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2 1 70 :SSI(Small Scale Integration), 1 10,MSI (Medium Scale Integration),,, 80 LSI(Large Scale Integration),, 16,Motoral M68000(7 ),Intel (12.5 ),80386 (27.5 ) 90 : VLSI(Very Large Scale Integration), 32,80486, 100 ;98 Pentium III 1000 ULSI(Ultra LSI), GLSI(Giant LSI) SOC/SOPC : Intel Prescott ( Pentium 4E), 2GHz Pentium-M

3 SOC

4 SOPC

5 (ALTERA StartixII)

6 FIFO M512 RAM FIR DSP DDR PCI PCI-X SSTL-3 SSTL- 2HSTL-1 HSTL-2 LCDS Hyper I/O IOEs M-RAM DSP M4K RAM 9-76 STRIDIX

7 Evolution of Integration Density and Minimum Feature Size, as seen in the early 1980s

8 The integration density between the memory chips and logic chips Adapted from Mlynek, Daniel J

9 Moore s s Law in Microprocessors

10 Transition to Automation and Regular Structures Intel 4004 ( 71)( Intel 8080 Intel 8085 Intel 8286 Intel 8486 Courtesy Intel Design Methods 13

11 Pentium 3 & Alpha µm,6M,CMOS 0.18,0.25,0.35µm,6M,CMOS Transistors: 28.1M 15.2M die size: 106 mm 2 210,210,314 mm 2

12 Pentium 4 Pentium 4 42M transistors / GHz / 49-55W L=0.18µm Pentium 4 Northwood 55M transistors / 2-2.5GHz L=0.13µm

14 Die Size Growth 100 Die size grows by 14% to satisfy Moore s Law Die size (mm) P6 Pentium proc ~7% growth per year ~2X growth in 10 years Year Adapted from Irwin & Nayaranan s Slides from PSU. Copyright 2002 J. Rabaey et al."

15 Evolution in DRAM Chip Capacity Kbit capacity/chip ,000 4, µm 16, µm human memory human DNA 4X growth every 3 years! book page 64, µm 256, µm 1,000,000 4,000, µm 16,000, µm µm 64,000, µm Year 0.07 µm encyclopedia 2 hrs CD audio 30 sec HDTV Adapted from Irwin & Nayaranan s Slides from PSU. Copyright 2002 J. Rabaey et al."

18 3~30GHz

19 Power will be a major problem Power (Watts) Pentium proc 18KW 5KW 1.5KW 500W Year Power delivery and dissipation will be prohibitive

23 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

24 SIA(Semiconductor Industry Association) Roadmap Year Feature size (nm) Logic trans/cm 2 6.2M 18M 39M 84M 180M 390M Cost/trans (mc) #pads/chip Clock (MHz) Chip size (mm 2 ) Wiring levels Power supply (V) High-perf pow (W)

25 1. Transistors are smaller and denser : 180nm to 35nm : 6.2 to 390 M logic Trans/cm 2 Chip areas are larger :340 to 900mm 2 Clock : 1250 to 16900Mhz power :90 to 183W Interconnects are dense :6 to 10 wiring levels

33 30~60%

35 Cache

37 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

38 2 (50~70%,0.35um)

39 2

40 2 ASIC (0.8um--1,0.5um- -5,0.35um-->10 )

41 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

42 3 EDA SOC Single Pass, Physical Synthesis Floorplanning IP SOC

43 SOC SOPC EDA SOC 4. ASIC 5. IC 6. 7.

44 4 ASIC 1985 Xillinx XC2000 PLC CLB PRR PIO 400~500MHz m 6-9 SOPC FPGA DSP MCU RAM PCI XILINX Virtex-II Pro,Altera Stratix

45 ASIC

46 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

47 5 IC (Embeded System) (, ): DSP,,RAM,ROM., (Cable Modem, 1G ): (Mpeg Decoder Encoder, STB, IA ATI R420

48 5 IC IC

49 We must,but,but

50 MOS transistor scaling (2003ITRS) Technology-node cycles the period of time in which a new technology node is reached CARR(3yrs) =0.5 Λ =-10.9% CARR(2yrs) =0.5 Λ =-15.9%

51 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

52 6 Technology shrinks by ~0.7 per generation But How to design chips with more and more functions? Design engineering population does not double every two years Adapted from Mani Srivastava s Slides. Copyright 2003

53 6 10,000,000 10,000 1,000,000 1, , , , Logic Tr./Chip Tr./Staff Month. x x x x x x x x 58%/Yr. compounded Complexity growth rate 21%/Yr. compound Productivity growth rate 100,000,000 10,000,000 1,000, ,000 10,000 1, Complexity Logic Transistor per Chip (M) Productivity (K) Trans./Staff - Mo Source: Sematech A growing gap between design complexity and design productivity f C ( d ) C

54 6

55 ,

56 trans/month each designers Months until completion

57 6 Transistors per team per month Team Months until completion Individual Number of designers [Adapted from Embedded Systems Design: A Unified Hardware/Software Introduction. Copyright 2000 Vahid & Givargis]

58 SOC SOPC EDA SOC 4. SOPC 5. IC 6. 7.

59 7 EDA

60 2X growth in 1.96 year 7% growth per year 2X growth in 10 in year 4X growth every 3 year

61 A4 2 4

I 元器件上市公司经济状况分析及年度展望

I 元器件上市公司经济状况分析及年度展望 2002 1 2002 5 WWW.CEI.GOV.CN 2001-2005 2005 3000 2010 7500 : : : 21 1 FAX 010 68558370 2 FAX 010 68558370 I.. 2...2...3...7...8 2002...9 II..11...11...12...17...21...23 III.26...26...27...27...27 1 2001...3