied Force: 5N Duration: 101S Adhesion h ( NPO/X7R: -55 Y5V:-25 Z5U:+10) 30 C/C 2 (+20) 23 1% 1pF, 3 ( NPO/X7R:+125 Y5V/Z5U: +85) 30 B: 10% 4 (+20) 23 E,F: 20% Temperature Cycle Class: 1% or 1pF, whichever is larger Class: B: 10% E,F: 20% 242h Preheating conditions: up-category temperature, 1h Recovery time: 241h Initial Measurement Cycling Times: 5 times, 1 cycle, 4 steps: Step Temperature Time (min) NPO/X7R: Low- category temp ( Y5V:-25 Z5U:+10) 30 2 Normal temp (+20) 23 NPO/X7R: Up- category temp ( Y5V/Z5U: +85) 30 4 Normal temp (+20) 23 Recovery time after test: 242h FH

16 Item C/C DF Moisture Resistance IR Technical Specification : 2% 1pF, : B: 10% E,F: 30% Class: 2% or 1pF, whichever is larger Class: B: 10% E,F: 30% 2 Not more than twice of initial value Test Method and Remarks ~95%RH ( )48 ( ) Ri2500M Ri C R 25S Temperature402 Humidity90~95%RH Class: Ri2500M Ri C R Duration500h 25S whichever is smaller Ri1000M Ri C R 25S Recovery conditionsroom temperature Recovery Time24h (Class1) or 48h (Class2) Class: Ri1000M Ri C R 25S whichever is smaller Appearance: No visible damage 2% 1pF B: 20% 100V E,F: 30% C/C Class: 2% or 1pF, 15 whichever is larger 1000 Class: B: 20% 50mA E,F: 30% 2 DF Not more than twice of initial value Low-Voltage 100V Life Test Ri4000M Ri C R 40S Applied Voltage: 15 Rated Voltage Class: Ri4000M Ri C R Duration: 1000h 40S whichever is smaller Charge/ Discharge Current: 50mA max IR Ri2000M Ri C R 50S Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h Class: Ri2000M Ri C R (Class2) 50S whichever is smaller Visual Appearance: No visible damage FH

17 Item C/C DF Middle &high voltage Life Test IR Technical Specification 2% 1pF Test Method and Remarks B: 20% E,F: 30% Class: 2% or 1pF, whichever is larger Class: B: 20% E,F: 30% 2 Not more than twice of initial value Ri4000M Ri C R 40S 100VRated Voltage500V2 Multiple 40S whichever is smaller Ri2000M Ri C R 50S Charge/ Discharge Current: 50mA max 50S whichever is smaller Visual Appearance: No visible damage 2 100V 500V2 500V 1000V V mA 125 NPO X7R85 Y5V Applied Voltage: Class: Ri4000M Ri C R 500VRated Voltage1000V15 Multiple 1000V Rated Voltage12 Multiple Duration: 100h Class: Ri2000M Ri C R Temperature 125 NPO X7R 85 Y5V Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 1h 241h NotePretreatment (only for class2 capacitor) Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement First, place the capacitor in the up-category temperature or other specified higher temperature environment for 1hour Then recovery the capacitor at standard pressure conditions for 241hours FH

18 PACKAGE PAPER TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel Bottom tape 0402 Dimensions of paper taping for 0402 type W1 L1 D C B P1 P2 P0 d t Code ± ± ± ± ± ± ±010-0/+010 Below FH

19 Dimensions of paper taping for types Feeding hole J Chip pocket A E D C T Chip cap Tape running direction Code paper size Unitmm A B C D* E F G* H J T 110 ± ± ± ± ± ± ± ± ± ± ± ± * Note: The place with * means where needs exactly dimensions / / / Max 110 Max 110 Max EMBOSSED TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel FH

20 ( 0805~1812 ) Dimensions of embossed taping for 0805~1812 type Feeding hole J Chip pocket A B E D C T Chip cap H G F Tape running direction Code Tape size A B C D* E F G* H J T ± ± ± ± / Max ± ± ± ± ± / Max ± ± / Max ± ± / Max ± ± / Max * NoteThe place with * means where needs exactly dimensions FH

21 Structure of leader part and end part of the carrier paper End (Vacant position) Chip carrier Vacant position Leader part(cover) tape) 200 mm 200 mm over 200mm over 200mm 200 mm /Over 200 mm / Moving Direction Reel Dimensions (unit: mm) CODE A B C D E F G 7 REEL REEL or more or more 12max 12max FH

22 Taping specification Top tape peeling strength (a)paper Taping Cover tape 0~15 Cover tape peeling direction Carrier tape (b) Embossed Taping Cover tape peeling direction Cover tape N< <07N Standard: 01N < peeling strength < 07N Carrier tape, No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape Bulk Case Package unit:mm Symbol A B T C D E Dimension / / Symbol F W G H L I Dimension / / FH

23 Packing Quantity (SIZE) ( PACKAGE STYLE & QUANTITY) unit: pcs PT ET BC BP NoteWe can choose packing style and quantity can be according to the customer s requirement Outer packing The first package Quantity: 5 reels (Max 25000pcs) pcs The second package Quantity: 12 cases (Max pcs) pcs 65mm 185mm 200mm 197mm label 385mm 425mm PART No QUANTITY : DATE Label Production name Quantity Weight FH

24 Storage Methods 6 ( ) The guaranteed period for solderability is 6 months /Storage conditions /Temperature 5~40 (Under deliver package condition) /Relative Humidity 20~70% Precautions For Use (MLCC),,,,,,, The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case Following precautions for safety and Application Notes shall be taken in your major consideration If you have a question about the precautions for handling, please contact our engineering section or factory 1 Soldering Profile, ( ) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page) 2 Manual Soldering,,,,,, Manual soldering can pose a great risk of creating thermal cracks in capacitors The hot soldering iron tip comes into direct contact with the end terminations, and operator s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip FH

25 3 Too much solder Cracks tend to occur due to large stress Not enough solder, Weak holding force may cause bad connection between the capacitor and PCB The temperature profile for soldering Re-flow soldering Temperature () Preheating Peak Temperature S Over 1 minute Over 1 minute Gradual cooling Pb-Sn FH

26 Wave soldering Temperature () Preheating Peak Temperature 230 ~260 Over 1 minute 3s max Gradual cooling Pb-Sn Hand soldering Temperature () Preheating Peak Temperature Over 1 minute 3s max Gradual cooling W 1mm 5s 1/2 FH

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